JPS5945938U - hybrid integrated circuit - Google Patents

hybrid integrated circuit

Info

Publication number
JPS5945938U
JPS5945938U JP14079582U JP14079582U JPS5945938U JP S5945938 U JPS5945938 U JP S5945938U JP 14079582 U JP14079582 U JP 14079582U JP 14079582 U JP14079582 U JP 14079582U JP S5945938 U JPS5945938 U JP S5945938U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
wiring
insulating layer
conductor wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14079582U
Other languages
Japanese (ja)
Inventor
三川　卓男
Original Assignee
日本電気アイシ−マイコンシステム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気アイシ−マイコンシステム株式会社 filed Critical 日本電気アイシ−マイコンシステム株式会社
Priority to JP14079582U priority Critical patent/JPS5945938U/en
Publication of JPS5945938U publication Critical patent/JPS5945938U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の混成集積回路の一例の部分斜視図、第２
図ａ、　　ｂは本考案の一実施例の斜視図及び断面図で
ある。 １・・・・・・絶縁体基板、２・・・・・・配線、２ａ
、２ｂ・・・・・・パッド、３・・・・・・配線、１１
・・・・・・絶縁体基板、１２・・・・・・第１の導体
配線、１２ａ、１２ｂ・・・・・・パッド、１３・・・
・・・配線、１４・・・・・・絶縁体層、１５・・・・
・・第２の導体配線。Figure 1 is a partial perspective view of an example of a conventional hybrid integrated circuit;
Figures a and b are a perspective view and a sectional view of an embodiment of the present invention. 1... Insulator board, 2... Wiring, 2a
, 2b... Pad, 3... Wiring, 11
...Insulator substrate, 12...First conductor wiring, 12a, 12b...Pad, 13...
...Wiring, 14...Insulator layer, 15...
...Second conductor wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁体基板上に設けられ少くとも２個所に接続用のパッ
ドを有する第１の導体配線と、前記パッド以外の前記第
１の導体配線を覆う絶縁体層と、前記第１の導体配線に
沿って前記絶縁体層の上に設けられ両端が前記パッドに
核続する第２の配線層とを含むことを特徴とする混成集
積回路。a first conductor wiring provided on an insulating substrate and having connection pads at at least two locations; an insulating layer covering the first conductor wiring other than the pads; and a second wiring layer provided on the insulating layer and having both ends connected to the pad.
JP14079582U 1982-09-17 1982-09-17 hybrid integrated circuit Pending JPS5945938U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14079582U JPS5945938U (en) 1982-09-17 1982-09-17 hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14079582U JPS5945938U (en) 1982-09-17 1982-09-17 hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5945938U true JPS5945938U (en) 1984-03-27

Family

ID=30315104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14079582U Pending JPS5945938U (en) 1982-09-17 1982-09-17 hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5945938U (en)

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