JPS6211031Y2 - - Google Patents
Info
- Publication number
- JPS6211031Y2 JPS6211031Y2 JP1977007444U JP744477U JPS6211031Y2 JP S6211031 Y2 JPS6211031 Y2 JP S6211031Y2 JP 1977007444 U JP1977007444 U JP 1977007444U JP 744477 U JP744477 U JP 744477U JP S6211031 Y2 JPS6211031 Y2 JP S6211031Y2
- Authority
- JP
- Japan
- Prior art keywords
- decimal point
- emitting diode
- light emitting
- display
- light guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000149 argon plasma sintering Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977007444U JPS6211031Y2 (zh) | 1977-01-26 | 1977-01-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977007444U JPS6211031Y2 (zh) | 1977-01-26 | 1977-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53103669U JPS53103669U (zh) | 1978-08-21 |
JPS6211031Y2 true JPS6211031Y2 (zh) | 1987-03-16 |
Family
ID=28694064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977007444U Expired JPS6211031Y2 (zh) | 1977-01-26 | 1977-01-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6211031Y2 (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4968696A (zh) * | 1972-11-04 | 1974-07-03 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5132379Y2 (zh) * | 1972-12-21 | 1976-08-12 |
-
1977
- 1977-01-26 JP JP1977007444U patent/JPS6211031Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4968696A (zh) * | 1972-11-04 | 1974-07-03 |
Also Published As
Publication number | Publication date |
---|---|
JPS53103669U (zh) | 1978-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111446235B (zh) | 一种发光体及发光模组 | |
KR100659173B1 (ko) | 측면발광형 발광다이오드 패캐지 | |
JP2001094157A (ja) | チップ部品型発光ダイオードおよびその製造方法 | |
JPH07211940A (ja) | 平面発光型led発光装置及びその製造方法 | |
JP3802724B2 (ja) | 発光表示装置およびその製法 | |
JPS6211031Y2 (zh) | ||
JP2006086408A (ja) | Led装置 | |
JPS63274188A (ja) | 光結合素子 | |
JPS5856483A (ja) | 光半導体装置 | |
JPH07176791A (ja) | 発光表示装置 | |
JP2003077317A (ja) | Ledランプ | |
JPS59226401A (ja) | 発光表示装置 | |
JPS61148884A (ja) | 光半導体装置 | |
JPH05114751A (ja) | 光半導体装置 | |
JP2506452Y2 (ja) | 側面発光表示装置 | |
JPH0451991B2 (zh) | ||
JPS5866374A (ja) | 発光ダイオ−ド | |
JPS59119774A (ja) | 光結合半導体装置 | |
JPS59177978A (ja) | マルチチヤンネル型半導体光結合装置 | |
JPS6144456Y2 (zh) | ||
JPS6025084Y2 (ja) | 透光性樹脂材料によつて封入された発光素子 | |
JPS59195882A (ja) | インタラプタ | |
JPH05275752A (ja) | 発光ダイオード | |
JPS6238493A (ja) | 発光ダイオ−ドデイスプレイ装置 | |
JPS63200551A (ja) | リ−ドフレ−ム |