JPS62107445U - - Google Patents
Info
- Publication number
- JPS62107445U JPS62107445U JP20176185U JP20176185U JPS62107445U JP S62107445 U JPS62107445 U JP S62107445U JP 20176185 U JP20176185 U JP 20176185U JP 20176185 U JP20176185 U JP 20176185U JP S62107445 U JPS62107445 U JP S62107445U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- integrated circuit
- circuit device
- hybrid integrated
- metal body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/737—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20176185U JPS62107445U (enExample) | 1985-12-25 | 1985-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20176185U JPS62107445U (enExample) | 1985-12-25 | 1985-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62107445U true JPS62107445U (enExample) | 1987-07-09 |
Family
ID=31165516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20176185U Pending JPS62107445U (enExample) | 1985-12-25 | 1985-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62107445U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856443A (ja) * | 1981-09-30 | 1983-04-04 | Nec Corp | 半導体装置 |
| JPS5874048A (ja) * | 1981-10-29 | 1983-05-04 | Mitsubishi Electric Corp | 半導体集積回路の実装方式 |
-
1985
- 1985-12-25 JP JP20176185U patent/JPS62107445U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856443A (ja) * | 1981-09-30 | 1983-04-04 | Nec Corp | 半導体装置 |
| JPS5874048A (ja) * | 1981-10-29 | 1983-05-04 | Mitsubishi Electric Corp | 半導体集積回路の実装方式 |