JPS62160538U - - Google Patents
Info
- Publication number
- JPS62160538U JPS62160538U JP4884286U JP4884286U JPS62160538U JP S62160538 U JPS62160538 U JP S62160538U JP 4884286 U JP4884286 U JP 4884286U JP 4884286 U JP4884286 U JP 4884286U JP S62160538 U JPS62160538 U JP S62160538U
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- plate
- metal
- semiconductor device
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Electrodes Of Semiconductors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Thyristors (AREA)
- Die Bonding (AREA)
Description
第１図はこの考案の実施例の見取図、第２図は
第１図におけるＡ―Ａ線に沿う厚味を拡大した断
面図、第３図は従来の半導体装置の正面図及び側
面図である。 １７……半導体ウエハ、１８……第１電極板、
１９……ゲート電極、２０……第２電極板、２１
〜２３……高温ハンダ層、２４〜２６……メツキ
層。
第１図におけるＡ―Ａ線に沿う厚味を拡大した断
面図、第３図は従来の半導体装置の正面図及び側
面図である。 １７……半導体ウエハ、１８……第１電極板、
１９……ゲート電極、２０……第２電極板、２１
〜２３……高温ハンダ層、２４〜２６……メツキ
層。
Claims (1)
- 所要の導電形式構造を有する半導体ウエハの両
面に、各々金属板からなる第１電極板と第２電極
板とゲート電極板を高温半田により取付け、これ
ら各電極板の外表面には半田付けし易い金属をメ
ツキしてなるチツプ型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4884286U JPS62160538U (ja) | 1986-03-31 | 1986-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4884286U JPS62160538U (ja) | 1986-03-31 | 1986-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62160538U true JPS62160538U (ja) | 1987-10-13 |
Family
ID=30870751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4884286U Pending JPS62160538U (ja) | 1986-03-31 | 1986-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62160538U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51135465A (en) * | 1975-05-20 | 1976-11-24 | Mitsubishi Electric Corp | Semi-conductor unit |
-
1986
- 1986-03-31 JP JP4884286U patent/JPS62160538U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51135465A (en) * | 1975-05-20 | 1976-11-24 | Mitsubishi Electric Corp | Semi-conductor unit |
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