JPS62161466A - セラミツク接合用金属部材 - Google Patents
セラミツク接合用金属部材Info
- Publication number
- JPS62161466A JPS62161466A JP307486A JP307486A JPS62161466A JP S62161466 A JPS62161466 A JP S62161466A JP 307486 A JP307486 A JP 307486A JP 307486 A JP307486 A JP 307486A JP S62161466 A JPS62161466 A JP S62161466A
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- ceramics
- metallic member
- metal
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 27
- 239000002131 composite material Substances 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 7
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 238000005219 brazing Methods 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 150000002739 metals Chemical class 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 150000004678 hydrides Chemical class 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000155 melt Substances 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- 229910052726 zirconium Inorganic materials 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 2
- 235000012054 meals Nutrition 0.000 abstract 1
- 239000000463 material Substances 0.000 description 11
- 239000002245 particle Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- -1 etc. Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241000219112 Cucumis Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003601 intercostal effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP307486A JPS62161466A (ja) | 1986-01-09 | 1986-01-09 | セラミツク接合用金属部材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP307486A JPS62161466A (ja) | 1986-01-09 | 1986-01-09 | セラミツク接合用金属部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62161466A true JPS62161466A (ja) | 1987-07-17 |
JPH0449511B2 JPH0449511B2 (enrdf_load_html_response) | 1992-08-11 |
Family
ID=11547191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP307486A Granted JPS62161466A (ja) | 1986-01-09 | 1986-01-09 | セラミツク接合用金属部材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62161466A (enrdf_load_html_response) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260952A (ja) * | 1988-08-27 | 1990-03-01 | Japan Synthetic Rubber Co Ltd | 冷凍機のゴム部材用ゴム組成物 |
US5340658A (en) * | 1991-08-21 | 1994-08-23 | Ishihara Chemical Co., Ltd. | Composites made of carbon-based and metallic materials |
-
1986
- 1986-01-09 JP JP307486A patent/JPS62161466A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260952A (ja) * | 1988-08-27 | 1990-03-01 | Japan Synthetic Rubber Co Ltd | 冷凍機のゴム部材用ゴム組成物 |
US5340658A (en) * | 1991-08-21 | 1994-08-23 | Ishihara Chemical Co., Ltd. | Composites made of carbon-based and metallic materials |
Also Published As
Publication number | Publication date |
---|---|
JPH0449511B2 (enrdf_load_html_response) | 1992-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0217509B2 (enrdf_load_html_response) | ||
US4729504A (en) | Method of bonding ceramics and metal, or bonding similar ceramics among themselves; or bonding dissimilar ceramics | |
US4988035A (en) | Method of liquid phase diffusion bonding of metal bodies | |
JPS62192296A (ja) | ろう材 | |
US20040060962A1 (en) | Method of joining surfaces | |
US4958763A (en) | Method of soldering aluminum | |
JPS62161466A (ja) | セラミツク接合用金属部材 | |
JP3629578B2 (ja) | Ti系材料とCu系の接合方法 | |
JP2002292474A (ja) | チタン材又はチタン合金材の接合方法 | |
JPH05109947A (ja) | 熱伝導材料とその製造方法 | |
JPS6334963A (ja) | 半導体装置用セラミツク基板の製造方法およびその方法に使用するクラツド材 | |
JPS62222060A (ja) | スパツタリング用タ−ゲツト | |
JPH0338943B2 (enrdf_load_html_response) | ||
JPH01203209A (ja) | 黒鉛のメタライズ方法及び黒鉛複合部材 | |
JPS6177676A (ja) | 窒化珪素体の接合体および接合方法 | |
WO2001076335A1 (en) | Mounting structure of electronic device and method of mounting electronic device | |
JP3387655B2 (ja) | セラミックスとシリコンの接合方法 | |
JPH03237735A (ja) | Tabテープ | |
TW540276B (en) | Solder point with low speed of consuming nickel | |
JPS6026633A (ja) | 接合用インサ−ト合金 | |
JPH0238378A (ja) | セラミツクスのはんだ付方法 | |
JPH0215874A (ja) | 金属とセラミックの接合方法及び接合材 | |
JPS59174581A (ja) | アルミニウムとアルミナとの接合方法 | |
JPS6318647A (ja) | 半導体装置用セラミツク基板の製造方法およびその方法に使用するクラツド材 | |
JPS5893584A (ja) | 耐熱合金の接合方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |