JPS62108843A - エポキシエステル樹脂組成物 - Google Patents

エポキシエステル樹脂組成物

Info

Publication number
JPS62108843A
JPS62108843A JP24887085A JP24887085A JPS62108843A JP S62108843 A JPS62108843 A JP S62108843A JP 24887085 A JP24887085 A JP 24887085A JP 24887085 A JP24887085 A JP 24887085A JP S62108843 A JPS62108843 A JP S62108843A
Authority
JP
Japan
Prior art keywords
epoxy ester
epoxy
resin
tables
formulas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24887085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0574581B2 (enrdf_load_stackoverflow
Inventor
Akio Nishikawa
西川　昭夫
Toru Koyama
徹 小山
Morimichi Unno
海野　盛道
Motoyo Wajima
和嶋　元世
Toshikazu Narahara
奈良原　俊和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24887085A priority Critical patent/JPS62108843A/ja
Publication of JPS62108843A publication Critical patent/JPS62108843A/ja
Publication of JPH0574581B2 publication Critical patent/JPH0574581B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Resins (AREA)
JP24887085A 1985-11-08 1985-11-08 エポキシエステル樹脂組成物 Granted JPS62108843A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24887085A JPS62108843A (ja) 1985-11-08 1985-11-08 エポキシエステル樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24887085A JPS62108843A (ja) 1985-11-08 1985-11-08 エポキシエステル樹脂組成物

Publications (2)

Publication Number Publication Date
JPS62108843A true JPS62108843A (ja) 1987-05-20
JPH0574581B2 JPH0574581B2 (enrdf_load_stackoverflow) 1993-10-18

Family

ID=17184646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24887085A Granted JPS62108843A (ja) 1985-11-08 1985-11-08 エポキシエステル樹脂組成物

Country Status (1)

Country Link
JP (1) JPS62108843A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4004091A1 (de) * 1990-02-10 1991-08-22 Tech Hochschule C Schorlemmer Verfahren zur herstellung der additionsprodukte von epoxidoligomeren mit acryl- oder methacrylsaeure
KR100404233B1 (ko) * 2001-02-13 2003-11-03 학교법인연세대학교 3작용성 메타(아)크릴레이트 단량체 및 그를 함유하는치아 수복용 조성물

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4004091A1 (de) * 1990-02-10 1991-08-22 Tech Hochschule C Schorlemmer Verfahren zur herstellung der additionsprodukte von epoxidoligomeren mit acryl- oder methacrylsaeure
KR100404233B1 (ko) * 2001-02-13 2003-11-03 학교법인연세대학교 3작용성 메타(아)크릴레이트 단량체 및 그를 함유하는치아 수복용 조성물

Also Published As

Publication number Publication date
JPH0574581B2 (enrdf_load_stackoverflow) 1993-10-18

Similar Documents

Publication Publication Date Title
US3686359A (en) Curable polyepoxide compositions
US20120095133A1 (en) Core/shell rubbers for use in electrical laminate compositions
JPH01306405A (ja) オルトジアリルビスシアナート系化合物、及び、この化合物を含む組成物
JPS5927916A (ja) エポキシ樹脂組成物およびエポキシ樹脂の加工性改善方法
JPH0384025A (ja) 耐炎性被覆用注型用樹脂
JPWO2006129480A1 (ja) エポキシ樹脂硬化性組成物
JPH02113020A (ja) 硬化性エポキシ樹脂組成物
JPS62108843A (ja) エポキシエステル樹脂組成物
JPS6317910A (ja) 耐熱性樹脂組成物
JPS63243125A (ja) エポキシ樹脂の硬化促進剤
JPS62172048A (ja) 樹脂組成物
JPS62146925A (ja) 熱硬化性樹脂組成物
JPS62132916A (ja) 熱硬化性樹脂組成物
JPS62112613A (ja) 樹脂組成物
JPS62161819A (ja) エポキシ樹脂組成物
JPH0749401B2 (ja) シンナムアニリド系化合物と製法及び用途
JPH02302426A (ja) エポキシ樹脂組成物
JPS63308066A (ja) 樹脂組成物及びその樹脂組成物で被覆封止した半導体装置
JPS6159328B2 (enrdf_load_stackoverflow)
JPS624716A (ja) 硬化可能のエポキシ樹脂混合物
JPS63291919A (ja) 熱硬化性樹脂組成物
JPH089653B2 (ja) 硬化性樹脂組成物
JPS59155428A (ja) 熱硬化性樹脂組成物
JPH03112195A (ja) 樹脂封止小型電気部品
JPS62257927A (ja) 硬化性エポキシ樹脂組成物