JPS62174367U - - Google Patents
Info
- Publication number
- JPS62174367U JPS62174367U JP6347586U JP6347586U JPS62174367U JP S62174367 U JPS62174367 U JP S62174367U JP 6347586 U JP6347586 U JP 6347586U JP 6347586 U JP6347586 U JP 6347586U JP S62174367 U JPS62174367 U JP S62174367U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- mounting board
- electrodes
- longitudinal direction
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案の部品実装基板の一実施例を示
す横断面図、第2図はその平面図、第3図は従来
の部品実装基板の一例を示す横断面図、第4図は
その平面図、第5図従来の部品実装基板の他の例
を示す横断面図、第6図はその平面図である。
1,7,12……基板母材、2,13……透孔
、3,6,14a,14b……ランド、4,9,
15……チツプ部品、5……リード、6,11,
17a,17b……半田、10,16a,16b
……電極。
FIG. 1 is a cross-sectional view showing an embodiment of a component mounting board of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a cross-sectional view showing an example of a conventional component mounting board, and FIG. 4 is a cross-sectional view thereof. A plan view, FIG. 5 is a cross-sectional view showing another example of a conventional component mounting board, and FIG. 6 is a plan view thereof. 1, 7, 12... Substrate base material, 2, 13... Through hole, 3, 6, 14a, 14b... Land, 4, 9,
15... Chip parts, 5... Leads, 6, 11,
17a, 17b...Solder, 10, 16a, 16b
……electrode.
Claims (1)
の透孔内に長手方向の両端に電極を有するチツプ
部品が長手方向から挿入され、前記基板母材の両
面側から前記チツプ部品の電極と前記透孔周辺の
導体部とに跨がつて導電材料が被着されているこ
とを特徴とする部品実装基板。 (2) 透孔周辺の導体部が、透孔の開口部に設け
られた非スルーホールランドである実用新案登録
請求の範囲第1項記載の部品実装基板。[Claims for Utility Model Registration] (1) A through hole is drilled at a predetermined position in the base material of the substrate, and a chip component having electrodes at both ends in the longitudinal direction is inserted into the through hole from the longitudinal direction. 1. A component mounting board, characterized in that a conductive material is applied from both sides of the material, spanning the electrodes of the chip component and the conductor portion around the through hole. (2) The component mounting board according to claim 1, wherein the conductor portion around the through hole is a non-through hole land provided at the opening of the through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6347586U JPS62174367U (en) | 1986-04-26 | 1986-04-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6347586U JPS62174367U (en) | 1986-04-26 | 1986-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62174367U true JPS62174367U (en) | 1987-11-05 |
Family
ID=30898736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6347586U Pending JPS62174367U (en) | 1986-04-26 | 1986-04-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62174367U (en) |
-
1986
- 1986-04-26 JP JP6347586U patent/JPS62174367U/ja active Pending