JPS62163386A - レ−ザ−ダイオ−ド用ポイントスクライブ装置 - Google Patents

レ−ザ−ダイオ−ド用ポイントスクライブ装置

Info

Publication number
JPS62163386A
JPS62163386A JP61006020A JP602086A JPS62163386A JP S62163386 A JPS62163386 A JP S62163386A JP 61006020 A JP61006020 A JP 61006020A JP 602086 A JP602086 A JP 602086A JP S62163386 A JPS62163386 A JP S62163386A
Authority
JP
Japan
Prior art keywords
cutter
compound semiconductor
predetermined
prescribed
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61006020A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523514B2 (enrdf_load_stackoverflow
Inventor
Masanobu Yae
正信 八江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAITO SEIKI KOGYO KK
Original Assignee
DAITO SEIKI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAITO SEIKI KOGYO KK filed Critical DAITO SEIKI KOGYO KK
Priority to JP61006020A priority Critical patent/JPS62163386A/ja
Publication of JPS62163386A publication Critical patent/JPS62163386A/ja
Publication of JPH0523514B2 publication Critical patent/JPH0523514B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Semiconductor Lasers (AREA)
  • Dicing (AREA)
JP61006020A 1986-01-13 1986-01-13 レ−ザ−ダイオ−ド用ポイントスクライブ装置 Granted JPS62163386A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61006020A JPS62163386A (ja) 1986-01-13 1986-01-13 レ−ザ−ダイオ−ド用ポイントスクライブ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61006020A JPS62163386A (ja) 1986-01-13 1986-01-13 レ−ザ−ダイオ−ド用ポイントスクライブ装置

Publications (2)

Publication Number Publication Date
JPS62163386A true JPS62163386A (ja) 1987-07-20
JPH0523514B2 JPH0523514B2 (enrdf_load_stackoverflow) 1993-04-02

Family

ID=11627005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61006020A Granted JPS62163386A (ja) 1986-01-13 1986-01-13 レ−ザ−ダイオ−ド用ポイントスクライブ装置

Country Status (1)

Country Link
JP (1) JPS62163386A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045823A (ja) * 2001-07-27 2003-02-14 Disco Abrasive Syst Ltd スクライビング装置
US6916726B2 (en) 2002-07-22 2005-07-12 Sumitomo Electric Industries, Ltd. Method for forming scribed groove and scribing apparatus
CN102107241A (zh) * 2009-12-28 2011-06-29 赛科隆股份有限公司 用于从封装带分离半导体封装的装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5090940A (enrdf_load_stackoverflow) * 1973-12-14 1975-07-21
JPS5919352A (ja) * 1982-07-23 1984-01-31 Hitachi Ltd 半導体レ−ザヘキ開装置
JPS6265209U (enrdf_load_stackoverflow) * 1985-10-16 1987-04-23

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5090940A (enrdf_load_stackoverflow) * 1973-12-14 1975-07-21
JPS5919352A (ja) * 1982-07-23 1984-01-31 Hitachi Ltd 半導体レ−ザヘキ開装置
JPS6265209U (enrdf_load_stackoverflow) * 1985-10-16 1987-04-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045823A (ja) * 2001-07-27 2003-02-14 Disco Abrasive Syst Ltd スクライビング装置
US6916726B2 (en) 2002-07-22 2005-07-12 Sumitomo Electric Industries, Ltd. Method for forming scribed groove and scribing apparatus
CN102107241A (zh) * 2009-12-28 2011-06-29 赛科隆股份有限公司 用于从封装带分离半导体封装的装置

Also Published As

Publication number Publication date
JPH0523514B2 (enrdf_load_stackoverflow) 1993-04-02

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