JPS6213816B2 - - Google Patents
Info
- Publication number
- JPS6213816B2 JPS6213816B2 JP5044385A JP5044385A JPS6213816B2 JP S6213816 B2 JPS6213816 B2 JP S6213816B2 JP 5044385 A JP5044385 A JP 5044385A JP 5044385 A JP5044385 A JP 5044385A JP S6213816 B2 JPS6213816 B2 JP S6213816B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- semiconductor wafer
- wafer
- power
- aging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 20
- 230000032683 aging Effects 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/326—Application of electric currents or fields, e.g. for electroforming
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5044385A JPS60220938A (ja) | 1985-03-15 | 1985-03-15 | 半導体ウエ−ハの給電構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5044385A JPS60220938A (ja) | 1985-03-15 | 1985-03-15 | 半導体ウエ−ハの給電構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60220938A JPS60220938A (ja) | 1985-11-05 |
| JPS6213816B2 true JPS6213816B2 (ko) | 1987-03-28 |
Family
ID=12859002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5044385A Granted JPS60220938A (ja) | 1985-03-15 | 1985-03-15 | 半導体ウエ−ハの給電構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60220938A (ko) |
-
1985
- 1985-03-15 JP JP5044385A patent/JPS60220938A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60220938A (ja) | 1985-11-05 |
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