JPS62129802U - - Google Patents
Info
- Publication number
- JPS62129802U JPS62129802U JP1590586U JP1590586U JPS62129802U JP S62129802 U JPS62129802 U JP S62129802U JP 1590586 U JP1590586 U JP 1590586U JP 1590586 U JP1590586 U JP 1590586U JP S62129802 U JPS62129802 U JP S62129802U
- Authority
- JP
- Japan
- Prior art keywords
- ground conductor
- ground
- conductor
- holds
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000969 carrier Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Description
第１図ａ，ｂはこの考案の一実施例を示す高周
波伝送路の接続回路の構成図、第２図，第３図は
従来の高周波伝送路接続回路の構成図および等価
回路図である。
図において、１は誘電体基板、２は接地導体、
３はマイクロストリツプ線路、４は導体リボン、
５はキヤリア、６はベース、１１はアースパツド
である。なお、図中同一符号は同一または相当部
分を示す。
FIGS. 1a and 1b are block diagrams of a high-frequency transmission line connection circuit showing an embodiment of this invention, and FIGS. 2 and 3 are block diagrams and equivalent circuit diagrams of conventional high-frequency transmission line connection circuits. In the figure, 1 is a dielectric substrate, 2 is a ground conductor,
3 is a microstrip line, 4 is a conductor ribbon,
5 is the carrier, 6 is the base, and 11 is the ground pad. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
板と、上記誘電体基板の接地導体で覆われない他
方面上に形成されたマイクロストリツプ線路とに
よつて構成された複数の高周波伝送路を接続する
接続回路において、上記それぞれの誘電体基板の
端面部より形成された上記マイクロストリツプ線
路近傍に設けられ、上記接地導体に電気的に接続
された複数のアースパツドと、上記複数の高周波
伝送路のマイクロストリツプ線路及びアースパツ
ド同士をそれぞれ接続する導体リボンと、上記そ
れぞれの誘電体基板を上記接地導体側から保持す
るキヤリアと、上記それぞれのキヤリアを保持固
定するベースとを備えたことを特徴とする高周波
伝送路の接続回路。 A plurality of high-frequency waves are constructed by a flat dielectric substrate whose one side is covered with a ground conductor, and microstrip lines formed on the other side of the dielectric substrate which is not covered with the ground conductor. In a connection circuit for connecting transmission lines, a plurality of ground pads are provided near the microstrip line formed from the end face portions of the respective dielectric substrates and electrically connected to the ground conductor; A conductor ribbon that connects the microstrip lines and ground pads of the high frequency transmission line, a carrier that holds each of the dielectric substrates from the ground conductor side, and a base that holds and fixes each of the carriers. A high frequency transmission line connection circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1590586U JPS62129802U (en) | 1986-02-06 | 1986-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1590586U JPS62129802U (en) | 1986-02-06 | 1986-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62129802U true JPS62129802U (en) | 1987-08-17 |
Family
ID=30807269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1590586U Pending JPS62129802U (en) | 1986-02-06 | 1986-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62129802U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04227101A (en) * | 1990-09-04 | 1992-08-17 | Watkins Johnson Co | Microwave module and connecting system thereof |
-
1986
- 1986-02-06 JP JP1590586U patent/JPS62129802U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04227101A (en) * | 1990-09-04 | 1992-08-17 | Watkins Johnson Co | Microwave module and connecting system thereof |
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