JPS62125695A - Manufacture of electric circuit forming substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed explanation of the invention] [In industrial use field] The present invention is more detailed in the manufacturing method for the formation of the electric circuit formation, and in more detail, a continuous metal foil, adhesive, heat -resistant insulator, adhesive, metal board. The present invention relates to a method capable of manufacturing a five-layer structure board for forming an electric circuit.

[Prior art 1] Conventionally, as shown in Fig. 2, for example, a five-layer electric circuit forming board consisting of copper foil, adhesive, heat-resistant insulating film, adhesive, and iron substrate was manufactured using a hot press method. It had been.

That is, multiple materials with a five-layer structure of iron substrate, adhesive, insulating film, adhesive, and copper foil are stacked together, heat pressed at room temperature, and air removed approximately 5 times.
-40k) Apply a pressure of 1/can2, heat to raise the temperature by 1", remove air again at a temperature of about 100℃, apply a pressure of 87cm2 to 20-40, and raise the temperature from 140 to 160℃. At a temperature of 40 to 160°C, air is removed again.
Processing is carried out for 40 to 60 minutes at a pressure of 0 to 40 kg/cni2, after which it is cooled and taken out from the hot press to be used as a substrate for forming an electric circuit.

Since this heat press method is a batch type, it is not suitable for mass production as it is not possible to glue together a large number of five-layered materials. In addition, there are problems in that it takes time to bleed air during repressing during pressing, and there is also a limit to the size of the layered structure.

[Problem to be Solved by the Invention 1] As explained above, the present invention is directed to a conventional method for manufacturing a board for forming an electric circuit having a five-layer structure of copper foil, adhesive, insulating film, adhesive, and iron substrate. As a result of intensive research by the present inventors, we have developed a copper foil, adhesive, and heat-resistant material that does not require manual labor, does not require air removal, enables mass production, and has excellent quality. Five-layer structure consisting of insulating film, adhesive, and iron substrate? We developed a method for manufacturing a substrate for forming a 1'L IX circuit.

[Means for Solving the Problems 1 The method for manufacturing the electric circuit forming J1 (board) according to the present invention is characterized by applying an adhesive to one side of a long metal foil, heating and drying it, and then applying heat-resistant insulation. The film is bonded to form a three-layer structure of metal foil, adhesive, and heat-resistant insulating film. Next, adhesive is applied to this three-layer structure of heat-resistant insulating film, and after heating* and drying, a release film is bonded. It has a five-layer structure consisting of metal foil, adhesive, heat-resistant insulating film, adhesive, and release film.Then, the release film of this five-layer structure is removed and the adhesive on the heat-resistant insulating film is combined with a sheet or long metal. The purpose is to bond the substrate to a five-layer structure consisting of metal foil, adhesive, heat-resistant insulating film, adhesive, and metal substrate.

[Manufacturing of electric circuit forming board according to the present invention] Method J will be described in detail below.

First, materials used in the method of manufacturing an electric circuit forming board according to the present invention will be explained.

Since metal foil is a conductor, it is naturally made of copper, which has excellent electrical conductivity, and its thickness is preferably 5 to 70μ1.Furthermore, this metal foil can be made of aluminum, copper alloy,
Nickel, silver, a conductive metal, or an alloy thereof is used.

It is best to use an epoxy adhesive with relatively good electrical insulation properties, and other adhesives with good adhesion to metals and good electrical insulation properties, such as polyamide, etc. Imide-based, silicone-based, acrylic-based, polyester-based, and polyurethane-based materials can also be used. The thickness of the adhesive is preferably determined based on the insulation properties required for the electrical insulation layer including the heat-resistant insulation 7-r lume, and is preferably about 20 to 200 microns.

The heat-resistant insulating film must have heat resistance that does not have defects such as bottle balls, does not melt even when heated, is not affected by adhesives, and has excellent electrical insulation properties.For example, polyimide film is preferred. The thickness of this heat-resistant insulating film is preferably 5 to 50 microns. In addition, polyester film, polyetherimide, polyester film, lua-on film, etc. can also be used depending on the purpose. This insulating layer is not affected by pattern etching of the metal foil.

The metal substrate is preferably a steel plate with a thickness of 0.3 to 3.0+n+n or =4- is a thickness of 0.1 = 1. Use Omm silicon steel plate.

Additionally, aluminum, aluminum alloys, copper, and copper alloys can also be used.

Next, a method of manufacturing a substrate for forming an electric circuit according to the present invention will be explained in this order using examples shown in FIGS. 1(a), 1(b), and 1(c). Hereinafter, the metal foil will be explained as a copper foil, and the metal substrate will be explained as an iron substrate.

Copper foil 1 drawn out from the coil is coated with adhesive by roll 2, sent through roller R, heated to a temperature of 40 to 100°C in heating furnace 3, and then heated to heat-resistant insulating film 4. The heat-resistant insulating film 4 from the coil is compressed by a pair of rollers R2, and then the three-layer structure of copper foil, adhesive, and heat-resistant insulating film is wound around the roller 5 in a coil shape via the roller R0. .

Next, the coil 6 (material wound around the roller 5), which has a three-layer structure of copper foil, adhesive, and heat-resistant insulating film, is pulled out with the three-layer structure of the heat-resistant insulating film facing upward, and the roll 2 After applying the adhesive, heat it in a heating furnace 3' for 40 minutes.
The release film 7 is heated to ~100°C, and then the release film 7 and the release film 7 from the coil are bonded together by the roller [(2), and then the copper foil, adhesive, and heat-resistant The five-layer structure of insulating film, adhesive, and release film is also taken in a coiled manner by roller -8.
``The reason why we use a release film for the culm is that we do not bond it to the iron substrate immediately after applying the above-mentioned heat-resistant insulating film with a layered structure, and in addition, the adhesive is transferred to the copper foil surface. This is because the adhesive is coated with a release film so that it can be wound into a coil once without contamination.

Next, the release film is peeled off from the copper foil/adhesive/heat-resistant insulating film/adhesive/release film film 11, and the film 91 is wound up (1), and the copper foil/adhesion from which the release film has been removed is removed. The adhesive has a four-layer structure of adhesive, heat-resistant insulating film, and adhesive, and the iron substrate heated in a heating furnace 3'' is heated to a temperature of 80-160°C by a heating roll H0R, and the adhesive is heated to a temperature of 80-160°C. A board for forming an electric circuit with a five-layer structure consisting of an iron substrate, an adhesive, a heat-resistant insulating film, an adhesive, and a copper foil with an adhesive strength of several kilograms/cm after being cured is manufactured, and after cooling, it is cut into appropriate sizes and manufactured. shall be.

According to the method for manufacturing a board for forming an electric circuit according to the present invention, adhesive application, adhesion of a heat-resistant insulating film, adhesion of a release film, and mold release can also be performed automatically. A four-layer structure of copper foil, adhesive, heat-resistant insulating film, and adhesive is automatically bonded to the board, and a five-layer structure of iron board, adhesive, heat-resistant insulating film, adhesive, and copper foil is bonded to the board. A substrate for circuit formation is obtained.

[Effect of the invention 1] As explained below, since the method for manufacturing an electric circuit forming board according to the present invention has the configuration described in -1-, the strength and heat resistance are equivalent to those of the hot press type. Furthermore, it has an excellent effect of being suitable for mass production.

[Brief explanation of drawings]

FIG. 1 is an explanatory view for explaining the method of manufacturing an electric circuit forming substrate according to the present invention, and FIG. 2 is a sectional view of the electric circuit forming substrate.

Claims (1)

[Claims] Apply adhesive to one side of a long metal foil, heat and dry it, then adhere a heat-resistant insulating film to create a three-layer structure of metal foil, adhesive, and heat-resistant insulating film. Next, create a heat-resistant insulating film with this three-layer structure. After applying adhesive and heating and drying, a release film is bonded to form a five-layer structure of metal foil, adhesive, heat-resistant insulating film, adhesive, and release film.Then, this five-layer release film is Electricity characterized by bonding the adhesive on the removed heat-resistant insulating film and a sheet-like or long metal substrate to form a five-layer structure of metal foil, adhesive, heat-resistant insulating film, adhesive, and metal substrate. A method for manufacturing a substrate for circuit formation.