JPS6215991Y2 - - Google Patents

Info

Publication number
JPS6215991Y2
JPS6215991Y2 JP1977120058U JP12005877U JPS6215991Y2 JP S6215991 Y2 JPS6215991 Y2 JP S6215991Y2 JP 1977120058 U JP1977120058 U JP 1977120058U JP 12005877 U JP12005877 U JP 12005877U JP S6215991 Y2 JPS6215991 Y2 JP S6215991Y2
Authority
JP
Japan
Prior art keywords
heating
plate
reflow
heat
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977120058U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5446055U (pl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977120058U priority Critical patent/JPS6215991Y2/ja
Publication of JPS5446055U publication Critical patent/JPS5446055U/ja
Application granted granted Critical
Publication of JPS6215991Y2 publication Critical patent/JPS6215991Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Surface Heating Bodies (AREA)
  • Control Of Resistance Heating (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1977120058U 1977-09-06 1977-09-06 Expired JPS6215991Y2 (pl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977120058U JPS6215991Y2 (pl) 1977-09-06 1977-09-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977120058U JPS6215991Y2 (pl) 1977-09-06 1977-09-06

Publications (2)

Publication Number Publication Date
JPS5446055U JPS5446055U (pl) 1979-03-30
JPS6215991Y2 true JPS6215991Y2 (pl) 1987-04-22

Family

ID=29075898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977120058U Expired JPS6215991Y2 (pl) 1977-09-06 1977-09-06

Country Status (1)

Country Link
JP (1) JPS6215991Y2 (pl)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936747A (pl) * 1972-08-09 1974-04-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936747A (pl) * 1972-08-09 1974-04-05

Also Published As

Publication number Publication date
JPS5446055U (pl) 1979-03-30

Similar Documents

Publication Publication Date Title
IT1114116B (it) Struttura circuitale raffreddata mediante conduzione e processo per la sua fabbricazione
JPH0277143A (ja) 半導体装置およびその製造方法
EP0998175A1 (en) Method for soldering Dpak-type electronic components to circuit boards
JPS6215991Y2 (pl)
JPS60260192A (ja) 混成集積回路の製造方法
JPH08236918A (ja) 電子部品の実装方法
JP2583142B2 (ja) 熱電モジュールの製造方法
JPH0677631A (ja) チップ部品のアルミ基板への実装方法
JP2570626B2 (ja) 基板の接続構造及びその接続方法
JPH022024A (ja) サーマルヘッド
JPS61141199A (ja) チツプ部品の実装方法
JP2505479B2 (ja) 半導体装置
JP2005072369A (ja) 半導体装置の製造方法
US7824111B2 (en) Optical module
JP2004281646A (ja) 電子部品の固着方法および固着装置
JPS5946416B2 (ja) 電極リ−ドの形成方法
JPH06196851A (ja) 回路基板に金属部材を取り付けるはんだ付け方法
JPH04273155A (ja) パワー用混成集積回路の製造方法
JPS59205731A (ja) 半導体装置の製造方法
SU927458A1 (ru) Способ пайки полупроводниковых пластин с коммутационными шинами
JPS59198726A (ja) Mic装置の製造方法
JPS61117854A (ja) 混成集積回路
JPH01281760A (ja) 半導体装置
TW202401730A (zh) 覆晶接合方法
JPS6216040B2 (pl)