JPS6217872B2 - - Google Patents
Info
- Publication number
- JPS6217872B2 JPS6217872B2 JP56038460A JP3846081A JPS6217872B2 JP S6217872 B2 JPS6217872 B2 JP S6217872B2 JP 56038460 A JP56038460 A JP 56038460A JP 3846081 A JP3846081 A JP 3846081A JP S6217872 B2 JPS6217872 B2 JP S6217872B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- attached
- heat sink
- semiconductor chip
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3846081A JPS57153457A (en) | 1981-03-17 | 1981-03-17 | Semiconductor mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3846081A JPS57153457A (en) | 1981-03-17 | 1981-03-17 | Semiconductor mounting apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57153457A JPS57153457A (en) | 1982-09-22 |
JPS6217872B2 true JPS6217872B2 (enrdf_load_stackoverflow) | 1987-04-20 |
Family
ID=12525861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3846081A Granted JPS57153457A (en) | 1981-03-17 | 1981-03-17 | Semiconductor mounting apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57153457A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4748538A (en) * | 1985-07-08 | 1988-05-31 | Nec Corporation | Semiconductor module |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS482463U (enrdf_load_stackoverflow) * | 1971-05-21 | 1973-01-12 | ||
JPS55113351A (en) * | 1979-02-23 | 1980-09-01 | Hitachi Ltd | Integrated circuit module |
-
1981
- 1981-03-17 JP JP3846081A patent/JPS57153457A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57153457A (en) | 1982-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6559525B2 (en) | Semiconductor package having heat sink at the outer surface | |
JPH06350015A (ja) | 半導体装置 | |
US6703691B2 (en) | Quad flat non-leaded semiconductor package and method of fabricating the same | |
JP2001156251A (ja) | 半導体装置 | |
US5719748A (en) | Semiconductor package with a bridge for chip area connection | |
JPS6217872B2 (enrdf_load_stackoverflow) | ||
JPH0582582A (ja) | 半導体装置 | |
JPH0461152A (ja) | 半導体装置 | |
JPS58218130A (ja) | 混成集積回路 | |
JPH04219966A (ja) | 半導体素子 | |
JPS5972755A (ja) | 半導体装置 | |
JPH01282846A (ja) | 混成集積回路 | |
JPH0697666A (ja) | 電子装置 | |
JP3036976B2 (ja) | マルチチップモジュール | |
JPH05211247A (ja) | 半導体装置 | |
JPH07221211A (ja) | 半導体装置 | |
JPS63187330U (enrdf_load_stackoverflow) | ||
JPS58195445U (ja) | 半導体集積回路パツケ−ジ | |
JPH0555452A (ja) | 半導体集積回路装置 | |
JPS6116553A (ja) | プラグインパツケ−ジ | |
JPS61288454A (ja) | マルチチツプ搭載半導体デバイスのリ−ドフレ−ム | |
JPS5965553U (ja) | 集積回路装置 | |
JPH04321266A (ja) | 半導体集積回路装置 | |
JPS59180427U (ja) | ハイブリツド集積回路装置 | |
JPS6033457U (ja) | 半導体装置 |