JPS62134935A - 半導体ウエハの表面処理方法 - Google Patents

半導体ウエハの表面処理方法

Info

Publication number
JPS62134935A
JPS62134935A JP27650685A JP27650685A JPS62134935A JP S62134935 A JPS62134935 A JP S62134935A JP 27650685 A JP27650685 A JP 27650685A JP 27650685 A JP27650685 A JP 27650685A JP S62134935 A JPS62134935 A JP S62134935A
Authority
JP
Japan
Prior art keywords
wafers
wafer
etchant
surface treatment
silicon wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27650685A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0410736B2 (enrdf_load_stackoverflow
Inventor
Kazunari Tsuchida
土田　和成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON SILICON KK
Mitsubishi Metal Corp
Original Assignee
NIPPON SILICON KK
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON SILICON KK, Mitsubishi Metal Corp filed Critical NIPPON SILICON KK
Priority to JP27650685A priority Critical patent/JPS62134935A/ja
Publication of JPS62134935A publication Critical patent/JPS62134935A/ja
Publication of JPH0410736B2 publication Critical patent/JPH0410736B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP27650685A 1985-12-09 1985-12-09 半導体ウエハの表面処理方法 Granted JPS62134935A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27650685A JPS62134935A (ja) 1985-12-09 1985-12-09 半導体ウエハの表面処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27650685A JPS62134935A (ja) 1985-12-09 1985-12-09 半導体ウエハの表面処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7005330A Division JP2604126B2 (ja) 1995-01-17 1995-01-17 半導体ウェハの表面処理方法

Publications (2)

Publication Number Publication Date
JPS62134935A true JPS62134935A (ja) 1987-06-18
JPH0410736B2 JPH0410736B2 (enrdf_load_stackoverflow) 1992-02-26

Family

ID=17570412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27650685A Granted JPS62134935A (ja) 1985-12-09 1985-12-09 半導体ウエハの表面処理方法

Country Status (1)

Country Link
JP (1) JPS62134935A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0215627A (ja) * 1988-07-02 1990-01-19 Shin Etsu Handotai Co Ltd 半導体ウェーハの製造方法
CN113725130A (zh) * 2021-11-01 2021-11-30 天霖(张家港)电子科技有限公司 一种半导体结构的刻蚀装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338594A (en) * 1976-09-20 1978-04-08 Rakuton Kagaku Kougiyou Kk Baits for angling
JPS55121643A (en) * 1979-03-13 1980-09-18 Toshiba Corp Fabricating method of semiconductor element
JPS57141926A (en) * 1981-02-26 1982-09-02 Toshiba Corp Bevelling method of hard and brittle wafer
JPS62132324A (ja) * 1985-12-04 1987-06-15 Showa Denko Kk ウエハ−の面取り研削ダメ−ジ層の除去方法および除去用治具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338594A (en) * 1976-09-20 1978-04-08 Rakuton Kagaku Kougiyou Kk Baits for angling
JPS55121643A (en) * 1979-03-13 1980-09-18 Toshiba Corp Fabricating method of semiconductor element
JPS57141926A (en) * 1981-02-26 1982-09-02 Toshiba Corp Bevelling method of hard and brittle wafer
JPS62132324A (ja) * 1985-12-04 1987-06-15 Showa Denko Kk ウエハ−の面取り研削ダメ−ジ層の除去方法および除去用治具

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0215627A (ja) * 1988-07-02 1990-01-19 Shin Etsu Handotai Co Ltd 半導体ウェーハの製造方法
CN113725130A (zh) * 2021-11-01 2021-11-30 天霖(张家港)电子科技有限公司 一种半导体结构的刻蚀装置
CN113725130B (zh) * 2021-11-01 2021-12-28 天霖(张家港)电子科技有限公司 一种半导体结构的刻蚀装置

Also Published As

Publication number Publication date
JPH0410736B2 (enrdf_load_stackoverflow) 1992-02-26

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Legal Events

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