JPS619835U - semiconductor manufacturing equipment - Google Patents
semiconductor manufacturing equipmentInfo
- Publication number
- JPS619835U JPS619835U JP9327784U JP9327784U JPS619835U JP S619835 U JPS619835 U JP S619835U JP 9327784 U JP9327784 U JP 9327784U JP 9327784 U JP9327784 U JP 9327784U JP S619835 U JPS619835 U JP S619835U
- Authority
- JP
- Japan
- Prior art keywords
- bell jar
- semiconductor manufacturing
- manufacturing equipment
- susceptor
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案に係る半導体製造装置の第１の実施例を
示す断面図、第２図は本考案の第２の実施例を示す断面
図、第３図は第２図のＡ−Ａ線に沿う断面図、第４図は
ベルジャの天井面を示す部分斜視図である。
第５図は従来の半導体製造装置の一例を示す断面図、第
６図はサセプタ上の半導体ウエーハを示す部分拡大断面
図である。
１・・・基台、５・・・サセプタ、７・・・半導体ウェ
ーハ、１４・・・ベルジャ、１４ａ・・・内ベルジャ、
１４ｂ・・・外ベルジャ、１５．１５’・・・天井面。FIG. 1 is a cross-sectional view showing a first embodiment of a semiconductor manufacturing apparatus according to the present invention, FIG. 2 is a cross-sectional view showing a second embodiment of the present invention, and FIG. A sectional view taken along the line, and FIG. 4 is a partial perspective view showing the ceiling surface of the bell jar. FIG. 5 is a sectional view showing an example of a conventional semiconductor manufacturing apparatus, and FIG. 6 is a partially enlarged sectional view showing a semiconductor wafer on a susceptor. DESCRIPTION OF SYMBOLS 1... Base, 5... Susceptor, 7... Semiconductor wafer, 14... Bell jar, 14a... Inner bell jar,
14b...outer bell jar, 15.15'...ceiling surface.
Claims (1)
ルジャの内部空間に供給した処理ガスによりベルジャ内
部のサセプタ上に整列配置された複数の半導体ウエーハ
を熱処理するものにおいて、上記ベルジャの天井面を、
半導体ウエーハと平行になるように対向させると共にサ
セプタ上からの輻射熱を反射する鏡面に成形したことを
特徴とする半導体製造装置。An inverted cup-shaped bell jar is airtightly attached to a base, and a plurality of semiconductor wafers arranged on a susceptor inside the bell jar are heat-treated by a processing gas supplied to the internal space of the bell jar. The ceiling surface of
A semiconductor manufacturing device characterized in that the susceptor is formed to have a mirror surface that faces the semiconductor wafer so as to be parallel to the wafer and reflects radiant heat from above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9327784U JPS619835U (en) | 1984-06-21 | 1984-06-21 | semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9327784U JPS619835U (en) | 1984-06-21 | 1984-06-21 | semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS619835U true JPS619835U (en) | 1986-01-21 |
Family
ID=30650811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9327784U Pending JPS619835U (en) | 1984-06-21 | 1984-06-21 | semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619835U (en) |
-
1984
- 1984-06-21 JP JP9327784U patent/JPS619835U/en active Pending
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