JPS62113435A - Ｉｃチツプボンデイング装置 - Google Patents

Ｉｃチツプボンデイング装置

Info

Publication number
JPS62113435A
JPS62113435A JP60253988A JP25398885A JPS62113435A JP S62113435 A JPS62113435 A JP S62113435A JP 60253988 A JP60253988 A JP 60253988A JP 25398885 A JP25398885 A JP 25398885A JP S62113435 A JPS62113435 A JP S62113435A
Authority
JP
Japan
Prior art keywords
chip
lead
bonding
forming
film carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60253988A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422333B2 (enExample
Inventor
Takeo Ando
安藤　健男
Kurahei Tanaka
田中　倉平
Akira Kabeshita
朗 壁下
Yoshifumi Kitayama
北山　喜文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60253988A priority Critical patent/JPS62113435A/ja
Publication of JPS62113435A publication Critical patent/JPS62113435A/ja
Publication of JPH0422333B2 publication Critical patent/JPH0422333B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Wire Bonding (AREA)
JP60253988A 1985-11-13 1985-11-13 Ｉｃチツプボンデイング装置 Granted JPS62113435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60253988A JPS62113435A (ja) 1985-11-13 1985-11-13 Ｉｃチツプボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60253988A JPS62113435A (ja) 1985-11-13 1985-11-13 Ｉｃチツプボンデイング装置

Publications (2)

Publication Number Publication Date
JPS62113435A true JPS62113435A (ja) 1987-05-25
JPH0422333B2 JPH0422333B2 (enExample) 1992-04-16

Family

ID=17258707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60253988A Granted JPS62113435A (ja) 1985-11-13 1985-11-13 Ｉｃチツプボンデイング装置

Country Status (1)

Country Link
JP (1) JPS62113435A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6769642B2 (en) 2001-04-06 2004-08-03 Yamauchi Corporation Pinch roller and pinch roller apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6769642B2 (en) 2001-04-06 2004-08-03 Yamauchi Corporation Pinch roller and pinch roller apparatus

Also Published As

Publication number Publication date
JPH0422333B2 (enExample) 1992-04-16

Similar Documents

Publication Publication Date Title
US7037751B2 (en) Fabrication of stacked microelectronic devices
JPH01106456A (ja) 半導体集積回路装置
US6354480B2 (en) Apparatus for positioning a thin plate
US4362902A (en) Ceramic chip carrier
JPS62113435A (ja) Ｉｃチツプボンデイング装置
JPH09181150A (ja) 半導体チップのピックアップ装置及びこれを用いたピックアップ方法
KR0167457B1 (ko) 다이 부착과 동시에 와이어 본딩이 이루어지는 와이어 본딩 장치
JP2849519B2 (ja) 半導体素子接合装置
JPS6245146A (ja) 治具およびこの治具を有する整列供給装置
JP2949872B2 (ja) 電子部品接合装置
JPH08203962A (ja) チップ位置決め装置、チップステージおよびインナリードボンディング装置ならびに方法
JPS5847704Y2 (ja) 半導体装置用容器
JPH02273949A (ja) テープボンデイング装置
JP2701174B2 (ja) バンプ付け方法
JPS5844593Y2 (ja) ビ−ム・リ−ド型半導体装置
JP3289631B2 (ja) 半導体装置およびその製造方法および半導体装置の製造装置
JP2779245B2 (ja) バンプ付きｔａｂテープの製造方法
JP2000216172A (ja) 半導体装置の製造装置
JPH01241138A (ja) 半導体装置のワイヤボンディング方法
JP2521693B2 (ja) 半導体装置及び半導体装置の製造方法
JPH0752740B2 (ja) ボンディング方法
JPH04324948A (ja) ボンディング方法
JPS5832441A (ja) 半導体素子のリ−ド曲げ成形装置
JPH05308084A (ja) 半導体装置
JPH09148516A (ja) 半導体装置