JPS62124866A - 研磨装置 - Google Patents

研磨装置

Info

Publication number
JPS62124866A
JPS62124866A JP60239362A JP23936285A JPS62124866A JP S62124866 A JPS62124866 A JP S62124866A JP 60239362 A JP60239362 A JP 60239362A JP 23936285 A JP23936285 A JP 23936285A JP S62124866 A JPS62124866 A JP S62124866A
Authority
JP
Japan
Prior art keywords
polishing
wafer
polishing mechanism
wafers
tertiary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60239362A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530592B2 (enFirst
Inventor
Takao Nakamura
孝雄 中村
Kiyoshi Akamatsu
潔 赤松
Takashi Shimura
俊 志村
Masaru Tsukahara
塚原　優
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60239362A priority Critical patent/JPS62124866A/ja
Publication of JPS62124866A publication Critical patent/JPS62124866A/ja
Publication of JPH0530592B2 publication Critical patent/JPH0530592B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP60239362A 1985-10-28 1985-10-28 研磨装置 Granted JPS62124866A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60239362A JPS62124866A (ja) 1985-10-28 1985-10-28 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60239362A JPS62124866A (ja) 1985-10-28 1985-10-28 研磨装置

Publications (2)

Publication Number Publication Date
JPS62124866A true JPS62124866A (ja) 1987-06-06
JPH0530592B2 JPH0530592B2 (enFirst) 1993-05-10

Family

ID=17043629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60239362A Granted JPS62124866A (ja) 1985-10-28 1985-10-28 研磨装置

Country Status (1)

Country Link
JP (1) JPS62124866A (enFirst)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301137A (ja) * 1989-05-15 1990-12-13 Toshiba Mach Co Ltd ポリシング装置
JPH05160088A (ja) * 1991-12-05 1993-06-25 Fujitsu Ltd 半導体基板の製造方法およびそれに用いる製造装置
JP2007043183A (ja) * 2006-09-05 2007-02-15 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2009272655A (ja) * 1994-12-06 2009-11-19 Ebara Corp ポリッシング装置
US8129275B2 (en) 1998-07-24 2012-03-06 Renesas Electronics Corporation Process for manufacturing semiconductor integrated circuit device
CN106826536A (zh) * 2016-12-28 2017-06-13 重庆晶宇光电科技有限公司 晶片研磨设备
CN106826538A (zh) * 2016-12-28 2017-06-13 重庆晶宇光电科技有限公司 具有自动卸料功能的研磨设备

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301137A (ja) * 1989-05-15 1990-12-13 Toshiba Mach Co Ltd ポリシング装置
JPH05160088A (ja) * 1991-12-05 1993-06-25 Fujitsu Ltd 半導体基板の製造方法およびそれに用いる製造装置
JP2009272655A (ja) * 1994-12-06 2009-11-19 Ebara Corp ポリッシング装置
US8129275B2 (en) 1998-07-24 2012-03-06 Renesas Electronics Corporation Process for manufacturing semiconductor integrated circuit device
JP2007043183A (ja) * 2006-09-05 2007-02-15 Renesas Technology Corp 半導体集積回路装置の製造方法
CN106826536A (zh) * 2016-12-28 2017-06-13 重庆晶宇光电科技有限公司 晶片研磨设备
CN106826538A (zh) * 2016-12-28 2017-06-13 重庆晶宇光电科技有限公司 具有自动卸料功能的研磨设备
CN106826536B (zh) * 2016-12-28 2019-02-15 重庆晶宇光电科技有限公司 晶片研磨设备

Also Published As

Publication number Publication date
JPH0530592B2 (enFirst) 1993-05-10

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