JPS62181414A - チップ形フィルムコンデンサの製造方法 - Google Patents

Info

Publication number

JPS62181414A

JPS62181414A JP2291686A JP2291686A JPS62181414A JP S62181414 A JPS62181414 A JP S62181414A JP 2291686 A JP2291686 A JP 2291686A JP 2291686 A JP2291686 A JP 2291686A JP S62181414 A JPS62181414 A JP S62181414A

Authority

JP

Japan

Prior art keywords

lead

resin

leads

chip

face

Prior art date

1986-02-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

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• 239000003990 capacitor Substances 0.000 title claims description 58
• 238000004519 manufacturing process Methods 0.000 title claims description 32
• 229920005989 resin Polymers 0.000 claims description 31
• 239000011347 resin Substances 0.000 claims description 31
• 239000011888 foil Substances 0.000 claims description 16
• 238000000034 method Methods 0.000 claims description 15
• 238000005452 bending Methods 0.000 claims description 10
• 238000000576 coating method Methods 0.000 claims description 10
• 239000011248 coating agent Substances 0.000 claims description 9
• 239000000853 adhesive Substances 0.000 claims description 7
• 230000001070 adhesive effect Effects 0.000 claims description 7
• 238000005498 polishing Methods 0.000 claims description 7
• 229910052782 aluminium Inorganic materials 0.000 claims description 6
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
• 229910052751 metal Inorganic materials 0.000 claims description 6
• 239000002184 metal Substances 0.000 claims description 6
• 238000004804 winding Methods 0.000 claims description 6
• 239000010408 film Substances 0.000 description 41
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 41
• 238000005470 impregnation Methods 0.000 description 6
• 238000004806 packaging method and process Methods 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000004593 Epoxy Substances 0.000 description 2
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• 238000005520 cutting process Methods 0.000 description 2
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• 229910000679 solder Inorganic materials 0.000 description 2
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
• 240000002129 Malva sylvestris Species 0.000 description 1
• 235000006770 Malva sylvestris Nutrition 0.000 description 1
• 229910000831 Steel Inorganic materials 0.000 description 1
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
• 244000111306 Torreya nucifera Species 0.000 description 1
• 235000006732 Torreya nucifera Nutrition 0.000 description 1
• 235000013351 cheese Nutrition 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
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• 229920000647 polyepoxide Polymers 0.000 description 1
• 239000010959 steel Substances 0.000 description 1
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• 239000002023 wood Substances 0.000 description 1