JPS6213569A - TeまたはTe合金製スパツタリング用焼結タ−ゲツト - Google Patents
TeまたはTe合金製スパツタリング用焼結タ−ゲツトInfo
- Publication number
- JPS6213569A JPS6213569A JP15160385A JP15160385A JPS6213569A JP S6213569 A JPS6213569 A JP S6213569A JP 15160385 A JP15160385 A JP 15160385A JP 15160385 A JP15160385 A JP 15160385A JP S6213569 A JPS6213569 A JP S6213569A
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- alloy
- target
- sintered
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15160385A JPS6213569A (ja) | 1985-07-10 | 1985-07-10 | TeまたはTe合金製スパツタリング用焼結タ−ゲツト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15160385A JPS6213569A (ja) | 1985-07-10 | 1985-07-10 | TeまたはTe合金製スパツタリング用焼結タ−ゲツト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6213569A true JPS6213569A (ja) | 1987-01-22 |
| JPS6328987B2 JPS6328987B2 (enExample) | 1988-06-10 |
Family
ID=15522138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15160385A Granted JPS6213569A (ja) | 1985-07-10 | 1985-07-10 | TeまたはTe合金製スパツタリング用焼結タ−ゲツト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6213569A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01106748U (enExample) * | 1988-01-05 | 1989-07-18 | ||
| WO2009107498A1 (ja) * | 2008-02-26 | 2009-09-03 | 日鉱金属株式会社 | 焼結用Sb-Te系合金粉末及び同粉末の製造方法並びに焼結体ターゲット |
| WO2013035695A1 (ja) * | 2011-09-08 | 2013-03-14 | Jx日鉱日石金属株式会社 | Cu-Te合金系焼結体スパッタリングターゲット |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0399291U (enExample) * | 1990-01-31 | 1991-10-16 | ||
| JPH0536195U (ja) * | 1991-10-21 | 1993-05-18 | 株式会社クボタ | 管継手部の防食用コア |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60131963A (ja) * | 1983-12-21 | 1985-07-13 | Nippon Mining Co Ltd | スパツタリング用タ−ゲツト板 |
-
1985
- 1985-07-10 JP JP15160385A patent/JPS6213569A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60131963A (ja) * | 1983-12-21 | 1985-07-13 | Nippon Mining Co Ltd | スパツタリング用タ−ゲツト板 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01106748U (enExample) * | 1988-01-05 | 1989-07-18 | ||
| WO2009107498A1 (ja) * | 2008-02-26 | 2009-09-03 | 日鉱金属株式会社 | 焼結用Sb-Te系合金粉末及び同粉末の製造方法並びに焼結体ターゲット |
| WO2013035695A1 (ja) * | 2011-09-08 | 2013-03-14 | Jx日鉱日石金属株式会社 | Cu-Te合金系焼結体スパッタリングターゲット |
| JP2014029026A (ja) * | 2011-09-08 | 2014-02-13 | Jx Nippon Mining & Metals Corp | Cu−Te合金系焼結体スパッタリングターゲット |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6328987B2 (enExample) | 1988-06-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |