JPS62141038U - - Google Patents
Info
- Publication number
- JPS62141038U JPS62141038U JP1986029476U JP2947686U JPS62141038U JP S62141038 U JPS62141038 U JP S62141038U JP 1986029476 U JP1986029476 U JP 1986029476U JP 2947686 U JP2947686 U JP 2947686U JP S62141038 U JPS62141038 U JP S62141038U
- Authority
- JP
- Japan
- Prior art keywords
- reel
- separator
- filler
- adhesive layer
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/013—
-
- H10W72/30—
-
- H10W72/073—
Landscapes
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986029476U JPS62141038U (cg-RX-API-DMAC10.html) | 1986-03-01 | 1986-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986029476U JPS62141038U (cg-RX-API-DMAC10.html) | 1986-03-01 | 1986-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62141038U true JPS62141038U (cg-RX-API-DMAC10.html) | 1987-09-05 |
Family
ID=30833389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986029476U Pending JPS62141038U (cg-RX-API-DMAC10.html) | 1986-03-01 | 1986-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62141038U (cg-RX-API-DMAC10.html) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372585A (ja) * | 1989-05-29 | 1991-03-27 | Tomoegawa Paper Co Ltd | 接着シート及び半導体装置 |
| JPH03296582A (ja) * | 1990-04-14 | 1991-12-27 | Tomoegawa Paper Co Ltd | 接着シート |
| JP2000144064A (ja) * | 1998-11-12 | 2000-05-26 | Hitachi Chem Co Ltd | 架橋性接着テープ構造体 |
| JP2001176895A (ja) * | 1994-10-31 | 2001-06-29 | Hitachi Chem Co Ltd | フィルム状有機ダイボンディング材のラミネ−ト方法、ダイボンディング方法、ラミネ−ト装置、ダイボンディング装置、半導体装置および半導体装置の製造法 |
| JP2009235402A (ja) * | 2008-03-05 | 2009-10-15 | Hitachi Chem Co Ltd | 接着フィルム |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57196415A (en) * | 1981-05-28 | 1982-12-02 | Nitto Electric Ind Co | Insulating tape |
| JPS5947281A (ja) * | 1982-09-13 | 1984-03-16 | Nitto Electric Ind Co Ltd | 粘着テ−プもしくはシ−トの製造方法 |
| JPS5980482A (ja) * | 1982-10-29 | 1984-05-09 | Hitachi Chem Co Ltd | 導電性粘着シ−ト |
| JPS606776A (ja) * | 1983-06-27 | 1985-01-14 | Nitto Electric Ind Co Ltd | α線シ−ルド用接着フイルム |
| JPS6028469A (ja) * | 1983-07-26 | 1985-02-13 | Aisin Seiki Co Ltd | エポキシ樹脂製テ−プ |
| JPS60102750A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用導電性接着フイルム |
| JPS6134085A (ja) * | 1984-07-26 | 1986-02-18 | Hitachi Chem Co Ltd | フイルム状接合部材 |
-
1986
- 1986-03-01 JP JP1986029476U patent/JPS62141038U/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57196415A (en) * | 1981-05-28 | 1982-12-02 | Nitto Electric Ind Co | Insulating tape |
| JPS5947281A (ja) * | 1982-09-13 | 1984-03-16 | Nitto Electric Ind Co Ltd | 粘着テ−プもしくはシ−トの製造方法 |
| JPS5980482A (ja) * | 1982-10-29 | 1984-05-09 | Hitachi Chem Co Ltd | 導電性粘着シ−ト |
| JPS606776A (ja) * | 1983-06-27 | 1985-01-14 | Nitto Electric Ind Co Ltd | α線シ−ルド用接着フイルム |
| JPS6028469A (ja) * | 1983-07-26 | 1985-02-13 | Aisin Seiki Co Ltd | エポキシ樹脂製テ−プ |
| JPS60102750A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用導電性接着フイルム |
| JPS6134085A (ja) * | 1984-07-26 | 1986-02-18 | Hitachi Chem Co Ltd | フイルム状接合部材 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372585A (ja) * | 1989-05-29 | 1991-03-27 | Tomoegawa Paper Co Ltd | 接着シート及び半導体装置 |
| JPH03296582A (ja) * | 1990-04-14 | 1991-12-27 | Tomoegawa Paper Co Ltd | 接着シート |
| JP2001176895A (ja) * | 1994-10-31 | 2001-06-29 | Hitachi Chem Co Ltd | フィルム状有機ダイボンディング材のラミネ−ト方法、ダイボンディング方法、ラミネ−ト装置、ダイボンディング装置、半導体装置および半導体装置の製造法 |
| JP2000144064A (ja) * | 1998-11-12 | 2000-05-26 | Hitachi Chem Co Ltd | 架橋性接着テープ構造体 |
| JP2009235402A (ja) * | 2008-03-05 | 2009-10-15 | Hitachi Chem Co Ltd | 接着フィルム |