JPS62177996A - Double-layer printed circuit board - Google Patents
Double-layer printed circuit boardInfo
- Publication number
- JPS62177996A JPS62177996A JP1819786A JP1819786A JPS62177996A JP S62177996 A JPS62177996 A JP S62177996A JP 1819786 A JP1819786 A JP 1819786A JP 1819786 A JP1819786 A JP 1819786A JP S62177996 A JPS62177996 A JP S62177996A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- layer printed
- layer
- adhesive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 25
- 239000004840 adhesive resin Substances 0.000 claims description 14
- 229920006223 adhesive resin Polymers 0.000 claims description 14
- 238000000034 method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、回路導体が二層構造となっている二層プリン
ト回路基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a two-layer printed circuit board in which circuit conductors have a two-layer structure.
従来の二層プリント回路基板は、ベースフィルムまたは
ガラスエポキシ基板などの絶縁シートの両面に所定パタ
ーンの回路導体を形成し、両面の回路導体を接続すべき
箇所にはスルーホールを形成して導体の接続を行ってい
る。A conventional two-layer printed circuit board has a predetermined pattern of circuit conductors formed on both sides of an insulating sheet such as a base film or a glass epoxy board, and through holes are formed at the locations where the circuit conductors on both sides are to be connected. Making a connection.
しかしスルーホールを形成するには、プリント回路基板
に穴をあけ、その穴の内面にメッキを施す必要がある。However, forming a through hole requires drilling a hole in the printed circuit board and plating the inside surface of the hole.
従来の二層プリント回路基板は、このスルーホール加工
、特に穴の内面メッキに多くの工程を要することから、
コスト高になる欠点がある。またベースフィルムの厚さ
方向の線膨張率がメッキ金属のそれに比べてはるかに大
きいためスルーホール内にクラックが生じるおそれがあ
り、信転性の点で問題があった。Conventional two-layer printed circuit boards require many steps to process through-holes, especially plating the inner surface of the holes.
It has the disadvantage of high cost. Furthermore, since the coefficient of linear expansion in the thickness direction of the base film is much larger than that of the plated metal, there is a risk of cracks occurring in the through holes, which poses a problem in terms of reliability.
本発明は、上記のような従来技術の問題点に鑑み、スル
ーホール加工を必要としない二層プリント回路基板を提
供するもので、その構成は、絶縁シート上に所定パター
ンの回路導体を形成してなる第一と第二のプリント回路
基板を上記回路導体側を内側にして対向させ、その間に
、」二記第−と第二のプリント回路基板の回路導体を接
続すべき箇所が導電化された接着性樹脂シートを介在さ
せ、その接着性樹脂シートにより上記第一と第二のブリ
ント回路基板を接着したことを特徴とするものである。In view of the problems of the prior art as described above, the present invention provides a two-layer printed circuit board that does not require through-hole processing.The present invention consists of forming a predetermined pattern of circuit conductors on an insulating sheet. The first and second printed circuit boards, which are made of The first and second printed circuit boards are bonded together by interposing an adhesive resin sheet.
上記構成によると、二層の回路導体が、それらを接続す
べき箇所では接着性樹脂シー１−の導電化された部分に
よって電気的に接続され、またそれらを絶縁すべき箇所
では接着性樹脂シートの絶縁性によって絶縁されること
になる。このためスルーホール加工なしで、二層の回路
導体が所定箇所で接続されたプリント回路基板を構成で
きる。According to the above configuration, the two layers of circuit conductors are electrically connected by the electrically conductive portion of the adhesive resin sheet 1- at the locations where they should be connected, and the adhesive resin sheet at the locations where they are to be insulated. It is insulated by the insulation properties of Therefore, a printed circuit board in which two layers of circuit conductors are connected at predetermined locations can be constructed without through-hole processing.
第１図は本発明の一実施例に係る二層プリント回路基板
を示す。図において、１１は第一のプリント回路基板で
、プラスチックフィルムのような可撓性のある絶縁シー
ト１２の片面に所定パターンの回路導体１３を形成した
ものである。また１４は第二のプリント回路基板で、同
じく絶縁シート１５の片面に回路導体１Ｇを形成したも
のである。これらのプリント回路基板１１．１４は回路
導体１３．１６を内側にして対向させである。１７．１
８は回路導体１３．１６以外の所に表面のレベルをそろ
えるために積層された絶縁レジストである。FIG. 1 shows a two-layer printed circuit board according to one embodiment of the invention. In the figure, 11 is a first printed circuit board, which has a predetermined pattern of circuit conductors 13 formed on one side of a flexible insulating sheet 12 such as a plastic film. Reference numeral 14 designates a second printed circuit board, which also has a circuit conductor 1G formed on one side of an insulating sheet 15. These printed circuit boards 11.14 are placed opposite each other with the circuit conductors 13.16 on the inside. 17.1
Reference numeral 8 denotes an insulating resist layered to align the surface level at locations other than the circuit conductors 13 and 16.
Ｉ９は第一と第二のプリント回路基板１１、Ｉ４０間に
介在させた接着性樹脂シートである。この接着性樹脂シ
ート】９には、二層の回路導体１３と１６を接続すべき
箇所に、導電化領域２０が設けられている。I9 is an adhesive resin sheet interposed between the first and second printed circuit boards 11 and I40. This adhesive resin sheet 9 is provided with conductive regions 20 at locations where the two-layer circuit conductors 13 and 16 are to be connected.
この導電化領域２０は例えば接着性樹脂シートを陽極に
張りつけ、ビロールを含む電解液中で電解を行い、接着
性樹脂シートの特定領域内に電解重合により導電性のポ
リピロールを生成させることにより形成できる（高分子
学会８５年第１同高分子可能性講座講演要旨集５２〜５
７頁）。もちろんこれ以外の方法、たとえば特定領域に
金属粉（銀粉、銅粉）を混入させることによっても導電
化領域を形成できる。第一と第二のプリント回路基板１
１、】４は上記のような接着性樹脂シート１９により接
着されている。This conductive region 20 can be formed, for example, by pasting an adhesive resin sheet on an anode, performing electrolysis in an electrolytic solution containing pyrrole, and producing conductive polypyrrole in a specific region of the adhesive resin sheet by electrolytic polymerization. (Collection of abstracts of the 1st Polymer Possibility Lecture of the Society of Polymer Science, 1985, 52-5
page 7). Of course, the conductive region can also be formed by other methods such as mixing metal powder (silver powder, copper powder) into a specific region. First and second printed circuit board 1
1 and ]4 are adhered by the adhesive resin sheet 19 as described above.
このような二層プリント回路基板は例えば第２図のよう
にして製造される。まず一枚の絶縁シート１２上に第一
のプリント回路基板１１用の回路導体１３と、第二のプ
リント回路基板１４用の回路導体１６を形成する。これ
は銅張り積層板のエツチングあるいは絶縁シート上への
スパッタリング等により行う。次に回路導体１３．１６
以外の所に表面のレベルを回路導体１３．１６に合わせ
るため、絶縁レジスト１７．１８を印刷する（これば回
路導体の厚さが薄い場合には省略することもできる）。Such a two-layer printed circuit board is manufactured, for example, as shown in FIG. First, the circuit conductor 13 for the first printed circuit board 11 and the circuit conductor 16 for the second printed circuit board 14 are formed on one insulating sheet 12. This is done by etching the copper-clad laminate or sputtering onto the insulating sheet. Then the circuit conductor 13.16
Elsewhere, an insulating resist 17.18 is printed in order to level the surface with the circuit conductor 13.16 (this can be omitted if the circuit conductor is thin).
次に第一のプリント回路基板１１上に、回路導体を接続
すべき箇所に導電化領域２０を形成した接着性樹脂シー
ト１９を載置する。次に絶縁シート１２を一点鎖線のよ
うに折り曲げ、第二のプリント回路基板１４を第一のプ
リント回路基板１１上に重ねる。この状態で加熱加圧し
て第一と第二のプリント回路基板１１．１４を接着する
。以上で二層プリント回路基板が出来あがる。Next, an adhesive resin sheet 19 is placed on the first printed circuit board 11, on which conductive regions 20 are formed at locations where circuit conductors are to be connected. Next, the insulating sheet 12 is folded along the dashed line, and the second printed circuit board 14 is placed on top of the first printed circuit board 11. In this state, heat and pressure are applied to bond the first and second printed circuit boards 11 and 14 together. With the above steps, a two-layer printed circuit board is completed.
なお接着性樹脂シートとしては、ホットメルト樹脂シー
トなどが使用可能である。Note that a hot melt resin sheet or the like can be used as the adhesive resin sheet.
なお第２図の例では、第一と第二のプリント回路基板の
絶縁シートを共通にし、これを折り曲げて、二つのプリ
ント回路基板を重ねるようにしたが、二つのプリント回
路基板を別々に製造して重ねるようにしてもよい。また
絶縁シートにはガラスエポキシ基板のような可撓性のな
いものを使用することも可能である。また本発明の二層
プリント回路基板を積層すれば、四層、六層 −のプリ
ント回路基板を構成することも可能である。In the example shown in Figure 2, the first and second printed circuit boards use a common insulating sheet, which is folded to overlap the two printed circuit boards, but it is not possible to manufacture the two printed circuit boards separately. You may also overlap them. Furthermore, it is also possible to use a non-flexible material such as a glass epoxy substrate as the insulating sheet. Further, by laminating the two-layer printed circuit boards of the present invention, it is also possible to construct a four-layer or six-layer printed circuit board.
第３図は本発明の二層プリント回路基板に電子部品を実
装した状態を示す。本発明の二層プリント回路基板は、
両面が絶縁シートになっており、回路導体が内部に存在
するため、電子部品の実装をいかにするかが問題である
が、これは次のように解決できる。FIG. 3 shows a state in which electronic components are mounted on the two-layer printed circuit board of the present invention. The two-layer printed circuit board of the present invention comprises:
Since both sides are insulating sheets and there are circuit conductors inside, the problem is how to mount electronic components, but this can be solved as follows.
例えば、第一のプリント回路基板１１に電子部品２１を
実装する場合には、そのプリント回路基板１１に電子部
品を接続する箇所の接着性樹脂シート１９に予め導電化
領域２０を形成しておき、かつ第二のプリント回路基板
１４のそれに対応する箇所には予め貫通穴を形成してお
いて、その貫通穴に導電ペースト２２を埋め、そこに電
子部品２１の端子を接続すればよい、この場合、電子部
品接続箇所は第二のプリント回路基板１４の回路導体１
６を避けた所を選定すべきことは当然である。また接着
性樹脂シートに導電化領域を形成する代わりに、その位
置に貫通穴を形成しておいてもよい。For example, when mounting the electronic component 21 on the first printed circuit board 11, a conductive region 20 is formed in advance on the adhesive resin sheet 19 at a location where the electronic component is connected to the printed circuit board 11. In this case, a through hole may be formed in advance at a corresponding location on the second printed circuit board 14, the conductive paste 22 may be filled in the through hole, and the terminal of the electronic component 21 may be connected thereto. , the electronic component connection point is the circuit conductor 1 of the second printed circuit board 14.
It goes without saying that you should choose a location that avoids 6. Furthermore, instead of forming the electrically conductive region in the adhesive resin sheet, a through hole may be formed at that position.
また第二のプリント回路基板１４に電子部品２３を接続
する場合には、そのプリント回路基板１４の電子部品接
続箇所に予め貫通穴を形成しておき、その貫通穴に導電
ペースト２４を埋めて、そこに電子部品２３の端子を接
続すればよい。Further, when connecting the electronic component 23 to the second printed circuit board 14, a through hole is formed in advance at the electronic component connection location of the printed circuit board 14, and the through hole is filled with conductive paste 24. The terminal of the electronic component 23 may be connected there.
なお電子部品を実装する場合、二層プリント回路基板の
強度が十分でないときは、実装面と反対側に補強基板２
５を張りつけるとよい。When mounting electronic components, if the two-layer printed circuit board is not strong enough, install a reinforcing board 2 on the side opposite to the mounting surface.
It is best to paste 5.
以上説明したように本発明によれば、スルーホールを形
成することなく、二層の回路導体が所要箇所で接続され
た二層プリント回路基板を得ることができ、二層プリン
ト回路基板のコスト低減と信幀性向上にきわめて有効で
ある。As explained above, according to the present invention, it is possible to obtain a two-layer printed circuit board in which two-layer circuit conductors are connected at required locations without forming through holes, thereby reducing the cost of the two-layer printed circuit board. It is extremely effective in improving credibility.
第１図は本発明の一実施例に係る二層プリント回路基板
を示す断面図、第２図は本発明の二層プリン１−回路基
板を製造する方法の一例を示す断面図、第３図は本発明
の二層プリント回路基板に電子部品を実装した状態を示
す断面図である。
１１〜第一のプリン１へ回路基板、１２〜絶縁シート、
１３〜Ｆ［導体、１４〜第二のプリント回路基板、１５
〜絶縁シート、１６〜回路導体、１９〜接着性樹脂シー
ト、２０〜導電化領域。FIG. 1 is a cross-sectional view showing a two-layer printed circuit board according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing an example of a method for manufacturing the two-layer printed circuit board of the present invention, and FIG. 1 is a sectional view showing a state in which electronic components are mounted on a two-layer printed circuit board of the present invention. 11~Circuit board to first pudding 1, 12~Insulating sheet,
13~F [conductor, 14~second printed circuit board, 15
- insulation sheet, 16 - circuit conductor, 19 - adhesive resin sheet, 20 - conductive region.
Claims (1)
る第一と第二のプリント回路基板を上記回路導体側を内
側にして対向させ、その間に、上記第一と第二のプリン
ト回路基板の回路導体を接続すべき箇所が導電化された
接着性樹脂シートを介在させ、その接着性樹脂シートに
より上記第一と第二のプリント回路基板を接着したこと
を特徴とする二層プリント回路基板。First and second printed circuit boards each having a predetermined pattern of circuit conductors formed on an insulating sheet are placed facing each other with the circuit conductor side facing inside, and the circuits of the first and second printed circuit boards are placed between them. 1. A two-layer printed circuit board, characterized in that the first and second printed circuit boards are bonded to each other by interposing an adhesive resin sheet in which the portions to which conductors are to be connected are made electrically conductive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1819786A JPS62177996A (en) | 1986-01-31 | 1986-01-31 | Double-layer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1819786A JPS62177996A (en) | 1986-01-31 | 1986-01-31 | Double-layer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62177996A true JPS62177996A (en) | 1987-08-04 |
Family
ID=11964904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1819786A Pending JPS62177996A (en) | 1986-01-31 | 1986-01-31 | Double-layer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62177996A (en) |
-
1986
- 1986-01-31 JP JP1819786A patent/JPS62177996A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4496793A (en) | Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion | |
| JP3059568B2 (en) | Method of manufacturing multilayer printed circuit board | |
| US4522667A (en) | Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion | |
| US8178191B2 (en) | Multilayer wiring board and method of making the same | |
| KR940009175B1 (en) | Multi-printed wiring board | |
| CN109429441A (en) | Rigid Flex and preparation method thereof | |
| WO2004017689A1 (en) | Multilayer printed wiring board and production method therefor | |
| JP2006344887A (en) | Printed-wiring board and manufacturing method therefor | |
| JPH0412702Y2 (en) | ||
| JPS62177996A (en) | Double-layer printed circuit board | |
| US5763060A (en) | Printed wiring board | |
| JP3329756B2 (en) | Multilayer wiring board and method of manufacturing the same | |
| CN112839451A (en) | Manufacturing method of rigid-flex board and rigid-flex board | |
| JPS63137498A (en) | Manufacture of through-hole printed board | |
| JPS62190796A (en) | Double-layer printed circuit board | |
| JPH01151293A (en) | Method for conducting inner layer of multilayer printed wiring board | |
| JP2000133943A (en) | Manufacture of multilayered board | |
| CN116634697A (en) | Flexible circuit board with embedded capacitor and manufacturing method thereof | |
| JPS60236278A (en) | Plate for circuit | |
| JPH04131964U (en) | composite circuit board | |
| JP2514384Y2 (en) | Metal base wiring board | |
| JPS6317589A (en) | Double-layer printed circuit board | |
| JPH02122588A (en) | Metal-cored printed wiring board | |
| JPH09283931A (en) | Multilayer wiring board | |
| JPS59168696A (en) | Method of producing metal base printed circuit board |