JPS62162865U - - Google Patents
Info
- Publication number
- JPS62162865U JPS62162865U JP5053286U JP5053286U JPS62162865U JP S62162865 U JPS62162865 U JP S62162865U JP 5053286 U JP5053286 U JP 5053286U JP 5053286 U JP5053286 U JP 5053286U JP S62162865 U JPS62162865 U JP S62162865U
- Authority
- JP
- Japan
- Prior art keywords
- woven fabric
- wiring board
- printed wiring
- conductor
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002759 woven fabric Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
第１図は本考案に係るプリント配線基板の斜視
図、第２図及び第３図は第１図のプリント配線基
板の基板中のアルミナ含有割合に対する誘電損失
及び熱伝導率を示す線図、第４図は従来のプリン
ト配線基板を示す斜視図である。
尚、図面中１はプリント配線基板、２は不織布
、３は積層体、４は銅箔である。
FIG. 1 is a perspective view of a printed wiring board according to the present invention, FIGS. 2 and 3 are diagrams showing the dielectric loss and thermal conductivity with respect to the alumina content ratio in the printed wiring board of FIG. FIG. 4 is a perspective view showing a conventional printed wiring board. In the drawings, 1 is a printed wiring board, 2 is a nonwoven fabric, 3 is a laminate, and 4 is a copper foil.
Claims (1)
とする積層板上に導体を形成したことを特徴とす
るプリント配線基板。 A printed wiring board characterized in that a conductor is formed on a laminate whose base material is a woven fabric or non-woven fabric containing alumina as a main component.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5053286U JPS62162865U (en) | 1986-04-04 | 1986-04-04 | |
| DE19873711238 DE3711238A1 (en) | 1986-04-04 | 1987-04-03 | Printed circuit board |
| KR870003234A KR870010762A (en) | 1986-04-04 | 1987-04-04 | Printed wiring board |
| KR2019900011295U KR900010855Y1 (en) | 1986-04-04 | 1990-07-30 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5053286U JPS62162865U (en) | 1986-04-04 | 1986-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62162865U true JPS62162865U (en) | 1987-10-16 |
Family
ID=30873983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5053286U Pending JPS62162865U (en) | 1986-04-04 | 1986-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62162865U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58139490A (en) * | 1982-02-15 | 1983-08-18 | 株式会社トクヤマ | Composite material utilizing alumina fiber |
-
1986
- 1986-04-04 JP JP5053286U patent/JPS62162865U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58139490A (en) * | 1982-02-15 | 1983-08-18 | 株式会社トクヤマ | Composite material utilizing alumina fiber |