JPS62149827A - スパツタリング用タ−ゲツト材の製造法 - Google Patents

スパツタリング用タ−ゲツト材の製造法

Info

Publication number
JPS62149827A
JPS62149827A JP29095985A JP29095985A JPS62149827A JP S62149827 A JPS62149827 A JP S62149827A JP 29095985 A JP29095985 A JP 29095985A JP 29095985 A JP29095985 A JP 29095985A JP S62149827 A JPS62149827 A JP S62149827A
Authority
JP
Japan
Prior art keywords
vacuum
target material
sputtering target
powder
raw material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29095985A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0317905B2 (cg-RX-API-DMAC10.html
Inventor
Masatoshi Fukushima
正俊 福島
Kosaburo Suehiro
末広　幸三郎
Soichi Fukui
福井　総一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP29095985A priority Critical patent/JPS62149827A/ja
Publication of JPS62149827A publication Critical patent/JPS62149827A/ja
Publication of JPH0317905B2 publication Critical patent/JPH0317905B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
JP29095985A 1985-12-24 1985-12-24 スパツタリング用タ−ゲツト材の製造法 Granted JPS62149827A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29095985A JPS62149827A (ja) 1985-12-24 1985-12-24 スパツタリング用タ−ゲツト材の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29095985A JPS62149827A (ja) 1985-12-24 1985-12-24 スパツタリング用タ−ゲツト材の製造法

Publications (2)

Publication Number Publication Date
JPS62149827A true JPS62149827A (ja) 1987-07-03
JPH0317905B2 JPH0317905B2 (cg-RX-API-DMAC10.html) 1991-03-11

Family

ID=17762671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29095985A Granted JPS62149827A (ja) 1985-12-24 1985-12-24 スパツタリング用タ−ゲツト材の製造法

Country Status (1)

Country Link
JP (1) JPS62149827A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPH0317905B2 (cg-RX-API-DMAC10.html) 1991-03-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees