JPS62163386A - Point-scribing device for laser diode - Google Patents

Abstract

PURPOSE:To enable the accurate making of a boat-shaped, point-like cut which is short and enables the accurate setting of the direction of split, by providing a table supporting a flat-plate-shaped compound semiconductor for a laser diode and sliding horizontally and a cutter head having a cutter in the force end and moving vertically, and by other means. CONSTITUTION:A table 19 supporting a flat-plate-shaped compound semiconductor for a laser diode and sliding horizontally and a cutter head 20 having a cutter 21 in the fore end and moving vertically are provided. Moreover, the device is designed to have a function to lower the cutter 21 to a prescribed height above the compound semiconductor, a function to make the table 19 slide relatively to the cutter 21 by a prescribed distance at a prescribed scribing speed after the cutter 21 lowers to the prescribed height, and a function to lower the cutter 21 at a prescribed speed with the sliding of the table 19, to hold the cutter 21 at a prescribed depth in the compound semiconductor after the cutter 21 is lowered at the prescribed speed, and to make the cutter 21 rise at a prescribed speed after it is held at the prescribed depth in the compound semiconductor.

Description

[Detailed Description of the Invention] 3. Description of the Invention (Field of Industrial Application) The present invention relates to a point scribing device for making scratches on a flat compound semiconductor for laser diodes in order to carry out manual labor. .

(Prior Art) Conventionally, an apparatus for cutting a silicon wafer into chips of a predetermined size is known. This device performs a so-called full scribing operation, in which the surface of a silicon wafer is scratched in the form of marks, and the chips are divided into 11 squares according to intuition.

On the other hand, the rake diode is approximately 250 μ square in size, and it is necessary to cut a plate-shaped compound semiconductor of approximately 1 cm square and 100 μ in thickness for interfold work. The shape of the fold surface is important for Fj because the laser diode transmits the laser from the broken penis surface.

(Problems to be Solved by the Invention) - The conventional apparatus is configured to scratch the surface of the workpiece in a line-like manner. Therefore, we divided the configuration into a predetermined size while exposing the male side and made the ray guide A-code 1! If you use it for inspection work, you will end up leaving fn points on the scratches you make unless the inspection surface is clean.

Further, although the above device -C- is suitable for cutting relatively long linear scratches, it is not possible to precisely cut short scratches by precisely determining the direction of cracking. Therefore, even if this configuration is adopted for separate work, the problem remains that a predetermined viewing surface cannot be accurately obtained, and the yield of products is extremely low.

The present invention is intended to solve the above problems.

(Means for solving the problem) A table on which a flat compound semiconductor for a laser diode is placed and slid into water 5: A cutter head having a cutter at the tip and moving to the top 4. A function to lower the cutter to a predetermined height above the compound semiconductor; a function to slide the cutter relative to the cutter by a predetermined distance at a predetermined scribing speed after the cutter has descended to the predetermined height; Along with the slide, the cutter is lowered at a predetermined scribing speed, and after the cutter is lowered at a predetermined scribing speed, the cutter is held at a predetermined depth within the compound semiconductor, and the cutter is maintained at a predetermined depth within the compound semiconductor! This is a point scribing device for a laser diode, which is characterized by a function of moving the cutter at a predetermined scribing speed after scouring.

(Function) First, a flat compound semiconductor for a laser diode is placed on a table. Next, after lowering the cutter attached to the cutter head to a predetermined height above the compound semiconductor, the table is slid relative to the cutter by a predetermined distance at a predetermined scribing speed.As the table slides, the cutter is The cutter is lowered at a predetermined scribing speed, the cutter is held at a predetermined depth within the compound semiconductor, and then the cutter is raised at a predetermined scribe speed.

As a result, a ship-shaped flaw suitable for linearly dividing the compound semiconductor to obtain a predetermined three-way cut surface is formed on the compound semiconductor.

(Example) The second example shows the appearance of the point scribing device according to Komei.
In the figure, a control box 12 is provided at the bottom of a set of pedestals 11 to control the CI'' U and a seven-point driver. A keyboard box 14, a stick controller box 15, and a monitor 16 for manually inputting numerical values to control the book (413) and for controlling the main body 13 of the apparatus are placed.

As shown in FIG.
T-taple 17 is fixed to J3, support table 17
A microscope 18 through which the worker looks is supported on a desk so that it can be moved upwards, backwards and forwards, and left and right. As a microscope 18 [5
11ri1e5~'IOOfn's binocular zoom entity!
A microscope is used. 5 degrees on the front upper surface of the main body 13 (
The table 19 is placed at J3, and the table is 1°C.
A microscope m18 is placed above. A base portion of a cutter head 20 is supported at the rear of the device main body 13,
A cutter 21, which has been cut by 4J at the tip of the cutter head 20, is placed above the table 19.

As shown in FIG. 1, which is a schematic diagram of the internal structure of the device main body 13, the daple 19 placed on the base 25 is guided by the table guide 26 in the X-axis direction (arrow X direction).
It has an X-axis table 27 that moves to
7 is driven and controlled by a pulse motor 28 for X411. A daple guide 29 is placed on the X-axis table 27, and a Y-axis daple 30 that is guided by the table guide 29 and moves in the Y-axis direction (direction of arrow Y) is aligned with the Y-axis daple guide 29. The table 30 is driven and controlled by a Y-axis pulse motor 31. A θ7'-pull 32 is placed on the Y-axis daple 30, and the θ daple 32 is controlled to rotate around the vertical axis (Z-axis) in the θ direction by a θ direction pulse (not shown). J: The sea urchin is turning. Further, the upper end surface of the 0 table 32 is formed horizontally. Although not shown, a large number of small holes are formed on the curved end surface of the θ table 32.
A vacuum chamber is connected to the small hole through the inside of the zero double 32. That is, the upper end surface of the θ table 32 has the ability to perform vacuum suction 6.

On the other hand, the cutter head 20 extends in the radial direction of the θ table 32, and the cutter 21 fixed to the cutter head 20 is arranged above the θ table 32. The base of the cutter head 20 is fixed to an intermediate portion of a support @35 extending parallel to the X direction in a radially protruding posture. Both ends of the support shaft 35 are rotatably supported on the upper portions of a pair of supporters 36 whose lower ends are fixed to the base 25. A portion of the support lll1l135 that protrudes from one supporter 36 in the X direction has a Z
The upper side surface of the axis arm 37 is connected, and when the Z axis arm 37 moves in the Y direction, the support shaft 35
is designed to rotate. The lower end of the Z-axis arm 37 is screwed onto a ball screw 3B extending in the Y direction.
The 7-axis arm 374J is rotated by the rotation of the ball screw 38.
Slide in the Y direction J: It is turned. The drive shaft of the 17-axis pulse generator 39 is connected to one end of the ball screw 333, a3, so that the rotation of the ball screw 38 is controlled 211. Note that this link mechanism allows the Z-axis arm 37 to move in the Y direction! l1
IJ amount and cutter 2 attached to cutter head 20
The seven directions of movement of the tip of the tip 1 correspond to each other in a 1:1 ratio.

As shown in FIG. 4, the cutter head 20 is mainly formed of a cutter head body 40 and an arm 41 that protrudes forward from the cutter head body 40 and covers it. The base of the arm 41 is supported by the cutter head body 40 so as to be rotatable around an axis in the X direction within the cutter head body 40, and is always elastically biased downward by a spring (not shown). The biasing force of the spring against the arm 41 can be changed and adjusted by manually rotating the spring adjustment knob 42.In the scribing work of compound semiconductors, the cutter 2
The biasing force of the spring is set so that the front end of the spring has a force of about 5 to 350, more preferably about 209. A cutter 21 is held at the distal end of the arm 41, which protrudes generally in the Y direction, and is directed generally downward. The cutter 21 has an angle adjustment knob 4 installed c) on the side of the tip of the arm 41.
By loosening 3, it becomes possible to rotate around the axis in the X direction, and the direction of the cutter 21 can be changed and adjusted by manually operating the cutter 21. In addition, the cutter 21 can be released from the hold by loosening a cutter removal knob 44 provided on the side of the tip end of the arm 41, thereby allowing the cutter 21 to be replaced.

As the cutter 21, for example, a three-point diamond cutter is used. The cutter 21 is a rod-like and generally cylindrical member, and the lower end thereof is sharpened in the shape of a 161-center circular hook. Furthermore, as shown in FIG. .

Next, I will explain the operation.

First, set up the necessary data to perform the scribing work. The moving speed (1), moving step width (2), and number of steps (
3), and the moving speed of the Y-axis table 30 (4).
Determine the movement step width (b) and the step number 85 [(6), and determine the movement quality of the Y-axis table 30 during scribing, that is, (
Determine the length of U (7) and the speed when scribing (8), and set the vertical speed of the cutter 21 (9) and the cutter 21.
Determine the distance of descent from a predetermined height, that is, the depth of 10 cm. These determined values are input using the keyboard box 14 in FIG.

After inputting the data, align the cross line drawn on the eyepiece of the microscope 18 (Fig. 2) with the (U insertion start position). Place the workpiece on the O table 32 shown in Fig. 1 and apply vacuum suction. 6.The workpiece has a pattern in advance to create a 250μ square laser diode, for example, and the overall size of the workpiece is, for example, 1cm square and 100μ thick.Swik controller The stick installed in the box 15 (Fig. 2) is operated repeatedly, and the workpiece is brought into the field of view of the microscope VL18 using the stick control.

Then, rotate the θ table 32 in the θ direction to align the side of the workpiece with
direction and Y direction.

Once the work piece I- has flowed, it is carried out in the same way as the method h described later (one insertion is required). Using the scratch as a guide, move the microscope 18 and turn the eyepiece of the microscope 18 to align (C) with the cross line in the Y direction, and (b), align one end of the scratch with the intersection of the cross lines.

For confirmation, move the X-axis table 27 once and adjust the width (
2) (move V1 again) (set once again (J Now. If the newly entered scratch is on the microscope 18 glue [1 line and one end of the scratch coincides with the intersection point, the microscope 18
This means that the cross line and the scratch starting position coincide.

Note that the work of aligning this cross line with the scratching start position must be performed every time the angle and quality of the cutter 21 is changed.

Next, a scribing operation is performed in a self+JJ manner based on the -F entry horn data. Its basic (11 positions are shown in Figure 6). According to Figure 6, W is the workpiece and S is the surface of the workpiece W (I). , The numbers in parentheses correspond to the ``-reporter ability data.''

For example, it is assumed that the wound is made starting from the scratch S at the left end. The length of the scratch S is determined by the data (7), specifically, by the movement interval of the Y-axis daple 30 by the YIIIll pulse 31. When the tb s of 1 tree is attached, move the workpiece W one step in the X direction based on data (2), then make a scratch S equal to the length of data (7).Move the workpiece W in the X direction. The moving speed is determined by data (1), specifically, the moving speed of the X-axis daple 27 by the X-axis pulse mode 928.

Once a predetermined number of scratches S are made in the X direction as many times as data (3), the next C3 is made at a predetermined interval in the Y direction based on data (5). The moving speed in the Y direction is based on data (4), specifically, the Y-axis output pulse motor 31
It is determined by the moving speed of the Y-axis table 30. Also here, a predetermined number of 18S is applied at predetermined intervals based on data (1), (2), (3), and (7). If this operation is repeated for the number of times based on data (6), scribing on one workpiece W is completed.

The old wound S is hung as shown in Figure 7. In FIG. 7, ■ is the origin position of the cutter 21.

First, the cutter 21 descends to the position (■). This vertical movement is performed by the rotation of the ball screw 38 by the Z-axis pulse 1-39. Next, the cutter 21
1 in the Y direction.

This movement is performed by moving the Y table 30 in the Y direction at the Y axis output pulse tanabata 31, and the movement speed C
Based on yo data (/I). Also, this moving place is
This corresponds to the offset fjt provided to ensure the field of view of the microscope 18. This A-fret 1~ is to prevent the seven fields of the microscope 18 from being blocked by the cutter 21, and from being unable to confirm the name of the work with the sword 1, 8, and 18.

The cutter 21 is moved further downward from the position (2). The moving speed at that time is based on data (9), and is much slower than the speed between ■ and 0. Upper end surface J of workpiece W: A certain height, for example, 150μ
When the cutter 21 comes to the position ■, which is the height of
According to the IT table 30, the workpiece W/fi starts moving in the Y direction at the speed of data (8). the result,
The cutter 21 moves relative to the workpiece W from the position ■ to the position ■. The movement speed based on data (8) at that time is much slower than data (4). The descending distance of the cutter 21 from ■ to ■ is the data (
10).

When the cutter 21 reaches the position t, 11, the cutter 2
1 is held at a constant depth, from then on (U is suspended from work W at a constant depth (IS).

After the cutter 21 reaches the position ■, the workpiece W is fed by the cutting edge based on the data (7), and when the cutter 21 relatively comes to the position ■, the next time the cutter 21 moves upward L; I can be yelled at. The movement speed at that time is day (
Based on 9). When the cutter 21 turns upward by a distance based on data (10) and comes to the lff1 position of ■, the movement of the workpiece W in the Y direction stops. After that, cutter 21 upper y? After this, the cutter 21 comes to the position (■). The workpiece W moves from the position (2) at a speed based on the data (4), and the cutter 21 relatively returns to the position (2).The cutter 21 further moves upward and returns to the origin (2).

That is, the cutter 21 returns to a position offset from the scratch S, and the field of view of the microscope 18 is secured.

The shape of the WS obtained as a result is a ship shape as shown in FIG. During the separation work, the workpiece W is broken in a straight line in the extending direction of the tip of the boat shape. The quality of scratch S is 30~
Approximately 250μ, width approximately 7-8μ, depth 14-16μ
Pi is 1 degree. The size of one laser diode after actual work is 250μ square, and the product is completed by wiring with a bonder and molding.

In the actual scribing work, scratches S are made vertically and horizontally on the workpiece W at the same time, so instead of 1.1, the following scratches are made. First, there is a line of lt;! only near one side of the workpiece W. Add "S to the above method". III'), data〈4), (b)
, (do not use (5). Next, based on +123, divide the workpiece W into 7 + 1 grids and 111 pieces to get a rigid surface. This surface will emit the laser. This surface After coating the protective film on each strip, make a scratch S to break the workpiece W into chips of 250 μ square. 1128 is suspended at the middle part of the strip-shaped workpiece W in the width direction.In other words, ca + is attached to the edge part of the strip-shaped workpiece W.
Since bs cannot be attached, bs will not have a negative effect on the laser emitting side. Also, in this case, the above data (4), (5), and (6) are not used. Make a scratch S in the J: row in the method.
The product is cut into chips, wired with a bonder, and molded.

(Another embodiment) (a) C instead of the microscope vL18 or together with the microscope 18
An OD camera is installed, and the workpiece W is positioned in rows 1-. through computer image recognition. You can also make it look like this.

In that case, a configuration may be adopted in which two cameras are used, one with low magnification and Ikegata with high magnification.

By using a low-magnification camera to perform overall positioning and a high-magnification camera to perform precise positioning, there is an advantage that work can be performed quickly and accurately.

(b) It is also possible to install an automatic loader so that the work W can be loaded and unloaded automatically.

(Effect of the invention) A daple 19 that carries a flat compound semiconductor for a laser diode and slides horizontally; a cutter 2 at the tip.
1, and has a cutter head 20 that moves up and down; a function that lowers the cutter 21 to a predetermined height above the compound semiconductor; and a function that lowers the cutter 21 to a predetermined height above the compound semiconductor; It is possible to avoid sliding relatively to the cutter 21; with one slide of the table, the cutter 21 is lowered at a predetermined scribing speed. depth and keep the cutter 21 at a predetermined depth inside the compound semiconductor)! cutter 21 after 1
Since it has the function of changing the upper bound at a predetermined scribing speed, the following effects can be achieved by 1 (11).

(a) Since the point scratches S on the ship's shape are made accurately and are short and the direction of cracking can be determined accurately, the actual work for cutting the wire can be done quickly and accurately. become.

(b) Therefore, the problem that the surface is not clean due to the scratches S is eliminated, and the yield of the product is significantly improved.

[Brief explanation of drawings]

FIG. 1 shows a point scribing device for a laser diode according to the present invention. A perspective view schematically showing the internal structure of the second
The figure is a front view showing the overall outline, and Figure 3 is I of Figure 2.
-I [1 arrow view, Figure 4 shows the cutter head part ♀i?
Figure 32, No. 51 is a bottom view of the cutter, Figure 6 is a schematic plan view showing the location of scratches z1 on the workpiece, and Figure 7 is the bottom view of the cutter.
8 is a side view showing the scratches, and FIG. 8 is a bottom view showing the detailed shape of the scratches. 19...Table, 20...Cutter head, 21...Cutter Patent applicant Obe Neiichi Kogyo Co., Ltd. Agent Patent attorney Tadaka Oshiki ゛・1 Figure 4 Figure 6 t3)

Claims (1)

[Claims] A table on which a flat compound semiconductor for laser diode is placed and slides horizontally; A cutter head having a cutter at the tip and moving up and down; A function to lower the cutter to a predetermined height above the compound semiconductor; The function is to slide the table relative to the cutter by a predetermined distance at a predetermined scribe speed after descending to the above predetermined height; as the table slides, the cutter is lowered at a predetermined scribe speed, and the cutter is lowered at a predetermined scribe speed. A point for a laser diode characterized by having a function of holding a cutter at a predetermined depth within a compound semiconductor after scribing, and raising the cutter at a predetermined scribing speed after holding the cutter at a predetermined depth within the compound semiconductor. scribing device.