JPS62101263U - - Google Patents
Info
- Publication number
- JPS62101263U JPS62101263U JP19370285U JP19370285U JPS62101263U JP S62101263 U JPS62101263 U JP S62101263U JP 19370285 U JP19370285 U JP 19370285U JP 19370285 U JP19370285 U JP 19370285U JP S62101263 U JPS62101263 U JP S62101263U
- Authority
- JP
- Japan
- Prior art keywords
- base material
- conductive foil
- soldered
- printed circuit
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の第１の実施例におけるフレキ
シブルプリント基板の主基板への半田付け状態を
示す断面図、第２図は本考案の第２の実施例にお
けるフレキシブルプリント基板を示す平面図、第
３図、第４図は従来のフレキシブルプリント基板
の主基板への半田付け状態を示す断面図である。
１…フレキシブルプリント基板、２…主基板、
２ａ，１―２…導体箔、１―２ａ…半田ランド、
４…半田境界面、１―１…ベース基材、１―１′
，１０…折り返されるベース基材、６…接着剤、
７…半田。
FIG. 1 is a cross-sectional view showing how the flexible printed circuit board is soldered to the main board in the first embodiment of the present invention, and FIG. 2 is a plan view showing the flexible printed circuit board in the second embodiment of the present invention. FIGS. 3 and 4 are cross-sectional views showing how a conventional flexible printed circuit board is soldered to a main board. 1...Flexible printed circuit board, 2...Main board,
2a, 1-2...conductor foil, 1-2a...solder land,
4...Solder interface, 1-1...Base material, 1-1'
, 10... Base material to be folded back, 6... Adhesive,
7...Solder.
Claims (1)
いてベース基材上の導体箔が主基板上の導体箔に
半田付けされてなり、かつ上記半田付け部分の近
傍に設けた屈曲部の内側面に折り返しによつて上
記ベース基材を添わせたことを特徴とするフレキ
シブルプリント基板。 The base material has a conductive foil on one side, and the conductive foil on the base material is soldered to the conductive foil on the main board at one end, and the inside of the bent part provided near the soldered part. A flexible printed circuit board characterized in that the base material is attached to the side surface by folding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19370285U JPS62101263U (en) | 1985-12-17 | 1985-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19370285U JPS62101263U (en) | 1985-12-17 | 1985-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62101263U true JPS62101263U (en) | 1987-06-27 |
Family
ID=31149972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19370285U Pending JPS62101263U (en) | 1985-12-17 | 1985-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62101263U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939885B2 (en) * | 1979-08-27 | 1984-09-27 | 松下電器産業株式会社 | Method for manufacturing abnormal voltage absorbing element |
-
1985
- 1985-12-17 JP JP19370285U patent/JPS62101263U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939885B2 (en) * | 1979-08-27 | 1984-09-27 | 松下電器産業株式会社 | Method for manufacturing abnormal voltage absorbing element |