JPS6210015B2 - - Google Patents
Info
- Publication number
- JPS6210015B2 JPS6210015B2 JP54050895A JP5089579A JPS6210015B2 JP S6210015 B2 JPS6210015 B2 JP S6210015B2 JP 54050895 A JP54050895 A JP 54050895A JP 5089579 A JP5089579 A JP 5089579A JP S6210015 B2 JPS6210015 B2 JP S6210015B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- heat
- weight
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5089579A JPS55143056A (en) | 1979-04-26 | 1979-04-26 | Manufacture of wiring structure for electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5089579A JPS55143056A (en) | 1979-04-26 | 1979-04-26 | Manufacture of wiring structure for electronic circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55143056A JPS55143056A (en) | 1980-11-08 |
| JPS6210015B2 true JPS6210015B2 (cs) | 1987-03-04 |
Family
ID=12871465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5089579A Granted JPS55143056A (en) | 1979-04-26 | 1979-04-26 | Manufacture of wiring structure for electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55143056A (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6097648A (ja) * | 1983-11-02 | 1985-05-31 | Hitachi Ltd | 半導体装置 |
| JPS61198634A (ja) * | 1985-02-27 | 1986-09-03 | Asahi Chem Ind Co Ltd | 半導体装置の製造方法 |
| JPS62263692A (ja) * | 1986-05-12 | 1987-11-16 | ニツポン高度紙工業株式会社 | 耐熱性フレキシブルプリント配線板 |
-
1979
- 1979-04-26 JP JP5089579A patent/JPS55143056A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55143056A (en) | 1980-11-08 |
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