JPS6322073U - - Google Patents
Info
- Publication number
- JPS6322073U JPS6322073U JP1986114552U JP11455286U JPS6322073U JP S6322073 U JPS6322073 U JP S6322073U JP 1986114552 U JP1986114552 U JP 1986114552U JP 11455286 U JP11455286 U JP 11455286U JP S6322073 U JPS6322073 U JP S6322073U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- circuit wiring
- low
- fired ceramic
- temperature fired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第1図は本考案の1実施例の斜視図、第2図は
第1図A―A線截断面図である。 1……低温焼成セラミツク回路基板、2……銅
電極、3……リード端子、3A……銅又はニツケ
ル被膜、4……銀ろう。
第1図A―A線截断面図である。 1……低温焼成セラミツク回路基板、2……銅
電極、3……リード端子、3A……銅又はニツケ
ル被膜、4……銀ろう。
Claims (1)
- 低温焼成セラミツク回路配線基板の主面に配設
されたろう付け性の良い材料から成る電極に、該
回路配線基板とほぼ同じ熱膨脹係数を有するリー
ド端子を銀ろうで接続してなるものにおいて、該
リード端子の表面をろう付け性の良い材料の層で
覆つたことを特徴とする低温焼成セラミツク回路
配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986114552U JPS6322073U (ja) | 1986-07-28 | 1986-07-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986114552U JPS6322073U (ja) | 1986-07-28 | 1986-07-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6322073U true JPS6322073U (ja) | 1988-02-13 |
Family
ID=30997396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986114552U Pending JPS6322073U (ja) | 1986-07-28 | 1986-07-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6322073U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06400U (ja) * | 1992-06-11 | 1994-01-11 | 株式会社トーカイ | 布類の掴み取り装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5427980A (en) * | 1977-08-01 | 1979-03-02 | Nec Corp | Terminal |
-
1986
- 1986-07-28 JP JP1986114552U patent/JPS6322073U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5427980A (en) * | 1977-08-01 | 1979-03-02 | Nec Corp | Terminal |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06400U (ja) * | 1992-06-11 | 1994-01-11 | 株式会社トーカイ | 布類の掴み取り装置 |