JPS62113497A - プリント回路基板等に対する素子除去装着装置およびそれに使用するノズル - Google Patents
プリント回路基板等に対する素子除去装着装置およびそれに使用するノズルInfo
- Publication number
- JPS62113497A JPS62113497A JP61207643A JP20764386A JPS62113497A JP S62113497 A JPS62113497 A JP S62113497A JP 61207643 A JP61207643 A JP 61207643A JP 20764386 A JP20764386 A JP 20764386A JP S62113497 A JPS62113497 A JP S62113497A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- baffle
- nozzle means
- spacing
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 50
- 239000012530 fluid Substances 0.000 claims description 40
- 238000010438 heat treatment Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 34
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000272168 Laridae Species 0.000 description 1
- 241001115903 Raphus cucullatus Species 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US79044885A | 1985-10-23 | 1985-10-23 | |
| US790448 | 1985-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62113497A true JPS62113497A (ja) | 1987-05-25 |
Family
ID=25150710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61207643A Pending JPS62113497A (ja) | 1985-10-23 | 1986-09-03 | プリント回路基板等に対する素子除去装着装置およびそれに使用するノズル |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS62113497A (fr) |
| CA (1) | CA1293653C (fr) |
| DE (1) | DE3624728A1 (fr) |
| FR (1) | FR2589029B1 (fr) |
| GB (1) | GB2181981B (fr) |
| IT (1) | IT1209978B (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018535914A (ja) * | 2015-10-30 | 2018-12-06 | コーニング インコーポレイテッド | ３ｄ形状のガラス系物品、それを製造する方法及び装置 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4787548A (en) * | 1987-07-27 | 1988-11-29 | Pace Incorporated | Nozzle structure for soldering and desoldering |
| DE3881623D1 (de) * | 1987-08-31 | 1993-07-15 | Siemens Ag | Loetkopf zum ein- oder ausloeten von bauelementen mittels einer beheizung durch heissgas, insbesondere fuer oberflaechenmontierbare bauelemente (smd). |
| ATE90248T1 (de) * | 1989-09-29 | 1993-06-15 | Siemens Nixdorf Inf Syst | Loetvorrichtung zum aufloeten von bauelementen auf leiterplatten. |
| DE9113986U1 (de) * | 1991-11-11 | 1992-04-16 | Zevac Auslötsysteme GmbH, 3548 Arolsen | Lötvorrichtung zum Ein- und Auslöten von elektrischen Bauelementen |
| JP2714520B2 (ja) * | 1992-08-28 | 1998-02-16 | 株式会社日立製作所 | 実装部品着脱装置 |
| DE4345109C2 (de) * | 1993-12-28 | 2002-10-24 | Finetech Ges Fuer Elektronik T | Werkzeug zum Löten und Entlöten von Lötstellen einer Sockelfassung eines vielpoligen integrierten Schaltkreises |
| DE4422341C2 (de) * | 1994-06-27 | 1997-03-06 | Martin Umwelt & Energietech | Löteinrichtung |
| CN115365600B (zh) * | 2022-09-16 | 2023-09-15 | 李文雄 | 一种用于电路板芯片的焊拆装置及焊拆方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873189A (ja) * | 1981-10-27 | 1983-05-02 | 富士通株式会社 | 電子部品自動取外し装置の熱風ノズルユニツトの構造 |
| JPS61141197A (ja) * | 1984-12-14 | 1986-06-28 | 富士通株式会社 | フラツトリ−ド形電子部品の取外し方法及びその装置 |
| JPS6285494A (ja) * | 1985-10-09 | 1987-04-18 | 株式会社日立製作所 | 部品取り外し装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3522407A (en) * | 1968-03-05 | 1970-08-04 | Argus Eng Co | Heating method |
| US3718800A (en) * | 1968-03-05 | 1973-02-27 | Argus Eng Co | Infrared heating apparatus |
| US4295596A (en) * | 1979-12-19 | 1981-10-20 | Western Electric Company, Inc. | Methods and apparatus for bonding an article to a metallized substrate |
| DE8334840U1 (de) * | 1983-12-05 | 1984-03-22 | Cooper Industries, Inc., 77210 Houston, Tex. | Loetgeraet zum befestigen von elektrischen und elektronischen bauteilen auf leiterplatten |
| GB2154921B (en) * | 1984-02-24 | 1988-06-08 | Pace Inc | Device for attaching modular electronic components to or removing them from an insulative substrate |
| FR2573950B3 (fr) * | 1984-11-27 | 1987-06-19 | Matra | Procede et dispositif d'extraction de composants electroniques soudes |
-
1986
- 1986-06-20 CA CA000512019A patent/CA1293653C/fr not_active Expired - Fee Related
- 1986-07-22 DE DE19863624728 patent/DE3624728A1/de not_active Ceased
- 1986-07-31 GB GB8618672A patent/GB2181981B/en not_active Expired
- 1986-08-07 IT IT8648369A patent/IT1209978B/it active
- 1986-09-03 JP JP61207643A patent/JPS62113497A/ja active Pending
- 1986-10-20 FR FR8614537A patent/FR2589029B1/fr not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873189A (ja) * | 1981-10-27 | 1983-05-02 | 富士通株式会社 | 電子部品自動取外し装置の熱風ノズルユニツトの構造 |
| JPS61141197A (ja) * | 1984-12-14 | 1986-06-28 | 富士通株式会社 | フラツトリ−ド形電子部品の取外し方法及びその装置 |
| JPS6285494A (ja) * | 1985-10-09 | 1987-04-18 | 株式会社日立製作所 | 部品取り外し装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018535914A (ja) * | 2015-10-30 | 2018-12-06 | コーニング インコーポレイテッド | ３ｄ形状のガラス系物品、それを製造する方法及び装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| IT1209978B (it) | 1989-08-30 |
| GB8618672D0 (en) | 1986-09-10 |
| GB2181981B (en) | 1989-11-08 |
| DE3624728A1 (de) | 1987-04-23 |
| IT8648369A0 (it) | 1986-08-07 |
| FR2589029A1 (fr) | 1987-04-24 |
| GB2181981A (en) | 1987-05-07 |
| FR2589029B1 (fr) | 1995-06-23 |
| CA1293653C (fr) | 1991-12-31 |
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