JPS62138454U - - Google Patents

Info

Publication number
JPS62138454U
JPS62138454U JP1986026175U JP2617586U JPS62138454U JP S62138454 U JPS62138454 U JP S62138454U JP 1986026175 U JP1986026175 U JP 1986026175U JP 2617586 U JP2617586 U JP 2617586U JP S62138454 U JPS62138454 U JP S62138454U
Authority
JP
Japan
Prior art keywords
screw
view
integrated circuit
hole
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986026175U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442926Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986026175U priority Critical patent/JPH0442926Y2/ja
Priority to US07/018,408 priority patent/US4781244A/en
Priority to DE8787301651T priority patent/DE3766384D1/de
Priority to EP87301651A priority patent/EP0236065B1/en
Publication of JPS62138454U publication Critical patent/JPS62138454U/ja
Application granted granted Critical
Publication of JPH0442926Y2 publication Critical patent/JPH0442926Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
JP1986026175U 1986-02-25 1986-02-25 Expired JPH0442926Y2 (cs)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1986026175U JPH0442926Y2 (cs) 1986-02-25 1986-02-25
US07/018,408 US4781244A (en) 1986-02-25 1987-02-25 Liquid cooling system for integrated circuit chips
DE8787301651T DE3766384D1 (de) 1986-02-25 1987-02-25 Fluessigkeitskuehlungssystem fuer integrierte schaltungschips.
EP87301651A EP0236065B1 (en) 1986-02-25 1987-02-25 Liquid cooling system for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986026175U JPH0442926Y2 (cs) 1986-02-25 1986-02-25

Publications (2)

Publication Number Publication Date
JPS62138454U true JPS62138454U (cs) 1987-09-01
JPH0442926Y2 JPH0442926Y2 (cs) 1992-10-12

Family

ID=30827010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986026175U Expired JPH0442926Y2 (cs) 1986-02-25 1986-02-25

Country Status (1)

Country Link
JP (1) JPH0442926Y2 (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011028888A (ja) * 2009-07-22 2011-02-10 Yu-Lin Chu Ｌｅｄ灯の放熱構造
JP2015073004A (ja) * 2013-10-02 2015-04-16 富士通株式会社 冷却装置、電子機器および冷却装置の取付方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011028888A (ja) * 2009-07-22 2011-02-10 Yu-Lin Chu Ｌｅｄ灯の放熱構造
JP2015073004A (ja) * 2013-10-02 2015-04-16 富士通株式会社 冷却装置、電子機器および冷却装置の取付方法

Also Published As

Publication number Publication date
JPH0442926Y2 (cs) 1992-10-12

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