TW540276B - Solder point with low speed of consuming nickel - Google Patents

Abstract

A solder point provided with copper atoms is suited for being positioned on a contact pad provided with a nickel layer. Interface products between the solder point and the contact pad can be influenced by controlling the quantity of copper atoms inside the solder point. Hence, the speed of consuming the nickel layer in the contact pad can be lowered.

Description

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The present invention relates to a solder joint structure b 4-.ϊ 丄 丄 纤 催 催 々 偁, and special y 丨 丨 3 kinds of errors caused by the control of welding load 疋 k k generated between a nickel layer Select the return rate of ~ points and contacts. "The consumption of the nickel layer of 5 may be under the current information generation society of M, electronic products have become common products, and electronic products become human but packaging steps, said M + execution AL Μ; For more Japanese and Japanese films, you must use Japanese-made Japanese-Japanese films to electrically connect with external circuits, such as 9 4 丨 using a flip-chip process and the substrate electrical production basin k1 such as

The brush circuit topology f π: connection, and the substrate can be reused for soldering HP connection. Among them are wafers, substrates, and printed circuits: the work of Yori, Rotan, and others is electrically connected to each other and also provides mechanical support. Therefore, the solder joint itself is strong; the BM is strong, the bright spot disk is ^ & the old mechanical shell is 2 ",, 1, the soldering properties between the contacts of the electronic components are also damage to the electronic components. Facts i. Percentage of electronic components: Hachijun comes directly or indirectly from solder joints. Therefore, the properties of solder joints and the improvement of their solderability are very important. Refer to Figure 1 for details. It is not intended that the contacts and solder joints of the components. Generally speaking, the electronic component 100 has multiple contacts. Only one of them is shown in the figure. It is called a soldering pad or bump metallurgy. The contact 11 () can be composed of a copper layer 112, a recording layer 114, and a gold layer 116. Nickel The layer 114 is located on the copper layer 112, the gold layer 116 is located on the nickel layer 11 4 and the solder joint 丨 2 0 is formed on the gold layer 丨 i 6. When the solder joint 1 2 0 has not been formed on the contact丨 丨 〇, the gold layer 丨 丨 6 can prevent the surface oxidation of the contact 11 0, and when the contact 丨 丨 〇 and the solder joint 1 2 〇

9468twf.ptd Page 4 540276 V. Description of the invention (2) When bonding, the wetting property between the solder joint 1 2 0 and the contact 11 0 can be increased by the gold layer 116. The main function of the nickel layer 114 is to act as a diffusion layer P between the copper layer 11 2 and the known point 120, so as to prevent the copper layer 112 from directly contacting the fish fresh point 1 2 0, which causes the copper layer 112 to be consumed. Too fast happens. The fresh spot 120 is, for example, an alloy containing tin. At the beginning of welding, the gold layer 116 will enter the interior of the solder joint 120 at a very fast speed and form (Au, Ni) Sn4 compound. After the gold layer 116 disappears, the underlying recording layer 114 starts to contact the solder joint 120 and reacts to form a Ni3Sn4 compound. The formation of the Ni3Sn4 compound will cause the nickel layer 114 to be consumed quickly. After the nickel layer 114 is consumed, The copper layer underneath it will quickly react with the solder joint 120 by removing the barrier of the nickel layer 114. The two-T reaction is compared with the reaction with the nickel layer 114 at a fresh point of 12 ° = the previous order of magnitude or more. Therefore, after losing the barrier of the nickel layer 114, Jinshan is the copper layer U2 will be quickly depleted by the bright point 120. Recorders ^

Branching is fragile and prone to disconnection. Therefore, the object of the present invention is to select the copper concentration contained in one point, and to select = -and, di-binary structure 'to achieve the consumption rate of the nickel layer on the invention. Suitable for arranging a contact ±, # ', the purpose is to propose a solder joint. At the point of setting, the contact is at least white twisted. The material includes copper, and the consumption rate of the solder joint in volume 2 is controlled by the steel. It can reduce the recording in the recording layer of the contact 540276. Description of the invention (3) a According to a preferred embodiment of the present invention, the material of the solder joint can be 5 a gold-tin oblique copper alloy or tin-silver Copper alloy. The above contacts can be placed on a chip, a substrate or a printed circuit board. In addition, the thickness of the nickel layer is between 500 μm: 15 μm and 15 μm, and the nickel layer * may be added with γΠ ′ gas phosphorus, cobalt, copper, or vanadium. In addition, the copper concentration in the solder joint is between 0 · 0 5% and 5%. Tian Weihan, a claw according to a preferred embodiment of the invention, there are four ways to form copper containing ===. The first way is to plate or screen print 4 fi when applying solder to the contacts. Just apply the solder containing copper U: one way is to join the solder joint with another joint, and the copper of the other joint makes the copper of the other joint diffuse into the solder joint; the third way A copper layer is added between the solder joint and the contact, and the copper element of the copper layer diffuses into the solder joint. The fourth method is to add copper atoms to the nickel layer to form a nickel-copper alloy to increase Copper content at the interface between contacts and solder joints. 7 Furthermore, according to a preferred embodiment of the present invention, the contacts further include a copper layer and a gold layer, and the nickel layer is located on the copper layer, and the gold layer is located on the nickel layer. On the gold layer, the interface product at this time can be (Cu, Au, Ni) 6Sn5 compound, or (Cu, Au, Ni) 6Sn disc type

Compounds in the form of (Ni, Cu) 3Sn4. If it does not contain gold sound, the interface product can be continuous (Cu, Ni) 6sJa, or a mixture of (Cu, Ni) 6Sn5. (Ni, Cu) 3Sn4 . G Contains: Shulai Anthology II = Construction

9468twf.ptd $ 6 page 540276 V. Description of the invention (4) Product ’to reduce the consumption rate of the nickel layer of the contact. If the contact contains a gold layer, you can choose to generate (Cu, Au, Ni) 6Sn5 compounds, or (Cu, Au, Ni) 6Sn5 and (Ni, Cu) 3Sn4 mixed compounds' right contact In the absence of a gold layer, you can choose to generate (Cu,

Ni) 6Sn5 compound, or a mixture of (Cu, Ni) 6Sn5 and (Ni, Cn) 3Sn4. For β to make the above and other objects, features, and advantages of the present invention more comprehensible, hereinafter, a preferred embodiment is described in detail, and in conjunction with the accompanying drawings, the detailed description is as follows: Symbols of the drawings: 100 electronics Element 110 contact 112 copper layer 114 nickel layer 116 gold layer 120 solder joint 200 wafer 210 contact 212 copper layer 214 nickel layer 216 gold layer 220 solder joint 510 straight

9468twf.ptd Page 7 540276 V. Description of the invention (5) 520 straight 530 straight 800 wafer 810 contact 820 solder joint 830 substrate 840 contact 900 wafer 910 contact 912 copper layer 914 recording layer 916 gold layer 920 solder joint 990 copper Layer Example The present invention intends to reduce the reaction products produced by the gate by controlling the production between the solder joint and the nickel layer of the joint. Consumption rate of the contact layer. In the middle of the basin, the structure of the A contacts and solder joints can be as shown in Figure 2. The contact 210 is configured on a wafer 200, and the contact 21 is a copper layer 212. , A nickel layer 214 and a gold layer 216, wherein the nickel layer 214 can be formed on the copper layer 212 by means of electroless plating, electrical bonding, coin bonding, or steaming. 1 micron

9468twf.ptd Page 8 540276 V. Description of the invention (6)-time; and the gold layer 216 can be formed on the nickel layer 21 4 by means of electroless plating, electroplating, sputtering or evaporation; and the solder joint 2 20 It can be formed on the gold layer 21 6 by means of “electric ore” or plate printing and re-soldering. However, the contacts of the present invention can also be arranged on a substrate or a printed circuit board, in which the nickel layer can be used. An electrical ore or non-electrical clock is formed on the copper layer. The thickness of the nickel layer is, for example, between 1 micrometer and 15 micrometers. The gold layer can be formed on the nickel layer by helmet electroplating or electroplating. The solder joints can be formed on the gold L by screen printing and reflow soldering or solder ball and reflow soldering. In addition, the material of the solder joint 220 is, for example, a tin alloy with copper or a tin-silver alloy. The material for adding copper is described in detail as follows. The reaction of the contact between the tin oblique copper series solder and the nickel-containing layer. Refer to Figure 2A, 2B, 2c, and ⑽. The solder joints of the tin-lead alloy are shown. The second phase of the 8th Middle School ^ Andian 1 ^ is about 2 minutes later. The first line shows 2Β FIG welded joint microstructure comprising 0.1wte% Cu Jun about 2 minutes after the phase diagram, the second, each square "to one of the pads and

Soldering and soldering of Cu-tin-copper alloys ㈤8, 2 = Contains 0.5wt. 〇 / 〇 The 2D picture shows a metallographic diagram of j2 knife 1 containing L5wt.% Cu. Welding approx. Metallographic picture after 2 minutes. Before welding, between the thickness of the gold joint and the contact micrometer to 1.2 micrometers, the thickness of the nickel layer is thick. The thickness is about 0 · 8 pa > / 1 is about 6 microns to ι | 8 The thickness of the copper layer is about 7 microns. Free 卞 卞 卞 8 镞 未 之 2C and 2D, we can see that with the indifference of copper, Figure 2B, the second form of the product. When copper is added to the solder joint and the interface appears different, the interface products between the joints will change from the original I, and the solder joint will be especially early—and continuous Ni3Sn4 layer.

540276 V. Description of the invention (7) --------- (Figure 2A), gradually transformed into a mixed type of (Ni, Cu) 3Sn4 and (Cu, Au, n (Figure 2B). If copper is added in If the concentration in the solder joint is ±, the interface product between the joint and the joint will be transformed into a continuous |

Ni) 6Sn5 layer (Figure 2C and 2D). ',, AU, In order to highlight the effect of copper on interface products, this study extended the time to 4 hours. Please refer to FIG. 3A and FIG. 3B, wherein the “series” shows a metallographic diagram of soldering and soldering of a tin-lead alloy after about 4 hours and is maintained at σ 225 ° C, and the third series is a diagram containing 15wt% Cu tin-lead-copper alloy solder joints and joints were welded for about 4 hours and maintained at a metallurgical diagram below 225 °. It can be seen from Figures 3A and 3B that although copper-added solder joints can grow A thicker interface product is produced, but the nickel layer remaining in the contacts is also thicker. In addition, according to the EPA's identification, it can be seen that in Figure 3A, the interface product between the contact and the tin-lead alloy solder joint The system is Ni3Sn4. In Figure 3B, the interface product between the contact and the tin-lead-copper alloy solder joint containing 1.5 wt.% Cu is (Cu, Au, Ni) 6Sn5. Therefore, if the interface is Grow out (Cu, Au, Ni) 6 S η 5 is indeed beneficial to reduce the consumption rate of the nickel layer in the contact. In order to understand the state of the solder joint in daily use more quickly, solid state heat treatment to accelerate solder joint aging is often used A method of this study. After welding, the solder joint is subjected to a solid state heat treatment at 160 ° C to understand its state in daily use. Figure 4A shows a metallographic diagram of soldering and soldering of tin-lead alloy after about 2000 hours and maintained at 160oC. From Figure 4A, it can be seen that after heat treatment, a layer of about 13 microns is removed. 7 微米。 Outside the thick Ni3Sn4 generated, there is another layer of about 14 microns thick (Au, Ni) Sn4 generated on the interface, and the thickness of the nickel layer in the contact is only about 1. 7 microns.

9468twf.ptd Page 10 V. Description of the invention (8) If the solder joint contains a scene of steel, as shown in Figure 4B, the interface between the solder joint and the joint is another Cu-Sn-Pb-Cu alloy. Zai = 'wherein Figure 4B is a metallographic diagram containing 0.5) η at 160 ° C. After about 2,000 hours of contact, contact, and contact were maintained and maintained. Only a single product was found on the surface of EPMA, XRD, and TEM. The Ni) 6Sn5 compound was found. In ^ 疋, the product of this interface is (Cu, Au, except that (Au, Ershi Er, (Cu ^ Au, Ni) 6Sn5) can be suppressed when there is copper (Au, = in This means that when the solder joint contains a picture, the thickness of the recording layer in the contact is generated. In addition, after the results shown in Figure 4B, the dry micron ' When the Xue point contains copper, it can be large

People are totally wrong for f / JV steps. Under the condition that the contact does not contain a gold layer, Sikkim L

The effect of the recording layer is also started in this study. Welding work of tin = :: ίΛ, in which the recording layer is formed on the copper layer, and the D #terminal m Γ recording layer is shown in Figure 4C, of which Figure 4C: After about 2000 hours of soldering of Ni-Cu lead and nickel / copper joints, the metallographic diagram of the temple at 160 ° C. Compared to Fig. 4A, since the contact does not contain a gold layer in Fig. 仏, it is natural that this solder joint will not have (eight small Ni) Sn4 generated. At this time on the interface, only a single Νί3§η4, ^ was found. It is worth noting that the thickness of the interface Ni3Sn4 is only about 9 microns, and this thickness is significantly thinner than the thickness of the interface Ni3Sn4 in FIG. 4A. This result means that when the interface (Au, Ni) Sn4 covers the interface Ni3Sn4, instead of failing to produce a shielding effect, it will have the effect of accelerating the growth of Ni3Sn4, and the consumption rate of the nickel layer will also increase.

Page 11 540276 V. Description of the invention (9) It can be clearly seen from Figures 4A, 4B and 4C that when the interface generates (Cu, Au, Ni) 6Sn5, the consumption rate of the nickel layer is the slowest. This is due to the fact that the concentration of nickel in (Cu, ju 'Ni) 6Sn5 is much lower than the concentration contained in Ni3Sn4, and that the growth rate of (Cu, Au, Ni) 6Sn5 is higher than that of Γ on Ni3Sn4. (Cu, Au, Ni) 6Sn5 consumes the most nickel. As shown in FIG. 4C, the thickness of the nickel layer is 71 micrometers. In contrast, when (Au, Ni) Sn4 covers the interface, it has an accelerating effect, as shown in Figure 2, where the thickness of the nickel layer is the smallest (1.7 microns). Figure 5 is a drawing Shown is the result of the heat treatment time rounding the growth thickness of Ni 3 6Sn5. U, Nl) is the result of the famous mapping, where the line 510 indicates the tin-lead alloy, dry, and nickel-steel contacts. The growth rate of Ni3Sn4 · The soldering capacity of the main tin-lead alloy is from the poor soil, the straight line 520 indicates that 530 indicates the growth rate containing Γ; on the straight contact (Cu L: RU Erco copper alloy solder joint is at ^ During solid-state heat treatment, (/ n long rate. It can be seen from Figure 5 that it is slow. &Amp; (CU, AU, Nl) 6Sn5 has a higher growth rate than Ni3Sn4, and the above-mentioned λ is true / proven 'copper to tin The reaction between the nickel layer and the nickel layer of the wrong connection system: drop :: select the welding point and the rate of consumption of the joint. The object of the tin-silver-copper series of the counterattack to reduce the nickel layer of the contact: fresh and nickel The layer's contact response ^ ^ The next stage will be further ^ ^ At the time of the copper wave on the tin-silver brazing 540276 five L, description of the invention (10) system ' The tin-silver-copper solder joint is formed on a contact. In the present embodiment, the contact is composed of a steel layer, a recording layer, and a gold layer, where the nickel layer is located on the copper layer. The layer is located on the nickel layer, and the solder joints are formed on the gold layer. Its structure is shown in Figure 2 and will not be repeated here. As shown in Figures 6A, 6B, and 6C, where The 6-person diagram is a metallographic diagram of ―3 5Ag (w ^ / Q) solder joint and contact after about 2 minutes of welding. The 6β diagram is not Sn-4Ag-0. 5Cu (wt ·%) The phase diagram of the solder joint and the joint is about 2 ^, and the 6C diagram is a metallographic diagram of 811-3.5Ag ^ 75 (: u (wt; spot welding f / minute). From Figures 6A and 6B : In Figure 6C, it can be seen that the difference in copper concentration between Ik and the interface will result in different objects. When copper is added to the solder joint, the interface products between the copper and copper joints will be formed from the original H ditin-silver-copper solder joints and contacts. As shown in Figure 6A), it gradually changes to (continuously, the Ni3Sn4 layer (if the concentration is higher, the interface origin point f =), if copper is added to the solder joint

Ni) 6Sn5 layer (as shown in Fig. 6C-: is transformed into a continuous (Cu, Au, silver with different content). In addition, this study also tried to add various effects, and found that silver reacted on the interface to the interface. In terms of reaction, tin-silver-copper solder is not so much as containing nickel = ㈢ shell. In other words, the concentration change is affected. .., θ, interface reactions are mainly affected by copper. It is worth clarifying that although-^, but The tin-silver-copper welding system% 1… is also slightly affected by the change in copper concentration. For example, when the tin alloy system is affected by the copper effect of 0.5 wU steel, it is' in the heart ~ 〇 ^ Welding the same μ

9468twf.ptd Page 13 The hot spot interface is to generate a single 540276 V. Invention description (11) of the (Cu, Au, Ni) 6Sn5 layer (as shown in Figure 2C). However, at the solder joint interface of SnAg-0.5Cu, two compounds ((Ni, Cu) 3Sn4 and (Cu, Au, Ni) 6Sn5) grow (see Fig. 6B). Please refer to Figures 7A, 7B, and 7C, where Figure 7A shows the solder joints and contacts of Sn-3. 5Ag (wt ·%) after about 30 hours and maintained at 180 ° C Fig. 7B shows a metallographic diagram of Sn-4Ag-0.5Cu (wt.%) Solder joints and contacts after 3,000 hours and maintained at 丨 800c. 7C is a metallographic diagram showing the solder joints and contacts of Sn-3.5Ag-0.75Cu (wt ·%) after being soldered for about 300 hours and maintained at 1800 (:). As can be seen from Fig. 7A, the solder joints When copper is not included, Ni3Sn4 and (Au, Ni) Sn4 compounds will be formed at the interface. As shown in Figure 7B, if the copper concentration of the tin-silver-copper solder joint is 0.5wt ·%, the interface will be generated ( Ni, Cu) 3Sn4 and (Cu, Au, Ni) 6SnJ are two kinds of a substance ', which is similar to the tin-copper solder joint (as shown in the figure) is' the interface between the soldering tightness of copper and the contact is also not the same There will be (a, old) l, lacking ', and the t disk, ie rhyme Λ, does not add copper to the solder joint, which can suppress (Au, Ni) Sn4 pts.

PbSn-0 · 5Cu (wt ·%) solder joint * & Tian L again

Au, Ni) 6Sn5 (As shown in the figure of the fairy, only a single (CU, but the interface between the points is generated (Ni is not, but 疋 SnAg-0. 5Cu solder joints and seed compounds (as shown in Figure 7B C ') 3Sn4 and (Cu, Au, Ni) 6Sn ^ to 0.75 wU are connected. The copper content of the right tin-silver-copper solder joint is further increased by Cu) 3Sn4 and (Cu, Au, Ni) =. It is generated, but the 7f ^ 2 compounds in the 7B panel are compared (as shown in FIG. 7C).

Sn ^ Ag-O ^ CuCwt.o ;;, !!) In the knowledge point, (Ni, CU) 3Sn4 is thicker, and

9468twf.ptd Page 14 540276 V. Description of the invention (12) The thickness of the remaining nickel layer is thin (as shown in Figure 7B); however, in

In the Sn-3.5Ag-.75Cu (wt ·%) solder joint, (Ni, Cu) 3Sn4 溥, and the thickness of the remaining nickel layer is thicker (as shown in FIG. 7C). From the two =, copper two has the effect of suppressing the production of (Au, Ni) Sn4, and it also has the effect of slowing the production of ’u ′ Sn4. Therefore, when the copper concentration of the solder joint is increased, the growth of Ni3Sn4 or (Ni, Cu) 3Sn4 can be increased, and the consumption rate of the nickel layer in the contact can be increased. However, this issue: Yueyi can be applied to various forms of palladium / zinc '/ 锦 ίΐί gold / nickel / copper contacts, nickel / copper contacts, or other You can also add 并且, 、, and copper solder joints to the recording layer / 4 / bu> π in the present invention is not limited to the use of tin-silver-copper as the material It :; the freshness of the material can also be The use of tin-copper as a material consumes 4 degrees of control, and the nickel layer in the contact is slowed down to 5% ^. In the β point, the copper concentration is, for example, between 0.05%. There are many ways to add Λ steel to the welding point B. For the following welding points, they are directly formed by electroplating or screen printing. ^ Then, a welding point containing copper is formed. . ^ ^ ΛΓΛνν w ^ ^ ^ ^ ^ ^ ^ ^ ^ Schematic cross-sectional view of the structure of the solder joint between the slabs at one end of point 820. Among them, the soldering end is connected to the contact 810 of the 831 sheet of the A board, and the soldering point 820 is connected to the contact 84G of the substrate 830. The contacts of chip 81q contain-record

9468twf.pld Page 15 540276 V. Description of the invention (13) 1, wherein the contact point 81 of the chip 80G can be similar to the structure shown in FIG. 2 or similar to the foregoing various contacts containing a nickel layer. The contact 840 of the substrate 83 is composed of a copper layer, so that after the solder joint 82 is joined with the contact 840 of the substrate 830, the copper in the contact 84 of the substrate 83 can diffuse to the front point. 820 to increase the copper concentration in solder joint 820. In addition, the distance between the contact point 8 1 0 of the wafer 8 0 and the contact point 8 40 of the substrate 8 3 0 can be reduced, so that the contact point 8 4 0 of the substrate 8 3 0 can be diffused to the solder point 8 2 〇. The copper in the copper can reach the contact point 810 of the wafer 8000 in a short time, and affect the properties of the interface between the contact point 810 of the wafer 8000 and the solder joint 820. In addition, by reducing the quality of the solder joint 820, only a small amount of copper needs to be diffused into the solder joint 820 at the junction 84 of the substrate 83, and the concentration of copper ions in the solder joint 82 can be greatly increased. ' However, it affects the properties of the interface between the contact 8 1 0 and the solder 8 2 0 of the wafer 8 0. In addition, the above-mentioned method for increasing the copper concentration can also be applied to a solder joint located between a substrate and a printed circuit board. -The third method, please refer to FIG. 9, which shows a schematic cross-sectional view of contacts and recording points according to a comparative example of the present invention. Before the solder joint 9 200 is formed on the contact 910 of the wafer 900, a copper layer 9900 can be pre-plated on the wafer 9 900 on the contact 91. After the bright spot 920 is formed on the copper layer 990 in this way, the copper atoms in the copper layer 990 will diffuse into the solder joint 920 to increase the copper content in the solder joint 920. The contact 91 of the wafer 900 is composed of a copper layer 912, a nickel layer 914, and a gold layer 916. The detailed structure and manufacturing method are shown in FIG. 2 and will not be repeated here. To repeat. However, it is also possible to form a copper layer on the contacts of the substrate to increase the concentration of copper in the solder joints on the contacts of the substrate, or to form a copper layer on the contacts of the printed circuit board.

Page 16 540276 V. Description of the invention (14) Adding contacts to the printed circuit board In the embodiment, the copper layer is pre-mineralized at the contacts ′ ,, s, and concentration. In the above-mentioned reality, however, the present invention is not localized = that is, formed in the gold layer plated in the contact, for example, the copper layer is spread: =, the copper layer can also be preset to the copper / nickel / copper contact structure . ′, Xi Chengdi four ways, can 〇 + i contact point and solder joint interface copper content. Copper is added in the brocade layer to increase the copper concentration. The description is: Li'V's joint structure is controlled by controlling the joint AJ, [, / ^ ^ ^, nickel of points and contacts. The reaction between the layers = to reduce the consumption rate of the nickel layer of the contact: In the case of the following, you can choose to generate (Cu, Au, gold AU, N⑽ and ⑽, Cu) 3; if connected If you do not have a gold layer, then you can choose i; Although the present invention has been disclosed as above with a preferred embodiment = Limiting the present invention, anyone familiar with this skill can make some changes on this and not on the eve. Retouching, so ί:; :: /, 濩 辄 虽 Although the scope of the attached patent application is defined as the standard.

Page 540 276

FIG. 1 is a schematic cross-sectional view of a contact and a solder joint of a conventional electronic component. FIG. 2 is a schematic cross-sectional view of a preferred contact according to the present invention. Figure 2 A. Miscellaneous tin alloys. LA. Metallographic diagram. Figure 2B of the welding of Wang Zhixian and the contact after about 2 minutes shows the metallographic phase containing 0.1% wt ·% of 44_ U tin tin 1 copper alloy bright spot welding 4 after about 2 minutes of welding Illustration. ", Fig. 2C shows the metallographic image of the tin-gold σ copper alloy containing 0.5wt ·% Cii $ 缌 人人 U, the tin-gold σ copper alloy, and" ". 〃 Figure 2D shows a metallurgical picture containing about 5 minutes of I5wt ·% Cu:? 4l »personal contact after welding. The solder joints of tin gas copper and gold are shown in Fig. 3A, and the metallographic diagrams of the fresh spots and joints of tin disorder i alloy are maintained at 2250C. Let η ″ be silly and FIG. 3B shows the soldering of the tin-lead-copper alloy containing Uwt.% CU for about 4 hours and the solder joint is maintained at 225. The following metallographic map I of Zhan and the younger brother 4 A shows the metallographic map of the tin point of Syrah alloy after the welding of the traitor and the contact is about 2000 hours and maintained at 16 00 C. Fig. 4B shows a metallographic diagram of a tin-lead-copper alloy containing 0.5 wt.% Cu after soldering to a joint for about 2,000 hours and maintained at 1600 (:). The metallographic diagram of the tin-lead alloy solder joint with the nickel / copper contact after about 2000 small 4 and maintained at 160 ° C. Figure 5 shows the heat treatment time for Ni3Sn4 (CU.7 〇Au0.05Ni0.25) 6Sn5 growth thickness mapping results.

9468twf.ptd Page 18 540276 Brief description of the drawing Figure 6A shows the metallographic picture of the soldering point of Sn-3 · 5Ag (wt ·%) after about 2 minutes. Fig. 6B shows a metallographic image of Sn-4Ag-0.5Cu (wt ·%) solder joint and contact freshly after about 2 minutes. Figure 6C shows a metallographic diagram of the solder joints and contacts of Sn-3.5Ag-0.75Cu (wt ·%) after about 2 minutes. Fig. 7A shows a metallographic diagram of Sn-3.5Ag (wt ·%) solder joints and contacts after being soldered for about 300 hours and maintained at 180 ° C. Figure 7B shows a metallographic diagram of Sn-4Ag-0.5Cu (wt ·%) solder joints and solder joints after about 300 hours and maintained at 1800 ° C. Figure 7C shows a metallographic diagram of the solder joints and contacts of Sn-3.5Ag-0.75Cu (wt.%) After being soldered for about 300 hours and maintained at 180 ° C. FIG. 8 is a schematic cross-sectional view of a solder joint structure between a wafer and a substrate according to a preferred embodiment of the present invention. FIG. 9 is a schematic cross-sectional view of a contact and a solder joint according to a preferred embodiment of the present invention.

9468twt.ptd Page 19

Claims (1)

540276 6. Scope of patent application 1. A solder joint suitable for being disposed on a joint 'the joint includes at least a nickel layer, characterized in that the material of the joint includes copper, and by controlling copper in the joint Content to control the interface product between the solder joint and the contact, so that the nickel consumption rate in the nickel layer of the contact can be reduced. 2 The solder joint according to item 1 of the scope of patent application, wherein the solder joint also includes tin. 3. The solder joint according to item 2 of the scope of patent application, wherein the material of the solder joint also includes lead. 4. The solder joint according to item 2 of the scope of patent application, wherein the material of the solder joint also includes silver. 5 The solder joint according to item 2 of the scope of the patent application, wherein the interface generation system is a (Cu, Ni) 6Sn5 compound, and the interface generation system is a continuous form. 6 · The solder joint according to item 2 of the scope of the patent application, wherein the interface generation compound is a compound in the form of a mixture of (Cu, Ni) 6Sn5 and (Ni, Cu) 3Sn4. 7 · The solder joint described in item 2 of the scope of the patent application, wherein the contact further includes a copper layer and a gold layer, the nickel layer is located on the copper layer, and the gold layer is located on the nickel layer. , And the solder joint is located on the gold layer. 8 · Knowing points as described in item 7 of the Shenjing patent scope, wherein the interface product of 5H is a (C u, Au, Ni) 6 S η 5 compound, and the interface product is a continuous form . 9 · The zinc dot according to item 7 in the scope of the patent application, wherein the interface generation system is a mixed form of (Cu, Au, Ni) 6Sn5 and (Ni, Cu) 3Sn4 ^ 68twf.ptd Page 20 540276 VI. Patent Application Compounds. 10. The solder joint according to item 1 of the scope of patent application, wherein when the solder joint is formed on the contact, the solder joint containing copper is directly formed. 11. The solder joint according to item 1 of the scope of patent application, wherein the solder joint is formed by electroplating. 1 2. The solder joint according to item 1 of the scope of patent application, wherein the solder joint is formed by screen printing. 1 3. The solder joint according to item 1 of the scope of the patent application, wherein the solder joint is formed by planting solder balls. 1 4. The solder joint described in item 1 of the scope of patent application, wherein the method of adding copper to the solder joint is to join the solder joint with another joint, and the material of the other joint includes copper, so that The copper atoms of the other contact will diffuse into the solder joint. 1 5. The solder joint described in item 1 of the scope of patent application, wherein the method of adding copper to the solder joint is to add a copper layer between the solder joint and the contact, and the copper atoms of the copper layer will Diffusion into the solder joint. 1 6. The solder joint described in item 1 of the scope of patent application, wherein copper atoms are also added to the nickel layer to increase the copper content at the interface between the joint and the solder joint ° 1 7. The solder joint according to item 1, wherein the contact is arranged on a wafer. 1 8. The solder joint according to item 1 of the scope of patent application, wherein the contact is arranged on a substrate. 1 9. The solder joint described in item 1 of the scope of patent application, wherein the joint 9468twf.ptd Page 21 540276 It is arranged on a printed circuit board. 20. The solder joint according to item 丨 in the scope of patent application, wherein the thickness of the nickel layer is between 500 angstroms and 15 micrometers. 2 1 • The solder joint as described in item 1 of the scope of the patent application, in which one of the stone grate and the hungry is added to the recording layer. 22. The solder joint according to item 1 of the scope of the patent application, wherein the concentration of copper in the fresh spot is between 0.05 wt.% And 5 wt.%. 2 3 · —A solder joint is suitable for being disposed on a joint, the material of the joint includes at least tin and copper, and the joint includes at least a nickel layer, which is characterized by controlling copper in the joint. The content of the point to control an interface product between the solder joint and the contact, thereby reducing the rate of nickel consumption in the nickel layer of the contact, where the interface product includes at least (Cu, Ni) One of 6Sn5 compounds and (Cu, X, Ni) 6Sn5 compounds, and X includes at least one metal component. 24. The solder joint according to item 23 of the scope of patent application, wherein the material of the solder joint also includes lead. 25. The solder joint according to item 23 of the scope of patent application, wherein the material of the solder joint further includes silver. 2 6 · The solder joint according to item 23 of the scope of patent application, wherein the interface product is a continuous form. 2 7 · The solder joint described in item 23 of the scope of patent application, wherein the interface product is a compound in the form of a mixture of (Cu, Ni) 6Sn5 and (Ni, Cu) 3Sn4 and (Cu, X, Ni) 6Sn5 and (Ni, Cu) 3Sn4 are one of the compounds in a mixed form. 540276 6. The scope of patent application 2 8 · The solder joint described in item 23 of the scope of patent application, wherein the contact also includes a copper layer and a gold layer, the nickel layer is located on the copper layer, and the gold A layer is located on the nickel layer, and the solder joint is located on the gold layer. 29. The solder joint according to item 28 in the scope of the patent application, wherein the interface product is a (Cu, Au, Ni) 6Sn5 compound, and the interface product is a continuous form. 30. The recording site as described in item 28 of the scope of patent application, wherein the interface product is a compound in the form of a mixture of (Cu, Au, Ni) 6Sn5 and (Ni, Cu) 3Sn4. 31. The solder joint according to item 23 of the scope of patent application, wherein when the solder joint is formed on the contact, the solder joint containing copper is directly formed. 3 2 · The solder joint according to item 23 of the scope of patent application, wherein the solder joint is formed by electroplating. 3 3 · The solder joint described in item 23 of the scope of patent application, wherein the solder joint is formed by screen printing. 3 4 · The solder joint as described in item 23 of the scope of patent application, wherein the solder joint is formed by planting a solder ball. 3 5 · According to the solder joint described in Item 23 of the scope of the patent application, the method of adding copper to the solder joint is to join the solder joint with another joint, and the material of the other joint includes copper, So that the copper of the other contact will diffuse into the U-point. 0 6 6 The solder joint described in item 23 of the scope of patent application, wherein the method of adding copper to the solder joint is to connect the solder joint with the solder joint. A copper layer is also added between the contacts, and the copper atoms of the copper layer will diffuse into the solder joint. 9468twf.ptd Page 23 ^ 40276 Sixth, the scope of the patent application includes copper in the nickel layer 37. The solder joint described in the item “Scope of the patent application”: also adds steel atoms to increase the boundary between the contact and the solder joint ° less 3 8 · The solder joints described in item 23 of the scope of patent application are arranged on a wafer. Less 39 · The solder joints described in item 1 of the scope of patent application are arranged on a substrate. Less 40 · as applied The solder joint described in item 23 of the patent scope is arranged on a printed circuit board. 41. The solder joint described in item 23 of the patent scope of application has a thickness between 500 Angstroms and 15 micrometers. 4 2. According to the solder joints described in item 23 of the scope of patent application, phosphorus, cobalt, and vanadium are also added to the layer. 4 3 · The solder joints described in item 23 of the scope of patent application, copper ions The concentration is between 0.005 wt.% And 5 wt.%, Where the contact point is in the contact point, the contact point is in the contact layer, where the contact point is in the nickel, and the solder point is 4 4 The contact includes at least a gold layer, a copper layer and a nickel layer, wherein the copper layer is located between the gold layer and the nickel layer 4 5 The contact described in item 44 of the scope is formed on the wafer. 46 · The contact described in item 44 of the scope of the patent application is formed on the substrate. 4 7 · —A kind of contact, the contact includes at least one gold Layer, recording layer 'wherein the gold layer is located between the copper layer and the recording layer 48. The contact as described in item 47 of the scope of patent application, wherein the contact is a contact in which the contact is a copper layer and its middle contact system eM68twf.ptd Page 24 6. Scope of patent application Formed on wafer 4 9 · If formed on substrate 50 0.—Doped with copper source 51 · If formed on wafer 52. If formed on substrate 5 3 · —. For the contacts mentioned in item 47 of the scope of patent application, the Yin contacts are attached. A contact including at least a nickel layer, wherein the nickel layer. : Please refer to the contact described in item 50 of the patent scope, wherein the contact is the contact described in item 50 of the patent scope, and connected in the middle. The solder joints are made of at least tin, lead, and steel.