JPS62139392A - Manufacture of substrate for electric circuit formation - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a substrate for forming an electric circuit, and more specifically, to a method for manufacturing an electric circuit with a three-layer structure of metal foil, adhesive, and a metal substrate. The present invention relates to a method of manufacturing a base for use.

[Prior art 1] Conventionally, as shown in Figure 3, for example, a five-layer electric circuit forming board consisting of copper foil, adhesive, heat-resistant insulating film, adhesive, and iron substrate is manufactured using a hot press method. It was manufactured.

That is, iron substrate, adhesive, insulating film, adhesive, '11
Stack multiple pieces of 4M five-layer material, set it in a heat press at room temperature, and bleed the air about 5 times.
Apply a pressure of 20 to 40 kg/cm", heat to raise the temperature, bleed air again at a temperature of about 100°C, apply a pressure of 20 to 40 kg/cm, and
At a temperature of 0 to 160°C, air is removed again, and at a temperature of 140 to 160°C, 20-
Processing is carried out at a pressure of 40 kg/cm'' for 40 to 60 minutes, after which it is cooled and taken out from the hot press to be used as a substrate for forming an electric circuit.

Since this heat press method is a batch type, it is not suitable for mass production as it is not possible to stack many sets of five-layer materials. It takes time to repeatedly bleed air during the process, and there is also a problem that there is a limit to the size of the five-layer structure, and there are many steps that require five layers. .

[Problem to be Solved by the Invention 1] As explained above, the present invention is directed to a conventional method for manufacturing a board for forming an electric circuit having a five-layer structure of copper foil, adhesive, insulating film, adhesive, and iron substrate. As a result of intensive research by the present inventors, the present inventor has developed a metal that does not require manpower or air removal, enables mass production, reduces the number of processes, and has excellent quality. They developed a method for manufacturing a three-layer electrical circuit board consisting of foil, adhesive, and a metal substrate.

[Means for Solving the Problems 1] The features of the method for manufacturing an electric circuit forming board according to the present invention are as follows: (1) Applying an adhesive once or twice or more to one side of a long metal substrate. After heating and drying, an adhesive applied to a metal substrate is bonded to a long metal foil to form a three-layer structure of metal foil, adhesive, and metal substrate. The manufacturing method is the first invention, (2) applying an adhesive once or twice or more to one side of a long metal substrate, heating and drying it, and then combining the adhesive applied to the metal substrate with a release film. The metal substrate is bonded to form a three-layer structure consisting of a metal substrate, an adhesive, and a release film.The release film of this three-layer structure is then removed, and the adhesive applied to the metal substrate is bonded to the long metal foil. This invention consists of two inventions, with the second invention being a method of manufacturing a board for forming an electric circuit, characterized in that it has a three-layer structure of metal foil, adhesive, and a metal substrate.

A method for manufacturing an electric circuit forming board according to the present invention will be described in detail below.

First, materials used in the method of manufacturing an electric circuit forming board according to the present invention will be explained.

Since the metal foil is a conductor, it is naturally made of a metal with excellent conductivity, and preferably has a thickness of 5 to 70 μm. Further, this metal foil may be made of aluminum, copper alloy, nickel, silver, or a conductive metal or an alloy thereof.

It is best to use an epoxy adhesive that has relatively good electrical insulation properties, and other adhesives that have good adhesion to metals and good electrical insulation properties, such as polyamide, etc.
Imide-based, silicone-based, acrylic-based, polyester-based, and polyurethane-based materials can also be used. In addition, the thickness of the adhesive should be determined based on the insulation required for the electrical insulation layer, and it is better to set it to about 20 to 200μ. Alternatively, a silicon steel plate with a thickness of 0.1 to 1.0 mm is used. Additionally, aluminum, aluminum alloys, copper, and copper alloys can also be used.

Next, a method of manufacturing a substrate for forming an electric circuit according to the present invention will be explained in this order using examples shown in FIGS. 1(a), 1(b), and 1(c). Hereinafter, the metal foil will be explained as a copper foil, and the metal substrate will be explained as an iron substrate.

Iron substrate 1 The iron substrate 1 pulled out from the film is coated with adhesive by roll 2, sent through roller R1, heated and dried in a heating furnace 3 at a temperature of 40 to 100°C, and then coated with copper? Copper drawn from i4 coil? i4 and a pair of rollers R2, and a three-layered electric circuit forming substrate of copper foil, adhesive, and iron substrate is wound around roller 5 via roller R1 (see FIG. 2). Note that the adhesive strength can be increased by heating before being wound around the roller 5.

Next, the iron substrate 1 pulled out from the iron substrate 1 film is coated with adhesive by a roll 2, sent through a roller R1, and heated and dried at a temperature of 40 to 100'C in a heating furnace 3. Release film 7 After the release film 7 from the film is compressed by a pair of rollers R2, the three-layer material of the iron substrate, adhesive, and release film is transferred to roller 8 in the form of a film via roller R3. It is wound up. This release film is used when transporting a steel substrate coated with adhesive to another location during the work process, or because there is little space in the factory. This is done when the iron substrate and iron substrate will not be bonded immediately.

Next, the release film is peeled off from the material coil 12 (the material wound around the roller 8) having a three-layer structure of iron substrate, adhesive, and release film, and wound around the coil 9, and this release film is removed. The adhesive of the two-layer structure material of iron substrate and adhesive and the long copper foil 10 are rolled by heating rolls H and R.
When heated to 0 to 160°C, the adhesive hardens and a three-layer structure of the iron substrate, adhesive, and copper foil with a strong adhesive strength of several kg/am is manufactured (Second (see figure), and after cooling, cut into appropriate sizes to produce products.

According to the method for manufacturing an electric circuit forming board according to the present invention, adhesive application, adhesion of a release film,
Demolition can be done automatically, and it is also possible to remove the mold from the iron substrate.
By automatically bonding materials with a three-layer structure of MM and adhesive, a base for forming an electric circuit with a three-layer structure of iron substrate, adhesive, and copper foil can be obtained.

[Effects of the Invention] As explained above, since the method for manufacturing an electric circuit forming board according to the present invention has the above configuration, the strength and heat resistance are equivalent to those manufactured by a hot press method, and furthermore, , which has the excellent effect of requiring a small number of steps and being suitable for mass production.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram for explaining the method of manufacturing an electric circuit forming substrate according to the present invention, and FIG. 2 is an explanatory diagram of the electric circuit forming substrate manufactured by the method of manufacturing an electric circuit forming substrate according to the present invention. FIG. 3 is a cross-sectional view of a five-layer electric circuit forming board.

Claims (2)

[Claims] (1) Apply adhesive once or twice or more to one side of a long metal substrate, heat and dry it, and then bond the adhesive applied to the metal substrate and the long metal foil to bond the metal foil. A method for manufacturing a substrate for forming an electric circuit, characterized by having a three-layer structure of a chemical agent and a metal substrate. (2) Apply adhesive once or twice or more to one side of a long metal substrate, heat and dry it, and then bond the adhesive applied to the metal substrate and a release film. A three-layer structure of a release film is created, and then the three-layer release film is removed, and the adhesive applied to the metal substrate and a long metal foil are bonded to form a metal foil, adhesive, and metal. A method of manufacturing a board for forming an electric circuit, characterized in that the board has a three-layer structure.