JPS61100149U - - Google Patents
Info
- Publication number
- JPS61100149U JPS61100149U JP18513584U JP18513584U JPS61100149U JP S61100149 U JPS61100149 U JP S61100149U JP 18513584 U JP18513584 U JP 18513584U JP 18513584 U JP18513584 U JP 18513584U JP S61100149 U JPS61100149 U JP S61100149U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- semiconductor device
- printed wiring
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例に係る半導体装置の
外観斜視図、第２図は第１図のＡ―Ａ線に沿う縦
断面図、第３図は第２図矢視Ｂ部の部分拡大図、
そして、第４図ａ，ｂは各々従来例を示す外観斜
視図である。 １…接続端子、５…印刷配線基板、６…半導体
集積回路パツケージ、７…接続部。
外観斜視図、第２図は第１図のＡ―Ａ線に沿う縦
断面図、第３図は第２図矢視Ｂ部の部分拡大図、
そして、第４図ａ，ｂは各々従来例を示す外観斜
視図である。 １…接続端子、５…印刷配線基板、６…半導体
集積回路パツケージ、７…接続部。
Claims (1)
- 集積回路の印刷配線基板への接続部に、着脱可
能なソケツト状の接続端子を取付けてなる半導体
装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18513584U JPS61100149U (ja) | 1984-12-06 | 1984-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18513584U JPS61100149U (ja) | 1984-12-06 | 1984-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100149U true JPS61100149U (ja) | 1986-06-26 |
Family
ID=30742614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18513584U Pending JPS61100149U (ja) | 1984-12-06 | 1984-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100149U (ja) |
-
1984
- 1984-12-06 JP JP18513584U patent/JPS61100149U/ja active Pending