JPS62125696A - Manufacture of electric circuit forming substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field 1] The present invention relates to a method for manufacturing a substrate for forming an electric circuit, and more specifically, to a method for manufacturing a substrate for forming an electric circuit, and more specifically, an electric circuit having a three-layer structure of a metal foil, a heat-resistant insulating layer, and a metal substrate. The present invention relates to a method by which a forming substrate can be manufactured.

[Prior Art] Conventionally, a three-layer electric circuit forming board consisting of a metal foil, a heat-resistant insulating layer (adhesive, a heat-resistant insulating film, and an adhesive), and a metal substrate as shown in Fig. 2(a) has been produced using a press. It was manufactured by the method.

That is, multiple materials with a three-layer structure of metal substrate, heat-resistant insulating HIJC adhesive, insulating film, adhesive), and metal foil were stacked, placed in a heat press at room temperature, and air-released approximately 5 times. Apply a pressure of ~40kg/cm2, heat it, raise the temperature by 1'', bleed the air again at a temperature of about 100'C, and then apply a pressure of 20-40kg/cm2.
Applying a pressure of m2, air is removed again at a temperature of 14.0 to 160 °C, and then 14.0 to 160 °C
C. and a pressure of 20 to 40 kg/c+n' for 40 to 60 minutes, after which it is cooled and removed from the hot press to serve as a substrate for forming an electric circuit.

According to this heat press method, it is difficult to adhere the metal substrate, heat-resistant insulating layer, metal foil, etc. without bubbles. For example, if the metal substrate has flatness or thickness deviation, considerable pressure is required. Therefore, there is a problem in that the Fr'f- of the heat-resistant insulating layer becomes non-uniform, and there is a gap between the heat-resistant insulating layer and the metal foil, resulting in insufficient adhesion.

[Problem to be Solved by the Invention 1] As explained above, the present invention is directed to the production of metal foil/heat-resistant insulation 774 (adhesive/
In view of various problems in the manufacturing method of an electric circuit forming board consisting of a three-layer structure of an insulating film, an adhesive) and a metal substrate, the present inventor has conducted intensive research to make mass production possible and improve performance. They developed a method for manufacturing a three-layer structure for forming electrical circuits, consisting of an excellent metal foil, a heat-resistant insulating layer (adhesive, a heat-resistant insulating film, and an adhesive), and a metal substrate.

[Means for Solving the Problems] The method for manufacturing an electric circuit forming board according to the present invention is characterized by manufacturing a material with a two-layer structure of metal foil, a heat-resistant insulating layer, and a release film to form a coil. Then, the metal foil with the release film removed from this two-layered material
Preheat the two-layer material for the heat-resistant insulating layer, and bond the two-layer heat-resistant insulating R4 adhesive to the preheated long metal substrate to form a three-layer metal foil, heat-resistant insulating layer, and metal substrate. It lies in the structure.

A method for manufacturing an electric circuit forming board according to the present invention will be described in detail below.

First, materials used in the method of manufacturing an electric circuit forming board according to the present invention will be explained.

Since the metal foil is a conductor, it is naturally made of copper, which has excellent conductivity, and preferably has a thickness of 5 to 70 μm. Furthermore, this metal foil may be aluminum, copper alloy, nickel, silver or conductive f1. Metals or alloys thereof, etc., are used.

The heat-resistant insulating layer may consist of a single layer of adhesive, a heat-resistant insulating film, and an adhesive, or it may simply consist of a single layer of adhesive.The adhesive and the heat-resistant insulating film will be described below.

It is best to use an epoxy adhesive that has relatively good electrical insulation properties, as well as other adhesives that have good adhesion to metals and have good electrical insulation properties, such as polyamide.
Imide-based, silicone-based, acrylic-based, polyester-based, and polyurethane-based materials can also be used. In addition, the thickness of the adhesive should be determined based on the insulation required for the electrical insulation layer including the heat-resistant insulation film, and is approximately 2.
It is preferable to set it to 0.~200μ. Note that when the heat-resistant insulating layer is made of only adhesive, it is preferable to make the thickness thicker than this.

A heat-resistant insulating FFL film is required to have no defects such as pinholes, to have heat resistance that does not melt even when heated, to be unaffected by adhesives, and to have excellent electrical insulation properties, such as: Polyimide film is preferred. The thickness of this heat-resistant insulating film is preferably 5 to 50 microns.

In addition to the above, polyester film, polyetherimide, polysulfonate film, etc. can also be used as the insulating film bar depending on the purpose. This insulating layer is not affected in any way by pattern etching of the metal foil.

The metal substrate is a suitable steel plate having a thickness of 0.3 to 3.0 mm or a thickness of 0.1 to 1 mm. Use Omm silicon steel plate. Also,
Aluminum, aluminum alloys, copper, copper alloys can also be used.

=4- Next, a method of manufacturing a board for forming an electric circuit according to the present invention will be explained using an example shown in FIG. In the following description, metal foil is copper foil, metal J11. The plate is made of iron.

In other words, if only an adhesive is used (not shown in the figure), an adhesive is applied to the copper foil, a heat-resistant insulating film is attached after heating, and an adhesive is applied to the heat-resistant insulating film to form a heat-resistant insulating layer. Instead of using a heat-resistant insulating film, the heat-resistant insulating layer consists only of an adhesive layer. ), a material with a three-layer structure of copper foil, a heat-resistant insulating layer, and a release film is manufactured by bonding a release film after heating, and then wound into a coil. In this case, the reason why a release film is used is that the adhesive for the heat-resistant insulating layer is not bonded to the iron substrate immediately after being applied, and that the adhesive is not transferred to the copper foil surface and does not contaminate it. This is to cover the adhesive with a release film in order to wind it into a shape. 1. The coil R0 of the copper foil, heat-resistant insulating layer, and release film made as appropriate in this way is rolled up by peeling off the release film 7 and forming the coil. The material 2 having a two-layer structure of copper foil and a heat-resistant insulating layer is preheated in a heating furnace 4 after the release film 7 is removed.

1. The adhesive of the preheated three-layer structure material 2 and the long iron substrate 1 preheated in the heating furnace 3 are heated to a humidity of 80 to 160°C by the heating roll 5, and the It becomes a base for forming an electric circuit with a three-layer structure of a substrate, a heat-resistant insulating layer, and a copper foil, and after cooling, it is cut into pieces of appropriate size to produce products (see Part 2, Section 1(a)).

In this case, preheating both the material with the two-layer structure of copper foil and heat-resistant insulating layer and the iron board is as follows: (1) If you preheat only the material with the two-layer structure and do not preheat the iron board, When pressurizing and heating the two-layer material adhesive with a heating roll, the iron plate gets heated (for example, even if the temperature of the first heating roll is about 300°0, it will not adhere). i'?-119, and the copper foil wrinkles due to thermal expansion, and although it can be bonded after the next heating roll, the copper foil is still wrinkled. (2) Also, if only the iron substrate is preheated to the temporary bonding temperature and the above two layers (1η layer) are not preheated, the temporary bonding strength will be 10-odd g/cm. Although temporary adhesion was carried out, the sudden heating of the two-layered copper foil from room temperature (thermal shock) caused wrinkles and poor appearance.
This is because, like 1), it is unsuitable as a base for forming an electric circuit.

Therefore, by preheating both the material of the two-layer structure of metal foil and a heat-resistant insulating layer and the iron substrate as in the method of manufacturing a board for forming an electric circuit according to the present invention, no distortion occurs in the metal foil. There are no wrinkles, and the performance as a base for forming electric circuits is sufficient, and the adhesive strength is several hundred g/c+.

Even at ~ several kg/cm, the I-J design makes handling at the next level safe.

In addition, in the case of a heat-resistant insulating layer coated with an adhesive that has been applied once, the heat-resistant insulating layer coated with an adhesive, a heat-resistant insulating film, and an adhesive, as shown in Section 21A (11). A substrate for forming an electric circuit can be manufactured by a method similar to that described above.

[Effects of the Invention] 17= As explained above, since the method for manufacturing the λ board for forming an electric circuit according to the present invention has the above configuration, it has sufficient performance as a base for forming an electric circuit, and has a high adhesive strength. is also high, and
It has an excellent effect of being suitable for mass production.

[Brief explanation of drawings]

FIG. 1 is an explanatory view for explaining the method of manufacturing an electric circuit forming substrate according to the present invention, and FIG. 2 is a sectional view of the electric circuit forming substrate.

Claims (1)

[Claims] A material with a three-layer structure of metal foil, a heat-resistant insulating layer, and a release film is manufactured and wound into a coil, and then the release film is removed from the coiled three-layer material to produce a metal foil and heat-resistant insulating layer. The two-layer material is preheated, and the adhesive for the heat-resistant insulating layer of the two-layer structure is bonded to the preheated long metal substrate to create a three-layer structure of metal foil, heat-resistant insulating layer, and metal substrate. A method of manufacturing a board for forming an electric circuit, characterized by: