JPS63129879U - - Google Patents
Info
- Publication number
- JPS63129879U JPS63129879U JP2225287U JP2225287U JPS63129879U JP S63129879 U JPS63129879 U JP S63129879U JP 2225287 U JP2225287 U JP 2225287U JP 2225287 U JP2225287 U JP 2225287U JP S63129879 U JPS63129879 U JP S63129879U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor device
- high frequency
- frequency semiconductor
- wirings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
従来の高周波半導体装置の測定治具の一例の斜視
図である。
１……基板、２，３，４……マイクロストリツ
プ線、５……電源線、６……圧接部材、７……高
周波半導体装置、８，９，１０……分岐マイクロ
ストリツプ線、１１……穴、２１……プリント基
板、２２，２３，２４……同軸ケーブル、２５…
…電源線、２６……接続ワイヤ、７１，７２……
入力信号端子、７３……出力信号端子、７４……
電源端子。
FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a perspective view of an example of a conventional measuring jig for a high-frequency semiconductor device. DESCRIPTION OF SYMBOLS 1...Substrate, 2, 3, 4...Microstrip line, 5...Power supply line, 6...Press contact member, 7...High frequency semiconductor device, 8, 9, 10...Branch microstrip line , 11... hole, 21... printed circuit board, 22, 23, 24... coaxial cable, 25...
...Power line, 26... Connection wire, 71, 72...
Input signal terminal, 73... Output signal terminal, 74...
Power terminal.
Claims (1)
する絶縁性の基板と、該基板の外周から前記高周
波半導体装置の入出力用の信号端子が載置される
前記基板上のそれぞれの領域までの該領域を含む
前記基板上に設けられる複数の第１の配線と、そ
れぞれの前記第１の配線上の前記領域の直前から
分岐し前記基板の外周にまで配設される第２の配
線と、それぞれの前記信号端子と前記第１の配線
とを圧接させる絶縁性の圧接部材とを含むことを
特徴とする高周波半導体装置の測定治具。 An insulating substrate having a hole into which a high frequency semiconductor device to be measured is inserted, and an area extending from the outer periphery of the substrate to each area on the substrate where input/output signal terminals of the high frequency semiconductor device are placed. a plurality of first wirings provided on the substrate including a plurality of first wirings, a second wiring branching from immediately before the area on each of the first wirings and disposed up to the outer periphery of the substrate; A measuring jig for a high frequency semiconductor device, comprising: an insulating press-contacting member for press-contacting the signal terminal and the first wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2225287U JPS63129879U (en) | 1987-02-17 | 1987-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2225287U JPS63129879U (en) | 1987-02-17 | 1987-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63129879U true JPS63129879U (en) | 1988-08-24 |
Family
ID=30819461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2225287U Pending JPS63129879U (en) | 1987-02-17 | 1987-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63129879U (en) |
-
1987
- 1987-02-17 JP JP2225287U patent/JPS63129879U/ja active Pending
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