KR870010762A - Printed wiring board - Google Patents

Printed wiring board Download PDF

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Publication number
KR870010762A
KR870010762A KR870003234A KR870003234A KR870010762A KR 870010762 A KR870010762 A KR 870010762A KR 870003234 A KR870003234 A KR 870003234A KR 870003234 A KR870003234 A KR 870003234A KR 870010762 A KR870010762 A KR 870010762A
Authority
KR
South Korea
Prior art keywords
wiring board
printed wiring
board according
fabric layer
fabric
Prior art date
Application number
KR870003234A
Other languages
Korean (ko)
Inventor
히로가즈 모다이
도시야 가와베
이사오 후지다
Original Assignee
사스가 노부오
니혼이다가라스 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5053486U external-priority patent/JPS62162866U/ja
Priority claimed from JP5053286U external-priority patent/JPS62162865U/ja
Application filed by 사스가 노부오, 니혼이다가라스 가부시끼 가이샤 filed Critical 사스가 노부오
Publication of KR870010762A publication Critical patent/KR870010762A/en
Priority to KR2019900011295U priority Critical patent/KR900010855Y1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/10—Fibres of continuous length
    • B32B2305/18—Fabrics, textiles
    • B32B2305/188—Woven fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B32B2315/085—Glass fiber cloth or fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음No content

Description

프린트 배선 기판Printed wiring board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 알루미나를 기재로 함유하는 본 발명의 제1실시예에 따른 프린트 배선기판의 사시도.3 is a perspective view of a printed wiring board according to a first embodiment of the present invention containing alumina as a substrate.

제4도는 글래스 마이크로-밸룬을 함유하는 본 발명의 제2실시예에 따른 프린트 배선기판의 사시도.4 is a perspective view of a printed wiring board according to a second embodiment of the present invention containing glass micro-balloons.

제5도는 제3도에서 나타낸 프린트 배선기판의 기재의 알루미나 함유율(중량%)에 대한 유전손실의 관계를 나타내는 그래프.FIG. 5 is a graph showing the relationship between dielectric loss and alumina content (wt%) of the substrate of the printed wiring board shown in FIG.

Claims (16)

알루미나를 주성분으로 함유하는 직물층으로 된 적층판과, 이 적층판의 표면이 전도층으로 구성된 프린트 배선기판.A printed wiring board comprising a laminated sheet of a woven fabric layer containing alumina as a main component, and a surface of the laminated sheet composed of a conductive layer. 제1항에 있어서, 적층판이 우기 바인더를 개재하여 전기 직물층을 라미네이트하여 형성된 것이 특징인 프린트 배선기판.The printed wiring board according to claim 1, wherein the laminated board is formed by laminating an electric fabric layer via a rainy season binder. 제2항에 있어서, 유기 바인더가 에폭시수지, 경화제, 경화촉진제 및 용매로 구성하여 형성된 것이 특징인 프린트 배선기판.The printed wiring board of claim 2, wherein the organic binder is formed of an epoxy resin, a curing agent, a curing accelerator, and a solvent. 제2항에 있어서, 직물층이 실리키를 주성분으로 함유하는 것이 특징인 프린트 배선기판.The printed wiring board according to claim 2, wherein the fabric layer contains silica as a main component. 제4항에 있어서, 전술한 직물층이 45~100중량%의 알루미나와 0~55중량%의 실리카를 함유하는 것을 특징으로 하는 프린트 배선기판.The printed wiring board according to claim 4, wherein the aforementioned fabric layer contains 45-100 wt% alumina and 0-55 wt% silica. 제5항에 있어서, 전술한 프린트 배선기판의 양면을 열압착 프레스함을 특징으로 프린트 배선기판.6. The printed wiring board according to claim 5, wherein both sides of the above-described printed wiring board are hot pressed. 제2항에 있어서, 진술한 직물층이 글래스 마이크로-밸렌으로 함침된 것이 특징인 프린트 배선기판.The printed wiring board according to claim 2, wherein the fabric layer mentioned is impregnated with glass micro-valene. 제7항에 있어서, 전술한 직물층이 5~40중량%의 글래스 마이크로-밸룬을 함유함을 특징으로 하는 프린트 배선기판.8. The printed wiring board according to claim 7, wherein the aforementioned fabric layer contains 5 to 40% by weight of glass micro-balloons. 제8항에 있어서, 전술한 글래스 마이크로-밸룬이 약 40이하의 평균입경을 갖는 것이 특징인 프린트 배선기판.9. The printed wiring board of claim 8, wherein the glass micro-balloon described above has an average particle diameter of about 40 or less. 제9항에 있어서, 전술한 글래스 마이크로-밸룬이 계면활성제로 계면처리된 것이 특징인 프린트 배선기판.10. The printed wiring board according to claim 9, wherein the glass micro-balloon described above is surface treated with a surfactant. 제10항에 있어서, 전술한 계면활성제가 메톡시실란과 아미노실란으로 구성된 군에서 선택된 유기실란임이 특징인 프린트 배선기판.The printed wiring board according to claim 10, wherein the surfactant is an organosilane selected from the group consisting of methoxysilane and aminosilane. 제7항에 있어서, 45중량%의 직물층이 20중량%의 글래서 마이크로-밸룬에 함침된 것이 특징인 프린트 배선기판.8. A printed wiring board according to claim 7, wherein 45% by weight fabric layer is impregnated with 20% by weight glasser micro-balloons. 제1항에 있어서, 전술한 직물층이 부직포로 구성된 것이 특징인 프린트 배선기판.The printed wiring board according to claim 1, wherein the fabric layer described above is made of a nonwoven fabric. 제1항에 있어서, 전술한 직물층이 직포로 구성된 것이 특징인 프린트 배선기판.The printed wiring board according to claim 1, wherein the fabric layer described above is made of a woven fabric. 제7항에 있어서, 직물층이 글래스 부직포로 구성된 것이 특징인 프린트 배선기판.8. The printed wiring board according to claim 7, wherein the fabric layer is made of glass nonwoven fabric. 제7항에 있어서, 전술한 직물층이 글래스 직포로 구성된 것이 특징인 프린트 배선기판.8. The printed wiring board according to claim 7, wherein the fabric layer described above is made of glass woven fabric. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR870003234A 1986-04-04 1987-04-04 Printed wiring board KR870010762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900011295U KR900010855Y1 (en) 1986-04-04 1990-07-30 Printed circuit board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP50532 1982-03-29
JP50534 1986-04-04
JP5053486U JPS62162866U (en) 1986-04-04 1986-04-04
JP5053286U JPS62162865U (en) 1986-04-04 1986-04-04

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019900011295U Division KR900010855Y1 (en) 1986-04-04 1990-07-30 Printed circuit board

Publications (1)

Publication Number Publication Date
KR870010762A true KR870010762A (en) 1987-11-30

Family

ID=26391009

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870003234A KR870010762A (en) 1986-04-04 1987-04-04 Printed wiring board

Country Status (2)

Country Link
KR (1) KR870010762A (en)
DE (1) DE3711238A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0309982A3 (en) * 1987-09-30 1990-09-12 E.I. Du Pont De Nemours And Company Polymer-ceramic composite plies
US5028984A (en) * 1988-11-04 1991-07-02 International Business Machines Corporation Epoxy composition and use thereof
US4960634A (en) * 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof
JP2993065B2 (en) * 1990-07-27 1999-12-20 三菱瓦斯化学株式会社 Metal foil-clad laminate with smooth surface
WO1993023979A1 (en) * 1992-05-15 1993-11-25 Marina Adolfovna Sokolinskaya Substrate for printed circuit boards and method of making it
US6042936A (en) * 1997-09-23 2000-03-28 Fibermark, Inc. Microsphere containing circuit board paper

Also Published As

Publication number Publication date
DE3711238A1 (en) 1987-10-15

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
WICV Withdrawal of application forming a basis of a converted application