JPH0461504B2 - - Google Patents

Info

Publication number
JPH0461504B2
JPH0461504B2 JP60257570A JP25757085A JPH0461504B2 JP H0461504 B2 JPH0461504 B2 JP H0461504B2 JP 60257570 A JP60257570 A JP 60257570A JP 25757085 A JP25757085 A JP 25757085A JP H0461504 B2 JPH0461504 B2 JP H0461504B2
Authority
JP
Japan
Prior art keywords
integrated circuit
heat dissipation
heat
flat
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60257570A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62118550A (ja
Inventor
Mitsuo Takamoto
Yoichi Matsuo
Toshifumi Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60257570A priority Critical patent/JPS62118550A/ja
Priority to EP86308975A priority patent/EP0225108B1/en
Priority to US06/931,847 priority patent/US4854377A/en
Priority to DE8686308975T priority patent/DE3666644D1/de
Publication of JPS62118550A publication Critical patent/JPS62118550A/ja
Publication of JPH0461504B2 publication Critical patent/JPH0461504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60257570A 1985-11-19 1985-11-19 集積回路の冷却構造 Granted JPS62118550A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60257570A JPS62118550A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造
EP86308975A EP0225108B1 (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips
US06/931,847 US4854377A (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips
DE8686308975T DE3666644D1 (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60257570A JPS62118550A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
JPS62118550A JPS62118550A (ja) 1987-05-29
JPH0461504B2 true JPH0461504B2 (cs) 1992-10-01

Family

ID=17308105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60257570A Granted JPS62118550A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造

Country Status (1)

Country Link
JP (1) JPS62118550A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241639B2 (ja) 1997-06-30 2001-12-25 日本電気株式会社 マルチチップモジュールの冷却構造およびその製造方法

Also Published As

Publication number Publication date
JPS62118550A (ja) 1987-05-29

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