JP2009142890A - Laminated solder material, soldering method using the same, and solder junction - Google Patents

Laminated solder material, soldering method using the same, and solder junction Download PDF

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JP2009142890A
JP2009142890A JP2007326010A JP2007326010A JP2009142890A JP 2009142890 A JP2009142890 A JP 2009142890A JP 2007326010 A JP2007326010 A JP 2007326010A JP 2007326010 A JP2007326010 A JP 2007326010A JP 2009142890 A JP2009142890 A JP 2009142890A
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layer
solder
alloy
laminated
soldering
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JP4959539B2 (en
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Goro Ideta
Junichi Murai
Katsuaki Suganuma
吾朗 出田
淳一 村井
克昭 菅沼
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Mitsubishi Electric Corp
三菱電機株式会社
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Abstract

Provided are a solder material having high heat resistance in soldering with an easily oxidizable Zn-Sn solder alloy and capable of forming a joint with few defects, a soldering method using the solder material, and a solder joint portion using the solder material To do.
A multilayer solder material comprising an inner layer and a surface layer, wherein the inner layer is made of Zn alone or containing 50% by mass or more of Zn, and the balance is made of a Zn-based alloy consisting of Sn and inevitable impurities. Is characterized by being composed of Sn alone or 50% by mass or more of Sn and the balance being Sn based alloy composed of Zn and inevitable impurities.
[Selection] Figure 1

Description

  The present invention relates to a laminated solder material used for component mounting of a wiring board constituting an electronic device or the like, or a joining method of a semiconductor element and a base material, a soldering method using the solder material, and a solder joint portion thereby.

  The toxicity of Pb has become a problem due to contamination of groundwater, etc., and the movement to limit its use in electric and electronic products has been strengthened worldwide. Sn-Pb, which has been widely used for mounting components on wiring boards of electronic devices, has been used so far. The solder based on Sn-Ag and Sn-Zn is replaced with an Sn-based Pb-free alloy. Conventionally, the most frequently used Sn-Pb alloy is an alloy having a composition ratio of 63% by mass of Sn having the lowest melting point and Sn having a melting point of 37% by mass, or a composition ratio in the vicinity thereof (37% by mass). It is expressed as 63 mass% Sn-37 mass% Pb (following this), and its melting point was about 183 ° C., but a solder alloy generally used as Pb-free solder is Sn-Ag type About 220 ° C., Sn-Zn-based around 200 ° C., which has a higher melting point than conventional Pb-containing solder alloys.

  On the other hand, the connection inside the electronic component is made with a solder alloy having a higher melting point than the solder alloy for mounting on the substrate so that the solder connection inside the electronic component does not melt when mounted on the electronic circuit board. There must be. When the electronic component is mounted on the electronic circuit board, it is heated to a temperature of about 250 ° C. Therefore, the solder alloy used for the internal connection of the electronic component needs to have a melting point exceeding 250 ° C. The Sn—Pb-based alloy can change the melting point relatively large by adjusting the content ratio of Sn and Pb, and can obtain a high melting point by increasing the content ratio of Pb. In the case of a 5 mass% Sn-95 mass% Pb alloy, the melting point exceeds 300 ° C. For example, a 5% by mass Sn-95% by mass Pb alloy has been used for conventional electronic component internal connections. However, in order to prevent environmental contamination due to Pb, Pb-free alloys are also used for internal connection of electronic components. There is a social demand.

  Candidates of Pb-free alloys having a melting point of over 300 ° C., such as the 5% by mass Sn-95% by mass Pb alloy, are Au—Sn, Zn—Sn—Al—Mg, Sn— Alloys such as Sb-based, Bi-Sn-based, and Bi-Ag-based materials are conceivable, but all have hard and brittle mechanical characteristics compared to conventional Sn-Pb-based alloys, and Au-Sn based is extremely expensive. The problem is that Sb contained in the Sn—Sb system is highly toxic.

  On the other hand, a Zn—Sn alloy is considered as an alloy having relatively flexible mechanical properties and a liquidus temperature of 300 ° C. or higher. However, Zn is easily oxidized, and a once oxidized Zn oxide film is difficult to break down, and thus tends to hinder solderability. In order to solve this problem, an alloy in which 0.001% by mass to 1% by mass of P is added to a Zn—Sn alloy has been proposed (see Patent Document 1).

  On the other hand, in Patent Document 2 related to Sn—Zn-based, Sn—Zn—Bi-based solder and its surface treatment method and a mounted product using the same, and Patent Document 3 related to Sn—Zn-based lead-free solder alloy powder and its manufacturing method Has proposed a method for preventing oxidation of the Sn—Zn alloy by coating the surface of the Sn—Zn alloy powder with at least one of Au, Sn, Ni, Cu, Pd, and Ag.

  However, in the conventional Zn-Sn solder alloy having the above composition, when 0.001 mass% to 1 mass% of P is added, P is preferentially oxidized and the surface of the solder material is phosphorylated. Since the film covers the film, it is possible to suppress the oxidation of Zn and Sn to some extent and to improve the solderability to some extent, but it is difficult to completely prevent the oxidation of Zn, and bonding defects such as unbonded portions and voids are difficult. There was a problem that the occurrence of was inevitable.

In addition, in the case of Sn—Zn-based alloy powder whose surface is coated with Au, Sn or the like, since it is a powder, the specific surface area is large, and as a result, the amount of oxide on the alloy surface increases, so that bonding such as voids is caused. There is a problem that tends to cause defects. Furthermore, in the Sn—Zn alloy powder provided with the coating of Sn or the like proposed in Patent Document 3, the Zn concentration in the Sn—Zn alloy is as low as 10% by mass at the maximum, so the melting point is around 200 ° C. There is a problem that it cannot be used as a high heat-resistant solder.
JP 2005-52869 A JP-A-8-16496 JP 2003-19591 A

  The present invention has been made to solve the above problems, and can suppress the generation of an oxide film that significantly deteriorates the solderability, and can form a joint having no joint defect such as a void. The purpose is to provide materials. Moreover, it aims at obtaining the soldering method using this solder material, and a solder joint part.

  That is, the present invention is a laminated solder material comprising an inner layer and a surface layer, and the inner layer is composed of Zn alone or 50% by mass or more of Zn, and the balance is composed of a Zn-based alloy consisting of Sn and inevitable impurities, The surface layer relates to a multilayer solder material characterized in that Sn alone or 50% by mass or more of Sn is contained, and the balance is composed of an Sn-based alloy composed of Zn and inevitable impurities.

  The surface layer preferably has a thickness of 100 nm or more, and preferably has a thickness of 20 μm or less.

  Moreover, it is preferable that the said inner layer is the thickness from which the compounding ratio of Sn in the whole of an inner layer and a surface layer will be less than 50 mass%, and Sn composition ratio in a surface layer is uniform.

  The surface layer can be formed by any one of plating, vacuum deposition, and sputtering. The surface layer can also be formed by a cladding method.

  The present invention also relates to a soldering method using the above-described laminated solder material, the sandwiching step of sandwiching the laminated solder material between the materials to be joined, the heating step of heating the laminated solder material, the laminated solder material and the coated material. And a completion step of completing soldering by cooling the bonding material, and the heating step relates to a soldering method for heating to a temperature equal to or higher than the melting point of the metal or alloy constituting the inner layer or surface layer of the laminated solder material.

  As a soldering method using the above-mentioned laminated solder material, a sandwiching process for sandwiching the laminated solder material between the materials to be joined, a heating process for heating the laminated solder material, and cooling the laminated solder material and the material to be joined. A method of heating to a temperature equal to or higher than the melting point of the metal or alloy constituting the surface layer of the laminated solder material and lower than the melting point of the metal or alloy constituting the inner layer. Can also be adopted.

  In addition, as a soldering method using the above-described laminated solder material, the sandwiching step of sandwiching the laminated solder material between the materials to be joined, the heating step of heating the laminated solder material, and the heating of the laminated solder material and the material to be joined are performed. And completing the soldering by holding the heating temperature in the step of performing the heating, wherein the heating step is equal to or higher than the melting point of the metal or alloy constituting the surface layer of the laminated solder material and the metal constituting the inner layer. Or you may use the soldering method heated to below melting | fusing point of an alloy.

  Furthermore, the present invention relates to a solder joint portion joined by the soldering method as described above.

  According to the present invention, by providing a structure in which an inner layer having a specific composition is covered with a surface layer made of Sn or an Sn-based alloy, a multilayer solder material capable of suppressing the generation of an oxide film that significantly deteriorates solderability is provided. It becomes possible to do.

  In addition, according to the present invention, it is possible to provide a soldering method capable of forming a high heat-resistant solder joint having no joint defects such as holes.

<Laminated solder material>
The laminated solder material in the present invention is a laminated solder material comprising an inner layer and a surface layer, the inner layer is composed of Zn alone or 50% by mass or more of Zn, and the balance is composed of a Zn-based alloy consisting of Sn and inevitable impurities, The surface layer is composed of Sn alone or an Sn-based alloy containing 50% by mass or more of Sn and the balance of Zn and inevitable impurities. The shape of the laminated solder material is not particularly limited as long as it has a laminated structure, but in order to obtain a solder material having high heat resistance, for example, a structure in which a surface layer is laminated on a plate-like body constituting an inner layer is used. It is preferable to have.

  Here, Cu frequently used as an electrode material (material to be bonded) and Zn widely used as a solder material are extremely easy to react, and the formed Cu—Zn intermetallic compound has a characteristic of being easily grown. And since this Cu-Zn intermetallic compound generally has weak mechanical characteristics, it is not preferable as a solder material that such a compound grows. In the present invention, since it has the above-mentioned specific laminated structure in which a surface layer made of Sn or Sn-based alloy is formed, it is Sn or Sn-based alloy that directly reacts with Cu as a material to be joined. The formed intermetallic compound is also a Cu-Sn alloy. On the other hand, since the Cu—Zn intermetallic compound is not formed, the layer of the compound does not grow, and the mechanical properties of the solder joint can be improved.

<Inner layer>
The inner layer is composed of a Zn-based alloy containing Zn alone or 50% by mass or more of Zn, with the balance being Sn and inevitable impurities. By setting the composition of the metal or alloy constituting the inner layer to the above specific one, high heat resistance can be imparted to the entire laminated solder material.

  When the inner layer is made of a Zn-based alloy, the content of Zn may be 50% by mass or more, more preferably in the range of 60 to 90% by mass, and in the range of 70 to 80% by mass. More preferably it is. By making Zn content into the said range, heat resistance can be improved more and the thermal damage with respect to a semiconductor can be suppressed, It is preferable.

  The inner layer is made of a Zn-based alloy composed of Sn and inevitable impurities, but the other inner layers appropriately contain other compositions as long as they do not affect the effects of the present invention even if they are blended with other compositions.

  As such an inner layer, a commercially available Zn plate having a desired thickness may be used, or a Zn—Sn alloy may be used.

<Surface layer>
The surface layer is composed of Sn alone or an Sn-based alloy containing 50 mass% or more of Sn, with the balance being Zn and inevitable impurities. By configuring the surface layer with Sn alone or with an Sn-based alloy, most of the outermost surface of the solder material is composed of Sn. In this case, the surface oxide layer becomes a Sn oxide film. This Sn oxide film can be easily removed by a rosin-based flux that is generally used in soldering, and can suppress deterioration of the laminated solder material in the air, and at the same time adversely affect the soldering characteristics. Will not affect.

  In the present invention, the surface layer is provided on at least one surface of the inner layer, and preferably the surface layer is provided on the entire surface in contact with the material to be joined.

  When the surface layer is an Sn-based alloy, examples of metals other than Sn to be blended include Zn, Ag, Cu, Ni, Ge, Bi, and Sb.

  The surface layer preferably has a thickness of 10 nm or more, and more preferably 100 nm or more. By setting the thickness of the surface layer to 10 nm or more, the oxide film formed on the outermost surface can be made only of Sn oxide. However, when the solder material is heated in the atmosphere, it is formed from the internal Zn or Zn-based alloy. Since Zn diffuses from the inner layer to the surface and Zn oxide tends to be formed on the outermost surface, in order to prevent such diffusion as much as possible, the thickness of the surface layer is more preferably 100 nm or more. Further, the thickness of the surface layer is preferably 20 μm or less, and more preferably 10 μm or less in consideration of the effect of improving heat resistance. By forming the thickness of the surface layer in such a thickness range, it is possible to efficiently suppress the oxidation of Zn constituting the inner layer, or in the soldering, the removal efficiency of the surface oxide film by the rosin flux is good. Can be.

  When the surface layer has such a thickness range, the thickness of the inner layer is such that the total content of the inner layer and the surface layer, that is, the Sn compounding ratio in the entire laminated solder material is less than 50% by mass. It is preferable that the thickness is less than 30% by mass. By satisfying such a relationship between the thickness of the inner layer and the Sn mixing ratio of the surface layer, the laminated solder material can have a high heat resistance or can be a solder material excellent in soldering characteristics.

  In addition, in the solder material, the heat resistance of the entire bonding material is determined at the part having the lowest melting point. Therefore, even if the part has a high Sn concentration, the heat resistance of the entire bonding part is improved. I can't. Therefore, it is preferable to diffuse Sn, which is a low melting point element, throughout the solder material forming the joint, that is, it is preferable that the Sn composition in the surface layer is uniform.

<Method for forming surface layer>
In the present invention, the surface layer can be formed by any one of plating, vacuum deposition and sputtering. The surface layer can also be formed by a cladding method. When the surface layer is formed by any one of plating, vacuum deposition and sputtering, the thickness and composition of the obtained surface layer can be formed uniformly, and when the surface layer is formed by the cladding method, it is high. We can expect mass productivity.

<Soldering method>
The first method of the soldering method in the present invention is to sandwich the laminated solder material between the materials to be joined, to heat the laminated solder material, and to cool the laminated solder material and the material to be joined. The above-mentioned heating step is a soldering method in which heating is performed at a temperature equal to or higher than the melting point of the metal or alloy constituting the inner layer or surface layer of the laminated solder material. By applying the heating step in such a temperature range, the surface layer and the inner layer of the laminated solder material can all be melted and mixed to form a uniform joining layer. The conditions for cooling the laminated solder material and the material to be joined after the heating step are not particularly limited.

  In addition, the second method of the soldering method according to the present invention includes a sandwiching step of sandwiching the laminated solder material between the joined materials, a heating step of heating the laminated solder material, and cooling the laminated solder material and the joined material. The heating step is performed at a temperature equal to or higher than the melting point of the metal or alloy constituting the surface layer of the laminated solder material and lower than the melting point of the metal or alloy constituting the inner layer. This is the soldering method. By controlling the temperature condition of the heating step to be equal to or lower than the melting point of the metal or alloy constituting the inner layer, the thickness control of the bonding layer can be facilitated.

  As a third method of the soldering method according to the present invention, the sandwiching step of sandwiching the laminated solder material between the materials to be joined, the heating step of heating the laminated solder material, and the heating of the laminated solder material and the material to be joined are performed. And completing the soldering by holding the heating temperature in the step of performing the heating, wherein the heating step is equal to or higher than the melting point of the metal or alloy constituting the surface layer of the laminated solder material and the metal constituting the inner layer. Or it is the soldering method of heating below the melting point of an alloy. By setting the conditions in the heating step to be equal to or higher than the melting point of the metal or alloy constituting the surface layer of the laminated solder material, only the surface layer is melted and metallicly joined to the material to be joined. In the third method, the completion of soldering is performed by maintaining the heating temperature in the heating process. The metal element in the surface layer and the metal element in the inner layer diffuse to each other, and the melting point gradually rises as the constituent elements in the surface layer change, and as a result, it is solidified while being held at a constant temperature and soldered. To complete.

  These soldering methods can be appropriately selected and applied depending on the composition of the metal or alloy constituting the inner layer and the surface layer of the laminated solder material, and in any case, there is no generation of voids and the desired solder material. The joining with the material to be joined can be made strong.

<Solder joint>
The present invention also relates to a solder joint part joined by the soldering method using the laminated solder material as described above. The solder joint portion of the present invention uses the specific laminated solder material having the above high heat resistance, and can be firmly joined to a material to be joined that requires high-temperature joining. Moreover, by joining by the said soldering method, the firm solder junction part which does not generate | occur | produce a void | hole can be formed.

  Hereinafter, the present invention will be described in more detail with reference to embodiments, but the present invention is not limited thereto.

<Embodiment 1>
FIG. 1 is a cross-sectional view showing a laminated solder material according to Embodiment 1 of the present invention. The laminated solder material in FIG. 1 includes an inner layer 1 made of a Zn-based alloy and a surface layer 2 made of a Sn-based alloy. As the inner layer, for example, a Zn plate having a thickness of 0.1 mm can be used. As the surface layer, for example, an Sn film formed by vacuum vapor deposition is used. In the laminated solder material configured as described above, Zn does not exist on the outermost surface, and only Sn exists, and therefore, the oxide film formed by reacting with oxygen in the atmosphere is only SnO or Sn 2 O. There is no Zn oxide. Therefore, when this laminated solder material is used to join, for example, a semiconductor element and a material to be joined such as a lead frame, an oxide film on the surface of the laminated solder material can be easily formed by using a rosin flux used in general solder joining. Since it can be removed and a large amount of gas is not generated as in the case of removing Zn oxide, there is no occurrence of bonding defects such as voids and unbonded.

  If the thickness of the surface layer 2 made of Sn or an Sn-based alloy is 10 nm or more, the outermost oxide film is composed only of Sn oxide, but when heated in the atmosphere, the inner Zn layer 1 Since Zn diffuses on the surface and Zn oxide tends to be formed on the outermost surface, the thickness of the Sn layer 2 is desirably 100 nm or more.

  Here, the case where the inner layer is a Zn plate and the surface solder layer disposed on both surfaces is a laminated solder material composed of Sn has been described. However, even if the metal plate constituting the inner layer is a Zn—Sn alloy, Sn is not present. The same effect can be obtained if it is 50% or less. Further, as a method for forming the surface treatment film, for example, there is vacuum deposition, but the same effect can be obtained even if it is constituted by a method such as plating, sputtering, or clad method. Furthermore, although the case where the semiconductor chip and the lead frame are used as the materials to be bonded has been described, the present invention is not limited to this, and it goes without saying that the same effect can be obtained if the materials to be bonded are soldered.

<Embodiment 2>
FIG. 2 is a block diagram showing a soldering method using a laminated solder material according to Embodiment 2 of the present invention. The multilayer solder material of FIG. 2 includes materials to be bonded 3 and 4 that have been surface-treated to be wetted with solder, and the material to be bonded is, for example, a semiconductor chip and a lead frame as a base material. The laminated solder material in FIG. 2 has the same configuration as that of the first embodiment, that is, an inner layer 1 made of a Zn-based alloy and a surface layer 2 made of a Sn-based alloy. When the laminated solder material having this laminated structure is heated, the inner layer 1 made of Zn or Zn-based alloy as the inner layer and the surface layer 2 made of Sn or Sn-based alloy as the surface layer are melted and diffused, and the inner layer and the surface layer are uniformly mixed. Thus, a homogeneous Zn—Sn alloy layer 5 is formed.

  As a soldering method for obtaining the homogeneous alloy layer, first, there is a sandwiching step in which a laminated solder material composed of the inner layer 1 and the surface layer 2 is sandwiched between the materials 3 and 4 to be joined, and then Zn which is the inner layer Alternatively, when the heating step of heating to 420 ° C. or higher which is the melting point of the layer 2 made of the Zn-based alloy is performed, the entire laminated solder material is melted including the layer 2 made of Sn or Sn-based alloy having the melting point of 230 ° C. The layer 2 made of Zn or Zn-based alloy and the layer 2 made of Sn or Sn-based alloy are uniformly mixed to form a new alloy layer 5 made of a single-layer Zn—Sn alloy. Next, the soldering is completed by cooling the laminated solder material and the material to be joined.

  Here, the case where the inner layer is a Zn plate and the surface layer disposed on both sides thereof is a laminated solder material composed of Sn has been described, but the inner layer metal plate is a Zn-Sn alloy and Sn is 50% or less. If so, the same effect can be obtained. Furthermore, although the case where the semiconductor chip and the lead frame are used as the materials to be bonded has been described, the present invention is not limited to this, and it goes without saying that the same effect can be obtained if the materials to be bonded are soldered.

<Embodiment 3>
FIG. 3 is a configuration diagram illustrating a soldering method using a laminated solder material according to Embodiment 3 of the present invention. The laminated solder material of FIG. 3 includes an inner layer 1 made of Zn or a Zn-based alloy and a surface layer 2 applied to the surface thereof. The surface layer may be a layer made of Sn having a thickness of 1 μm, for example. When the laminated solder material having such a structure is heated and soldered, the Zn—Sn alloy layer 7 is formed. In Embodiment 3, the other components are the same as those in Embodiment 2.

  As the soldering method, a laminated solder material composed of the inner layer 1 and the surface layer 6 is sandwiched between the materials to be joined 3 and 4, and heated to 230 ° C. or higher, which is the melting point of the surface layer 6 made of Sn, for example, 250 ° C. Then, the surface layer 6 made of Sn is melted, and further, the vicinity of the interface between the inner layer 1 made of Zn which is the inner layer and the surface layer 6 made of Sn is also melted by the eutectic reaction with the surface layer 6 made of Sn. The Zn concentration in the layer 6 made of Sn increases, and the melting point of the surface layer 6 rises. The surface layer 6 solidifies without cooling and the bonding is completed. That is, the surface layer 6 that was pure Sn before heating is changed to a Zn—Sn alloy after heating, and its melting point rises to the heated temperature.

  Here, although the case where it heated to 250 degreeC was described, it becomes possible to raise the heat resistance of the junction part formed by raising this temperature, for example, it heats to 300 degreeC and solidifies as it is. And a junction having a melting point of 300 ° C. is formed. Moreover, although the case where the thickness of the surface layer 6 made of Sn is 1 μm has been described, the Zn concentration tends to increase as the thickness becomes thinner, so the time until solidification can be shortened.

  Further, in the present embodiment, the case where the inner layer is a Zn plate and the surface layer arranged on both surfaces is made of Sn is described as a laminated solder material. However, even if the inner layer metal plate is a Zn-Sn alloy, Sn is used. If the ratio is 50% or less, the same effect can be obtained. Furthermore, although the case where the semiconductor chip and the lead frame are used as the materials to be bonded has been described, the present invention is not limited to this, and it goes without saying that the same effect can be obtained if the materials to be bonded are soldered.

<Embodiment 4>
FIG. 4 is a block diagram showing a soldering method using a laminated solder material according to Embodiment 4 of the present invention. The laminated solder material in FIG. 4 has the same configuration as in the third embodiment, and the Zn—Sn alloy layer 8 is formed by heating during soldering.

  As the soldering method, a laminated solder material composed of the inner layer 1 and the surface layer 6 is sandwiched between the materials to be joined 3 and 4, and heated to, for example, 250 ° C. at 230 ° C. or higher which is the melting point of the surface layer 6 made of Sn. The surface layer 6 made of Sn is melted, and the vicinity of the interface between the inner layer 1 made of Zn and the surface layer 6 made of Sn is melted by the eutectic reaction with the surface layer 6 made of Sn, and the surface layer 6 made of Sn. The Zn concentration in the medium increases, the melting point of the surface layer 6 increases, and the surface layer 6 solidifies without cooling. If it is kept at 250 ° C. without cooling as it is, the diffusion of Sn atoms into the inner layer 1 made of Zn further proceeds, the thickness of the Zn—Sn alloy layer 8 increases, and the Sn concentration in the alloy layer further increases. The melting point rises and the heating temperature rises to 250 ° C. or higher. Eventually, a uniform Zn—Sn alloy is formed over the entire layer, and the melting point reaches 400 ° C. or higher.

  Here, although the case where it heated at 250 degreeC was described, by raising this temperature, the spreading | diffusion of Sn can be accelerated | stimulated and a uniform alloy layer can be formed at an early stage.

  Here, the case where the inner layer is a Zn plate and the surface layer disposed on both sides thereof is a laminated solder material composed of Sn has been described, but the inner layer metal plate is a Zn-Sn alloy and Sn is 50% or less. If so, the same effect can be obtained. Furthermore, although the case where the semiconductor chip and the lead frame are used as the materials to be bonded has been described, the present invention is not limited to this, and it goes without saying that the same effect can be obtained if the materials to be bonded are soldered.

  As described above, the embodiments of the present invention have been described, but it is also planned from the beginning to appropriately combine the configurations of the above-described embodiments.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is sectional drawing which shows the laminated solder material by Embodiment 1 of this invention. It is a block diagram which shows the soldering method using the laminated solder material by Embodiment 2 of this invention. It is a block diagram which shows the soldering method using the laminated solder material by Embodiment 3 of this invention. It is a block diagram which shows the soldering method using the laminated solder material by Embodiment 4 of this invention.

Explanation of symbols

  1 Zn plate, 2, 6 surface layer, 3, 4 material to be joined, 5, 7, 8 Zn-Sn alloy layer.

Claims (10)

  1. A laminated solder material comprising an inner layer and a surface layer,
    The inner layer includes Zn alone or 50% by mass or more of Zn, and the balance is composed of a Zn-based alloy consisting of Sn and inevitable impurities,
    The surface layer is a multilayer solder material composed of Sn alone or a Sn-based alloy containing 50 mass% or more of Sn, the balance being Zn and inevitable impurities.
  2.   The multilayer solder material according to claim 1, wherein the surface layer has a thickness of 100 nm or more.
  3.   The multilayer solder material according to claim 1, wherein the surface layer has a thickness of 20 μm or less.
  4.   The thickness of the inner layer is such that Sn in the entire inner layer and the surface layer is less than 50% by mass, and the Sn composition ratio in the surface layer is uniform. The laminated solder material described.
  5.   The multilayer solder material according to claim 1, wherein the surface layer is a layer formed by any one of plating, vacuum deposition, and sputtering.
  6.   The multilayer solder material according to claim 1, wherein the surface layer is a layer formed by a clad method.
  7. A soldering method using the laminated solder material according to claim 1,
    A sandwiching step of sandwiching the laminated solder material between the materials to be joined;
    A heating step of heating the laminated solder material;
    Completing the soldering by cooling the laminated solder material and the material to be joined,
    The heating step is a soldering method in which heating is performed at a temperature equal to or higher than the melting point of the metal or alloy constituting the inner layer or surface layer of the laminated solder material.
  8. A soldering method using the laminated solder material according to claim 1,
    A sandwiching step of sandwiching the laminated solder material between the materials to be joined;
    A heating step of heating the laminated solder material;
    Completing the soldering by cooling the laminated solder material and the material to be joined,
    The heating step is a soldering method in which heating is performed at a temperature equal to or higher than a melting point of a metal or alloy constituting the surface layer of the laminated solder material and lower than a melting point of the metal or alloy constituting the inner layer.
  9. A soldering method using the laminated solder material according to claim 1,
    A sandwiching step of sandwiching the laminated solder material between the materials to be joined;
    A heating step of heating the laminated solder material;
    Completing the soldering by maintaining the heating temperature in the step of heating the laminated solder material and the material to be joined, and
    The heating step is a soldering method in which heating is performed at a temperature equal to or higher than a melting point of a metal or alloy constituting the surface layer of the laminated solder material and lower than a melting point of the metal or alloy constituting the inner layer.
  10.   The solder joint part joined by the soldering method in any one of Claims 7-9.
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