JPS6211031Y2 - - Google Patents

Info

Publication number
JPS6211031Y2
JPS6211031Y2 JP1977007444U JP744477U JPS6211031Y2 JP S6211031 Y2 JPS6211031 Y2 JP S6211031Y2 JP 1977007444 U JP1977007444 U JP 1977007444U JP 744477 U JP744477 U JP 744477U JP S6211031 Y2 JPS6211031 Y2 JP S6211031Y2
Authority
JP
Japan
Prior art keywords
decimal point
emitting diode
light emitting
display
light guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977007444U
Other languages
English (en)
Japanese (ja)
Other versions
JPS53103669U (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977007444U priority Critical patent/JPS6211031Y2/ja
Publication of JPS53103669U publication Critical patent/JPS53103669U/ja
Application granted granted Critical
Publication of JPS6211031Y2 publication Critical patent/JPS6211031Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1977007444U 1977-01-26 1977-01-26 Expired JPS6211031Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977007444U JPS6211031Y2 (zh) 1977-01-26 1977-01-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977007444U JPS6211031Y2 (zh) 1977-01-26 1977-01-26

Publications (2)

Publication Number Publication Date
JPS53103669U JPS53103669U (zh) 1978-08-21
JPS6211031Y2 true JPS6211031Y2 (zh) 1987-03-16

Family

ID=28694064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977007444U Expired JPS6211031Y2 (zh) 1977-01-26 1977-01-26

Country Status (1)

Country Link
JP (1) JPS6211031Y2 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4968696A (zh) * 1972-11-04 1974-07-03

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132379Y2 (zh) * 1972-12-21 1976-08-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4968696A (zh) * 1972-11-04 1974-07-03

Also Published As

Publication number Publication date
JPS53103669U (zh) 1978-08-21

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