JPS61131867U - - Google Patents
Info
- Publication number
- JPS61131867U JPS61131867U JP1647285U JP1647285U JPS61131867U JP S61131867 U JPS61131867 U JP S61131867U JP 1647285 U JP1647285 U JP 1647285U JP 1647285 U JP1647285 U JP 1647285U JP S61131867 U JPS61131867 U JP S61131867U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- bending
- bent
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は、本考案の一実施例に従つたフレキシ
ブル回路基板の折り曲げ構造の概念的要部斜視構
成図、第2図は、その折り曲げ形状の概念図、第
3図は、本考案の他の実施例によるフレキシブル
回路基板の折り曲げ構造を筐体等に折り曲げ装着
した状態で示す断面説明図、そして、第4図及び
第5図は、従来のフレキシブル回路基板の斜視図
及び折り曲げ説明図を示す。
1:フレキシブル回路基板、2:回路パターン
、3:折り曲げ用導体箔、4:折り曲げ該当部、
5:機器の筐体等。
FIG. 1 is a conceptual perspective view of essential parts of a folding structure of a flexible circuit board according to an embodiment of the present invention, FIG. 2 is a conceptual diagram of its folded shape, and FIG. 4 and 5 are perspective views and folding explanatory views of a conventional flexible circuit board, respectively. . 1: Flexible circuit board, 2: Circuit pattern, 3: Conductive foil for bending, 4: Bendable part,
5: Equipment housing, etc.
Claims (1)
部分と強度差を与えるように形成した折り曲げ用
導体箔を具備するように構成したことを特徴とす
るフレキシブル回路基板の折り曲げ構造。 1. A bending structure for a flexible circuit board, characterized in that a portion of the flexible circuit board to be bent is provided with a bending conductor foil formed to provide a strength difference from that portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1647285U JPS61131867U (en) | 1985-02-06 | 1985-02-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1647285U JPS61131867U (en) | 1985-02-06 | 1985-02-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61131867U true JPS61131867U (en) | 1986-08-18 |
Family
ID=30503276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1647285U Pending JPS61131867U (en) | 1985-02-06 | 1985-02-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61131867U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010730A (en) * | 2006-06-30 | 2008-01-17 | Hitachi Aic Inc | Substrate |
JP2008103376A (en) * | 2006-10-17 | 2008-05-01 | Hitachi Cable Ltd | Multilayer printed wiring board and manufacturing method thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS558834A (en) * | 1978-07-04 | 1980-01-22 | Origin Electric Co Ltd | Filter product and method of making same |
-
1985
- 1985-02-06 JP JP1647285U patent/JPS61131867U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS558834A (en) * | 1978-07-04 | 1980-01-22 | Origin Electric Co Ltd | Filter product and method of making same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010730A (en) * | 2006-06-30 | 2008-01-17 | Hitachi Aic Inc | Substrate |
JP2008103376A (en) * | 2006-10-17 | 2008-05-01 | Hitachi Cable Ltd | Multilayer printed wiring board and manufacturing method thereof |