JPH0523514B2 - - Google Patents

Info

Publication number
JPH0523514B2
JPH0523514B2 JP61006020A JP602086A JPH0523514B2 JP H0523514 B2 JPH0523514 B2 JP H0523514B2 JP 61006020 A JP61006020 A JP 61006020A JP 602086 A JP602086 A JP 602086A JP H0523514 B2 JPH0523514 B2 JP H0523514B2
Authority
JP
Japan
Prior art keywords
cutter
scribing
workpiece
data
predetermined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61006020A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62163386A (ja
Inventor
Masanobu Yae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAITORON TEKUNOROJII KK
Original Assignee
DAITORON TEKUNOROJII KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAITORON TEKUNOROJII KK filed Critical DAITORON TEKUNOROJII KK
Priority to JP61006020A priority Critical patent/JPS62163386A/ja
Publication of JPS62163386A publication Critical patent/JPS62163386A/ja
Publication of JPH0523514B2 publication Critical patent/JPH0523514B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Semiconductor Lasers (AREA)
JP61006020A 1986-01-13 1986-01-13 レ−ザ−ダイオ−ド用ポイントスクライブ装置 Granted JPS62163386A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61006020A JPS62163386A (ja) 1986-01-13 1986-01-13 レ−ザ−ダイオ−ド用ポイントスクライブ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61006020A JPS62163386A (ja) 1986-01-13 1986-01-13 レ−ザ−ダイオ−ド用ポイントスクライブ装置

Publications (2)

Publication Number Publication Date
JPS62163386A JPS62163386A (ja) 1987-07-20
JPH0523514B2 true JPH0523514B2 (enrdf_load_stackoverflow) 1993-04-02

Family

ID=11627005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61006020A Granted JPS62163386A (ja) 1986-01-13 1986-01-13 レ−ザ−ダイオ−ド用ポイントスクライブ装置

Country Status (1)

Country Link
JP (1) JPS62163386A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102107241A (zh) * 2009-12-28 2011-06-29 赛科隆股份有限公司 用于从封装带分离半导体封装的装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4664544B2 (ja) * 2001-07-27 2011-04-06 株式会社ディスコ スクライビング装置
JP3656910B2 (ja) 2002-07-22 2005-06-08 住友電気工業株式会社 スクライブ溝の加工方法及びスクライブ装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5320303B2 (enrdf_load_stackoverflow) * 1973-12-14 1978-06-26
JPS5919352A (ja) * 1982-07-23 1984-01-31 Hitachi Ltd 半導体レ−ザヘキ開装置
JPS6265209U (enrdf_load_stackoverflow) * 1985-10-16 1987-04-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102107241A (zh) * 2009-12-28 2011-06-29 赛科隆股份有限公司 用于从封装带分离半导体封装的装置

Also Published As

Publication number Publication date
JPS62163386A (ja) 1987-07-20

Similar Documents

Publication Publication Date Title
CN2550805Y (zh) 液晶显示器导光板的精密加工机
US5627913A (en) Placement system using a split imaging system coaxially coupled to a component pickup means
JP5214332B2 (ja) ウエーハの切削方法
JPH0794846A (ja) Ｐｃｂ加工機
JPH0523514B2 (enrdf_load_stackoverflow)
KR100826274B1 (ko) 반도체 웨이퍼 쏘잉 장치를 이용한 부채꼴 패턴의 홈 가공방법
JP4517269B2 (ja) Ｚ補正付ダイシング装置
JP3341855B2 (ja) ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置
JP2005136292A (ja) 板状物の加工方法
JP2011146593A (ja) ダイシング装置
JP2000323811A (ja) 基板の切断方法及び装置
AU2007100256A4 (en) A shaping apparatus
JP2022101881A (ja) 加工方法
JP2686814B2 (ja) バイトの芯高調整法
JPS6037186Y2 (ja) レ−ザ加工装置
KR0184524B1 (ko) 유리판의 가공기계
CN209407661U (zh) 一种激光加工间距调整结构
JP2019036659A (ja) 切削方法
JPS639643B2 (enrdf_load_stackoverflow)
AU2004253196B2 (en) A shaping apparatus
JPH07241918A (ja) フレネルレンズ切削用刃物台
JPH07153719A (ja) ダイシング装置
JP2024025394A (ja) 加工装置
JP2024040887A (ja) 加工装置
CN119965134A (zh) 一种背扫描式解键合装置及方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term