JPS62158905A - コ−クス炉に於ける排ガス再循環切換燃焼方法 - Google Patents
コ−クス炉に於ける排ガス再循環切換燃焼方法Info
- Publication number
- JPS62158905A JPS62158905A JP60299399A JP29939985A JPS62158905A JP S62158905 A JPS62158905 A JP S62158905A JP 60299399 A JP60299399 A JP 60299399A JP 29939985 A JP29939985 A JP 29939985A JP S62158905 A JPS62158905 A JP S62158905A
- Authority
- JP
- Japan
- Prior art keywords
- combustion
- gas
- fuel gas
- exhaust gas
- supplying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Air Supply (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60299399A JPS62158905A (ja) | 1985-12-28 | 1985-12-28 | コ−クス炉に於ける排ガス再循環切換燃焼方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60299399A JPS62158905A (ja) | 1985-12-28 | 1985-12-28 | コ−クス炉に於ける排ガス再循環切換燃焼方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62158905A true JPS62158905A (ja) | 1987-07-14 |
| JPH0332681B2 JPH0332681B2 (https=) | 1991-05-14 |
Family
ID=17872050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60299399A Granted JPS62158905A (ja) | 1985-12-28 | 1985-12-28 | コ−クス炉に於ける排ガス再循環切換燃焼方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62158905A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5071785A (en) * | 1989-07-25 | 1991-12-10 | Shin-Etsu Handotai Co., Ltd. | Method for preparing a substrate for forming semiconductor devices by bonding warped wafers |
| US5129827A (en) * | 1989-08-28 | 1992-07-14 | Kabushiki Kaisha Toshiba | Method for bonding semiconductor substrates |
| US5273553A (en) * | 1989-08-28 | 1993-12-28 | Kabushiki Kaisha Toshiba | Apparatus for bonding semiconductor substrates |
-
1985
- 1985-12-28 JP JP60299399A patent/JPS62158905A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5071785A (en) * | 1989-07-25 | 1991-12-10 | Shin-Etsu Handotai Co., Ltd. | Method for preparing a substrate for forming semiconductor devices by bonding warped wafers |
| US5129827A (en) * | 1989-08-28 | 1992-07-14 | Kabushiki Kaisha Toshiba | Method for bonding semiconductor substrates |
| US5273553A (en) * | 1989-08-28 | 1993-12-28 | Kabushiki Kaisha Toshiba | Apparatus for bonding semiconductor substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0332681B2 (https=) | 1991-05-14 |
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