JPS62116554U - - Google Patents
Info
- Publication number
- JPS62116554U JPS62116554U JP1986003078U JP307886U JPS62116554U JP S62116554 U JPS62116554 U JP S62116554U JP 1986003078 U JP1986003078 U JP 1986003078U JP 307886 U JP307886 U JP 307886U JP S62116554 U JPS62116554 U JP S62116554U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- heat sink
- circuit device
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の混成集積回路装置の一実施
例を示す断面図、第２図は第１図の要部の斜視図
、第３図は従来の混成集積回路装置を示す断面図
、第４図は第３図の要部の斜視図である。 ２１……ケース、２２……混成集積回路基板、
２４……放熱用ヒートシンク、２６……パワート
ランジスタ・チツプ、２７……端子部、２８……
外部端子。
例を示す断面図、第２図は第１図の要部の斜視図
、第３図は従来の混成集積回路装置を示す断面図
、第４図は第３図の要部の斜視図である。 ２１……ケース、２２……混成集積回路基板、
２４……放熱用ヒートシンク、２６……パワート
ランジスタ・チツプ、２７……端子部、２８……
外部端子。
Claims (1)
- 【実用新案登録請求の範囲】 ケース内に混成集積回路基板を固定し、この基
板上に放熱用ヒートシンクを固定し、このヒート
シンク上にトランジスタ・チツプを搭載するよう
にした混成集積回路装置において、 ａ 前記トランジスタ・チツプから電気信号を外
部に引出すための薄片状のＬ形の端子部を前記放
熱用ヒートシンクに一体的に設け、 ｂ その端子部を、ケースに設けた外部端子と半
田付けするようにしたことを特徴とする混成集積
回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986003078U JPS62116554U (ja) | 1986-01-16 | 1986-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986003078U JPS62116554U (ja) | 1986-01-16 | 1986-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62116554U true JPS62116554U (ja) | 1987-07-24 |
Family
ID=30782506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986003078U Pending JPS62116554U (ja) | 1986-01-16 | 1986-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62116554U (ja) |
-
1986
- 1986-01-16 JP JP1986003078U patent/JPS62116554U/ja active Pending