JPS62171967A - パワーモジュール基盤の製造方法 - Google Patents
パワーモジュール基盤の製造方法Info
- Publication number
- JPS62171967A JPS62171967A JP1173786A JP1173786A JPS62171967A JP S62171967 A JPS62171967 A JP S62171967A JP 1173786 A JP1173786 A JP 1173786A JP 1173786 A JP1173786 A JP 1173786A JP S62171967 A JPS62171967 A JP S62171967A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- steel plate
- furnace
- ppm
- power module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 26
- 239000010959 steel Substances 0.000 claims description 26
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 25
- 239000001301 oxygen Substances 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 17
- 239000012298 atmosphere Substances 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000005304 joining Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 8
- 239000005751 Copper oxide Substances 0.000 description 8
- 229910000431 copper oxide Inorganic materials 0.000 description 8
- 239000007791 liquid phase Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1173786A JPS62171967A (ja) | 1986-01-22 | 1986-01-22 | パワーモジュール基盤の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1173786A JPS62171967A (ja) | 1986-01-22 | 1986-01-22 | パワーモジュール基盤の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62171967A true JPS62171967A (ja) | 1987-07-28 |
| JPH0455148B2 JPH0455148B2 (enrdf_load_stackoverflow) | 1992-09-02 |
Family
ID=11786341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1173786A Granted JPS62171967A (ja) | 1986-01-22 | 1986-01-22 | パワーモジュール基盤の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62171967A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58217475A (ja) * | 1982-02-06 | 1983-12-17 | ブラウン・ボバリ・ウント・シ−・アクチエンゲゼルシヤフト | 金属片と酸化物セラミツク基板を直接結合する方法 |
| JPS61270269A (ja) * | 1985-05-27 | 1986-11-29 | 松下電工株式会社 | セラミツク基板と金属片との接合方法 |
-
1986
- 1986-01-22 JP JP1173786A patent/JPS62171967A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58217475A (ja) * | 1982-02-06 | 1983-12-17 | ブラウン・ボバリ・ウント・シ−・アクチエンゲゼルシヤフト | 金属片と酸化物セラミツク基板を直接結合する方法 |
| JPS61270269A (ja) * | 1985-05-27 | 1986-11-29 | 松下電工株式会社 | セラミツク基板と金属片との接合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455148B2 (enrdf_load_stackoverflow) | 1992-09-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |