JPS62136859A - 半導体ウエハのメツキ装置 - Google Patents
半導体ウエハのメツキ装置Info
- Publication number
- JPS62136859A JPS62136859A JP60278562A JP27856285A JPS62136859A JP S62136859 A JPS62136859 A JP S62136859A JP 60278562 A JP60278562 A JP 60278562A JP 27856285 A JP27856285 A JP 27856285A JP S62136859 A JPS62136859 A JP S62136859A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wafer
- contacts
- contact
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 53
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 230000000873 masking effect Effects 0.000 claims abstract description 6
- 239000012212 insulator Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 230000035515 penetration Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 28
- 239000007788 liquid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60278562A JPS62136859A (ja) | 1985-12-10 | 1985-12-10 | 半導体ウエハのメツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60278562A JPS62136859A (ja) | 1985-12-10 | 1985-12-10 | 半導体ウエハのメツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62136859A true JPS62136859A (ja) | 1987-06-19 |
| JPH0251254B2 JPH0251254B2 (cg-RX-API-DMAC7.html) | 1990-11-06 |
Family
ID=17598991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60278562A Granted JPS62136859A (ja) | 1985-12-10 | 1985-12-10 | 半導体ウエハのメツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62136859A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0215622A (ja) * | 1988-07-01 | 1990-01-19 | Fujitsu Ltd | メッキ処理方法およびメッキ処理装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6288985B2 (ja) | 2013-08-13 | 2018-03-07 | キヤノン株式会社 | リソグラフィ装置、および物品の製造方法 |
-
1985
- 1985-12-10 JP JP60278562A patent/JPS62136859A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0215622A (ja) * | 1988-07-01 | 1990-01-19 | Fujitsu Ltd | メッキ処理方法およびメッキ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0251254B2 (cg-RX-API-DMAC7.html) | 1990-11-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |