JPS6216009B2 - - Google Patents
Info
- Publication number
- JPS6216009B2 JPS6216009B2 JP15259480A JP15259480A JPS6216009B2 JP S6216009 B2 JPS6216009 B2 JP S6216009B2 JP 15259480 A JP15259480 A JP 15259480A JP 15259480 A JP15259480 A JP 15259480A JP S6216009 B2 JPS6216009 B2 JP S6216009B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- integrated circuit
- wafer
- pad
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 13
- 239000011159 matrix material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/316—Testing of analog circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15259480A JPS5776854A (en) | 1980-10-30 | 1980-10-30 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15259480A JPS5776854A (en) | 1980-10-30 | 1980-10-30 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5776854A JPS5776854A (en) | 1982-05-14 |
| JPS6216009B2 true JPS6216009B2 (enExample) | 1987-04-10 |
Family
ID=15543842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15259480A Granted JPS5776854A (en) | 1980-10-30 | 1980-10-30 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5776854A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5996833U (ja) * | 1982-12-20 | 1984-06-30 | クラリオン株式会社 | 半導体装置 |
| JPS59115642U (ja) * | 1983-01-26 | 1984-08-04 | 日本電気アイシ−マイコンシステム株式会社 | 半導体ウエフア |
| JPS59159948U (ja) * | 1983-04-12 | 1984-10-26 | 日本電気株式会社 | 集積回路装置 |
| JPS59215717A (ja) * | 1983-05-24 | 1984-12-05 | Nec Corp | 半導体集積回路装置の製造方法 |
| JPH07120696B2 (ja) * | 1986-02-26 | 1995-12-20 | 富士通株式会社 | 半導体装置の製造方法 |
| JPH03273502A (ja) * | 1990-03-23 | 1991-12-04 | Matsushita Electric Ind Co Ltd | 回転ヘッド装置 |
-
1980
- 1980-10-30 JP JP15259480A patent/JPS5776854A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5776854A (en) | 1982-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1139898A5 (enExample) | ||
| US4225878A (en) | Integrated circuit on chip trimming | |
| JPS6216009B2 (enExample) | ||
| US2468625A (en) | Electrical bridge circuit for testing the value of a resistor | |
| US3692987A (en) | Methods and apparatus for allocating the measured noise and resistance of a thin-film resistor between the resistor proper and the contact pads therefor | |
| US6320399B1 (en) | Measuring method for detecting a short-circuit between the turns of a coil integrated on a chip, and integrated circuit structure adapted to such a measuring method | |
| JPS6230971A (ja) | 半導体集積回路装置 | |
| JP2890682B2 (ja) | 半導体装置 | |
| US731209A (en) | Resistance set. | |
| JPH01298737A (ja) | 半導体装置 | |
| JPS60192344A (ja) | 半導体装置のウエハ−検査方法 | |
| JPH06216208A (ja) | 集積回路のコンタクト抵抗測定器 | |
| JPH04324951A (ja) | 半導体装置 | |
| JPH0421106Y2 (enExample) | ||
| JP3038936B2 (ja) | マトリックス型配線基板 | |
| JPH0743667Y2 (ja) | インサーキットテスタ用アナログマルチプレクサ | |
| JPH05175430A (ja) | 半導体集積回路 | |
| JPS6376414A (ja) | 半導体集積回路装置 | |
| JPH0538887U (ja) | 半導体デバイスの信頼性評価用テストパターン | |
| JPH05218207A (ja) | 半導体装置 | |
| JPH0827307B2 (ja) | プリント配線板の試験装置 | |
| JPH05264633A (ja) | 試験ボード配線導通試験回路 | |
| JPH0152030B2 (enExample) | ||
| JPH03185744A (ja) | 半導体素子 | |
| JPH03203365A (ja) | 半導体集積回路 |