JPS6213184B2 - - Google Patents
Info
- Publication number
- JPS6213184B2 JPS6213184B2 JP21528283A JP21528283A JPS6213184B2 JP S6213184 B2 JPS6213184 B2 JP S6213184B2 JP 21528283 A JP21528283 A JP 21528283A JP 21528283 A JP21528283 A JP 21528283A JP S6213184 B2 JPS6213184 B2 JP S6213184B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal
- inorganic filler
- volume
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000011256 inorganic filler Substances 0.000 claims description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21528283A JPS60107332A (ja) | 1983-11-15 | 1983-11-15 | 金属ベ−ス金属張積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21528283A JPS60107332A (ja) | 1983-11-15 | 1983-11-15 | 金属ベ−ス金属張積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60107332A JPS60107332A (ja) | 1985-06-12 |
| JPS6213184B2 true JPS6213184B2 (enrdf_load_stackoverflow) | 1987-03-24 |
Family
ID=16669733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21528283A Granted JPS60107332A (ja) | 1983-11-15 | 1983-11-15 | 金属ベ−ス金属張積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60107332A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010092905A1 (ja) * | 2009-02-10 | 2010-08-19 | 株式会社日立製作所 | 絶縁回路基板、インバータ装置、及びパワー半導体装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06390B2 (ja) * | 1986-05-14 | 1994-01-05 | 松下電工株式会社 | 金属ベ−ス積層板 |
-
1983
- 1983-11-15 JP JP21528283A patent/JPS60107332A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010092905A1 (ja) * | 2009-02-10 | 2010-08-19 | 株式会社日立製作所 | 絶縁回路基板、インバータ装置、及びパワー半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60107332A (ja) | 1985-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6213184B2 (enrdf_load_stackoverflow) | ||
| JPS6422097A (en) | Manufacture of metal base printed circuit board having through hole on both sides | |
| JPH06216484A (ja) | 金属ベース銅張り積層板 | |
| JPS60107333A (ja) | 金属ベ−ス金属張積層板 | |
| CN210579458U (zh) | 金属基覆铜箔层压板 | |
| JPS60262636A (ja) | 金属ベ−ス積層板 | |
| CN217789984U (zh) | 高耐压的铝基覆铜板 | |
| CN212435958U (zh) | 一种火车取暖器 | |
| JPS60262638A (ja) | 金属ベ−ス積層板 | |
| JPS60263698A (ja) | 金属ベ−ス積層板の加工方法 | |
| CN208020864U (zh) | 柔性覆铜板 | |
| JPS60262637A (ja) | 金属ベ−ス積層板 | |
| JPS58173648A (ja) | 金属ベ−ス積層板 | |
| JPH01194384A (ja) | 銅張積層板の製造方法 | |
| CN207481343U (zh) | 一种铝基覆铜板 | |
| JPS5989143A (ja) | 金属ベ−ス金属箔張積層板 | |
| CN208247631U (zh) | 一种新型铝基覆铜板 | |
| JPS62264942A (ja) | 金属ベ−ス積層板 | |
| JP2923343B2 (ja) | 電気用積層板の製造方法 | |
| JPS6373966U (enrdf_load_stackoverflow) | ||
| JPS60107334A (ja) | 金属ベ−ス金属張積層板 | |
| JPH05191040A (ja) | 金属ベース配線板の製造方法 | |
| JPS6210117Y2 (enrdf_load_stackoverflow) | ||
| JPS6287346A (ja) | 金属ベ−ス積層板の製造方法 | |
| JPS61182945A (ja) | 紙基材樹脂積層板の製造方法 |