JPH0523514B2 - - Google Patents
Info
- Publication number
- JPH0523514B2 JPH0523514B2 JP61006020A JP602086A JPH0523514B2 JP H0523514 B2 JPH0523514 B2 JP H0523514B2 JP 61006020 A JP61006020 A JP 61006020A JP 602086 A JP602086 A JP 602086A JP H0523514 B2 JPH0523514 B2 JP H0523514B2
- Authority
- JP
- Japan
- Prior art keywords
- cutter
- scribing
- workpiece
- data
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Semiconductor Lasers (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61006020A JPS62163386A (ja) | 1986-01-13 | 1986-01-13 | レ−ザ−ダイオ−ド用ポイントスクライブ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61006020A JPS62163386A (ja) | 1986-01-13 | 1986-01-13 | レ−ザ−ダイオ−ド用ポイントスクライブ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62163386A JPS62163386A (ja) | 1987-07-20 |
| JPH0523514B2 true JPH0523514B2 (enrdf_load_stackoverflow) | 1993-04-02 |
Family
ID=11627005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61006020A Granted JPS62163386A (ja) | 1986-01-13 | 1986-01-13 | レ−ザ−ダイオ−ド用ポイントスクライブ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163386A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107241A (zh) * | 2009-12-28 | 2011-06-29 | 赛科隆股份有限公司 | 用于从封装带分离半导体封装的装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4664544B2 (ja) * | 2001-07-27 | 2011-04-06 | 株式会社ディスコ | スクライビング装置 |
| JP3656910B2 (ja) | 2002-07-22 | 2005-06-08 | 住友電気工業株式会社 | スクライブ溝の加工方法及びスクライブ装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5320303B2 (enrdf_load_stackoverflow) * | 1973-12-14 | 1978-06-26 | ||
| JPS5919352A (ja) * | 1982-07-23 | 1984-01-31 | Hitachi Ltd | 半導体レ−ザヘキ開装置 |
| JPS6265209U (enrdf_load_stackoverflow) * | 1985-10-16 | 1987-04-23 |
-
1986
- 1986-01-13 JP JP61006020A patent/JPS62163386A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107241A (zh) * | 2009-12-28 | 2011-06-29 | 赛科隆股份有限公司 | 用于从封装带分离半导体封装的装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62163386A (ja) | 1987-07-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102009030454B4 (de) | Waferbehandlungsverfahren | |
| KR900001232B1 (ko) | 반도체 웨이퍼 방형절단기 | |
| CN2550805Y (zh) | 液晶显示器导光板的精密加工机 | |
| US5627913A (en) | Placement system using a split imaging system coaxially coupled to a component pickup means | |
| JP5214332B2 (ja) | ウエーハの切削方法 | |
| JPH0794846A (ja) | Pcb加工機 | |
| CN115255622B (zh) | 一种膜材打孔高精度大幅面加工系统及方法 | |
| JPH0523514B2 (enrdf_load_stackoverflow) | ||
| CN1775471A (zh) | 切削装置中的切削刀片倾斜角度调整方法及切削方法 | |
| JP5610123B2 (ja) | ダイシング装置 | |
| KR100826274B1 (ko) | 반도체 웨이퍼 쏘잉 장치를 이용한 부채꼴 패턴의 홈 가공방법 | |
| JP4517269B2 (ja) | Z補正付ダイシング装置 | |
| JP3341855B2 (ja) | ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置 | |
| JP2005136292A (ja) | 板状物の加工方法 | |
| JPH0760505A (ja) | バイトのセット方法 | |
| JP2000323811A (ja) | 基板の切断方法及び装置 | |
| AU2007100256A4 (en) | A shaping apparatus | |
| JP2686814B2 (ja) | バイトの芯高調整法 | |
| JPS6037186Y2 (ja) | レ−ザ加工装置 | |
| JP2532185B2 (ja) | セラミックス板の切断方法およびその切断装置 | |
| KR0184524B1 (ko) | 유리판의 가공기계 | |
| CN209407661U (zh) | 一种激光加工间距调整结构 | |
| JP2019036659A (ja) | 切削方法 | |
| JPS639643B2 (enrdf_load_stackoverflow) | ||
| AU2004253196B2 (en) | A shaping apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |