JPS62154970U - - Google Patents
Info
- Publication number
- JPS62154970U JPS62154970U JP4382286U JP4382286U JPS62154970U JP S62154970 U JPS62154970 U JP S62154970U JP 4382286 U JP4382286 U JP 4382286U JP 4382286 U JP4382286 U JP 4382286U JP S62154970 U JPS62154970 U JP S62154970U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- external connection
- opening
- base
- storing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第1図a,b,cはこの考案の一実施例のIC
モジユールを示しaは正視図、bはaのA−A線
に沿つた断面図、cはaのB−B線に沿つた断面
図、第2図は同実施例のICモジユールの組立て
状態を説明するための正視図、第3図は同実施例
のICモジユールの組立て状態を説明するための
工程図、第4図は同ICモジユールの回路構成を
示すブロツク図、第5図は同ICモジユールを組
込んだICカードを示す斜視図、第6図は同IC
モジユールを組込んだICカードの分解斜視図、
第7図は同ICモジユールを組込んだICカード
の断面図である。
1……フレキシブルフイルム、1a……ICチ
ツプ収納用開口、2……外部接続用コンタクト、
3……ICチツプ、4……リード線、4a……突
出部、5……絶縁層。
Figure 1 a, b, and c are ICs of one embodiment of this invention.
Figure 2 shows the assembled state of the IC module of the same example. 3 is a process diagram for explaining the assembled state of the IC module of the same example, FIG. 4 is a block diagram showing the circuit configuration of the IC module, and FIG. 5 is a diagram of the same IC module. Fig. 6 is a perspective view showing an IC card incorporating the IC card.
An exploded perspective view of an IC card incorporating a module;
FIG. 7 is a sectional view of an IC card incorporating the same IC module. 1...Flexible film, 1a...Opening for IC chip storage, 2...Contact for external connection,
3...IC chip, 4...Lead wire, 4a...Protrusion, 5...Insulating layer.
Claims (1)
スと、上記ベースに形成された複数の外部接続用
コンタクトと、これら外部接続用コンタクトより
上記ICチツプ収納用開口にかけて形成される導
電リード線と、上記ICチツプ収納用開口に収納
されるとともにその外部接続端子が対応するリー
ド線に接合されたICチツプと、上記ICチツプ
とリード線との接合部を保護するように上記コン
タクトを除く上記ベース全面に形成された絶縁層
とを具備したことを特徴とするICモジユール。 a sheet-like base formed with an opening for storing an IC chip; a plurality of external connection contacts formed on the base; a conductive lead wire formed from these external connection contacts to the opening for storing the IC chip; An IC chip that is housed in the chip storage opening and has its external connection terminals bonded to corresponding lead wires, and is formed on the entire surface of the base except for the contacts so as to protect the joints between the IC chip and the lead wires. An IC module characterized by comprising an insulating layer made of
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4382286U JPS62154970U (en) | 1986-03-25 | 1986-03-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4382286U JPS62154970U (en) | 1986-03-25 | 1986-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62154970U true JPS62154970U (en) | 1987-10-01 |
Family
ID=30861046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4382286U Pending JPS62154970U (en) | 1986-03-25 | 1986-03-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62154970U (en) |
-
1986
- 1986-03-25 JP JP4382286U patent/JPS62154970U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5936249U (en) | Flat package for at least one integrated circuit device | |
JPS62154970U (en) | ||
JPS62154971U (en) | ||
JPS5937747U (en) | semiconductor equipment | |
JPS60172351U (en) | semiconductor element | |
JPS6343430U (en) | ||
JPS6115755U (en) | Semiconductor device with built-in resistor | |
JPS6355445U (en) | ||
JPS5858328U (en) | electronic components | |
JPS6130250U (en) | semiconductor equipment | |
JPS6094836U (en) | semiconductor equipment | |
JPS60174253U (en) | Hybrid integrated circuit device | |
JPS58130272U (en) | Printed board | |
JPS6146755U (en) | semiconductor device | |
JPS611850U (en) | semiconductor element | |
JPS60109155U (en) | memory card | |
JPH01173947U (en) | ||
JPS5991722U (en) | capacitor | |
JPS606293U (en) | Electronic parts series | |
JPS59107101U (en) | chip resistor | |
JPH02101487U (en) | ||
JPS58122410U (en) | high frequency circuit | |
JPS58170835U (en) | semiconductor equipment | |
JPH0377454U (en) | ||
JPS6122359U (en) | semiconductor equipment |