JPH02120905U - - Google Patents
Info
- Publication number
- JPH02120905U JPH02120905U JP3043589U JP3043589U JPH02120905U JP H02120905 U JPH02120905 U JP H02120905U JP 3043589 U JP3043589 U JP 3043589U JP 3043589 U JP3043589 U JP 3043589U JP H02120905 U JPH02120905 U JP H02120905U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- microwave integrated
- transmission line
- integrated circuits
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000000969 carrier Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
第１図は本考案の一実施例を示し、同図ａは平
面図、同図ｂは縦断面図、第２図は従来構造を示
し、同図ａは平面図、同図ｂは縦断面図である。
１，２……マイクロ波集積回路、３，４……誘
電体基板、５，６……導体パターン、７，８……
接地導体、９，１０……金属リボン、１１……伝
送路板、１２……誘電体基板、１３……伝送路導
体、１４……接地導体、２１……筐体、２２，２
３……金属製キヤリア。
Figure 1 shows an embodiment of the present invention, Figure a is a plan view, Figure b is a vertical sectional view, Figure 2 shows a conventional structure, Figure a is a plan view, and Figure b is a vertical cross section. It is a diagram. 1, 2... Microwave integrated circuit, 3, 4... Dielectric substrate, 5, 6... Conductor pattern, 7, 8...
Ground conductor, 9, 10... Metal ribbon, 11... Transmission line board, 12... Dielectric substrate, 13... Transmission line conductor, 14... Ground conductor, 21... Housing, 22, 2
3...Metal carrier.
Claims (1)
の夫々に、上面に導体パターンを有し下面に接地
導体を有するマイクロ波集積回路を搭載し、かつ
これらマイクロ波集積回路の各導体パターンを相
互に電気接続する接続構造において、前記各マイ
クロ波集積回路は夫々相互接続する側の金属製キ
ヤリアの上面を露呈させるように金属製キヤリア
の端部から引き込んだ位置に搭載し、この露呈さ
れた金属製キヤリア間にわたつて、上面に伝送路
導体を有し下面に接地導体を有する伝送路板を搭
載し、かつ前記各マイクロ波集積回路の導体パタ
ーンとこの伝送路板の伝送路導体とを夫々金属リ
ボンで相互に接続したことを特徴とするマイクロ
波集積回路の接続構造。 A microwave integrated circuit having a conductor pattern on the upper surface and a ground conductor on the lower surface is mounted on each of two metal carriers arranged at appropriate intervals, and each conductor pattern of these microwave integrated circuits is electrically connected to each other. In the connection structure to be connected, each of the microwave integrated circuits is mounted in a position retracted from the end of the metal carrier so as to expose the upper surface of the metal carrier on the side to be interconnected, and the exposed metal carrier A transmission line board having a transmission line conductor on the upper surface and a grounding conductor on the lower surface is mounted between them, and the conductor pattern of each microwave integrated circuit and the transmission line conductor of this transmission line plate are connected with metal ribbons. A connection structure for microwave integrated circuits, characterized in that they are interconnected with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3043589U JPH02120905U (en) | 1989-03-17 | 1989-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3043589U JPH02120905U (en) | 1989-03-17 | 1989-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02120905U true JPH02120905U (en) | 1990-10-01 |
Family
ID=31255502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3043589U Pending JPH02120905U (en) | 1989-03-17 | 1989-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120905U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015176980A (en) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | High frequency package, high frequency unit and manufacturing method of high frequency unit |
-
1989
- 1989-03-17 JP JP3043589U patent/JPH02120905U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015176980A (en) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | High frequency package, high frequency unit and manufacturing method of high frequency unit |