JPS6196780A - Ｌｅｄチツプのコ−テイング方法 - Google Patents

Ｌｅｄチツプのコ−テイング方法

Info

Publication number
JPS6196780A
JPS6196780A JP59217925A JP21792584A JPS6196780A JP S6196780 A JPS6196780 A JP S6196780A JP 59217925 A JP59217925 A JP 59217925A JP 21792584 A JP21792584 A JP 21792584A JP S6196780 A JPS6196780 A JP S6196780A
Authority
JP
Japan
Prior art keywords
refractive index
led chip
light beam
coating
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59217925A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422352B2 (enrdf_load_stackoverflow
Inventor
Isato Oba
勇人 大場
Hiroo Sakai
酒井　弘生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59217925A priority Critical patent/JPS6196780A/ja
Publication of JPS6196780A publication Critical patent/JPS6196780A/ja
Publication of JPH0422352B2 publication Critical patent/JPH0422352B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP59217925A 1984-10-17 1984-10-17 Ｌｅｄチツプのコ−テイング方法 Granted JPS6196780A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59217925A JPS6196780A (ja) 1984-10-17 1984-10-17 Ｌｅｄチツプのコ−テイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59217925A JPS6196780A (ja) 1984-10-17 1984-10-17 Ｌｅｄチツプのコ−テイング方法

Publications (2)

Publication Number Publication Date
JPS6196780A true JPS6196780A (ja) 1986-05-15
JPH0422352B2 JPH0422352B2 (enrdf_load_stackoverflow) 1992-04-16

Family

ID=16711873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59217925A Granted JPS6196780A (ja) 1984-10-17 1984-10-17 Ｌｅｄチツプのコ−テイング方法

Country Status (1)

Country Link
JP (1) JPS6196780A (enrdf_load_stackoverflow)

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331557U (enrdf_load_stackoverflow) * 1986-08-14 1988-03-01
JPH03222375A (ja) * 1990-01-26 1991-10-01 Sharp Corp 発光ダイオードアレイ
JPH0463162U (enrdf_load_stackoverflow) * 1990-10-02 1992-05-29
EP0563991A3 (en) * 1992-04-03 1993-11-10 Eastman Kodak Co Light-emitting apparatus
DE19631736A1 (de) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Verfahren und Vorrichtung zum Herstellen von Linsen mikrooptischer Systeme sowie Lichtsender/Lichtempfängersystem
JP2000150965A (ja) * 1998-11-11 2000-05-30 Matsushita Electronics Industry Corp 半導体発光装置
JP2003017756A (ja) * 2001-06-28 2003-01-17 Toyoda Gosei Co Ltd 発光ダイオード
KR20030033273A (ko) * 2001-10-19 2003-05-01 (주) 나노옵토테크놀러지 칩형 엘. 디. 엠
JP2003324215A (ja) * 2002-04-30 2003-11-14 Toyoda Gosei Co Ltd 発光ダイオードランプ
WO2003069685A3 (en) * 2002-02-14 2004-07-01 Enfis Ltd A light system
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
JP2005251875A (ja) * 2004-03-02 2005-09-15 Toshiba Corp 半導体発光装置
EP1538681A3 (en) * 2003-12-04 2005-09-21 Nitto Denko Corporation Process for producing optical semiconductor device
EP1580818A1 (en) * 2004-03-10 2005-09-28 Nitto Denko Corporation Process for producing optical semiconductor device
JP2005277127A (ja) * 2004-03-25 2005-10-06 Stanley Electric Co Ltd 発光デバイス
EP1585179A1 (en) * 2004-04-05 2005-10-12 Nitto Denko Corporation Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
EP1475846A3 (en) * 2003-05-06 2006-03-01 Seiko Epson Corporation Light emitting diode based light source with cooling liquid arrangement, and projection-type display apparatus
JP2006140362A (ja) * 2004-11-15 2006-06-01 Nitto Denko Corp 光半導体素子封止用シートおよび該シートを用いた光半導体装置の製造方法
JPWO2004082036A1 (ja) * 2003-03-10 2006-06-15 豊田合成株式会社 固体素子デバイスおよびその製造方法
JP2006518111A (ja) * 2003-02-14 2006-08-03 クリー　インコーポレイテッド 発光材料を組み込んでいる発光デバイス
JP2007516601A (ja) * 2003-09-08 2007-06-21 ナノクリスタル・ライティング・コーポレーション 高屈折率のカプセル材料を用いたｌｅｄランプのための光の効率的なパッケージ構成
US7304425B2 (en) * 2004-10-29 2007-12-04 3M Innovative Properties Company High brightness LED package with compound optical element(s)
WO2007139894A2 (en) 2006-05-26 2007-12-06 Cree Led Lighting Solutions, Inc. Solid state light emitting device and method of making same
US7330319B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company High brightness LED package with multiple optical elements
WO2008026699A1 (fr) * 2006-08-30 2008-03-06 Kyocera Corporation Dispositif émetteur de lumière
JP2008085361A (ja) * 2003-03-10 2008-04-10 Toyoda Gosei Co Ltd 固体素子デバイス
JP2008227502A (ja) * 2007-03-13 2008-09-25 Cree Inc 傾斜誘電体層
JP2008270791A (ja) * 2007-03-28 2008-11-06 Kyocera Corp 発光装置およびその製造方法
US7497597B2 (en) 2004-01-19 2009-03-03 Toyoda Gosei Co., Ltd. Light emitting apparatus
JP2009543321A (ja) * 2006-07-06 2009-12-03 ティーアイアール テクノロジー エルピー 照明装置パッケージ
US7795625B2 (en) 2006-01-16 2010-09-14 Panasonic Corporation Semiconductor light-emitting device
CN102163682A (zh) * 2010-01-28 2011-08-24 Lg伊诺特有限公司 发光器件封装
JP2011187929A (ja) * 2010-02-09 2011-09-22 Sony Corp 発光装置およびその製造方法
JP2011249856A (ja) * 2011-09-14 2011-12-08 Toshiba Corp 半導体発光装置
JP4868427B2 (ja) * 2008-11-13 2012-02-01 国立大学法人名古屋大学 半導体発光装置
JP2013225692A (ja) * 2005-03-14 2013-10-31 Philips Lumileds Lightng Co Llc 波長変換型半導体発光デバイス
KR20140074709A (ko) * 2012-12-10 2014-06-18 삼성디스플레이 주식회사 발광 다이오드 패키지 및 그 제조 방법
US9583683B2 (en) 2000-09-12 2017-02-28 Lumileds Llc Light emitting devices with optical elements and bonding layers
US9601672B2 (en) 2004-10-29 2017-03-21 3M Innovative Properties Company High brightness LED package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5113589A (enrdf_load_stackoverflow) * 1974-07-25 1976-02-03 Tokyo Shibaura Electric Co
JPS57164585A (en) * 1981-04-02 1982-10-09 Toshiba Corp Photosemiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5113589A (enrdf_load_stackoverflow) * 1974-07-25 1976-02-03 Tokyo Shibaura Electric Co
JPS57164585A (en) * 1981-04-02 1982-10-09 Toshiba Corp Photosemiconductor device

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331557U (enrdf_load_stackoverflow) * 1986-08-14 1988-03-01
JPH03222375A (ja) * 1990-01-26 1991-10-01 Sharp Corp 発光ダイオードアレイ
JPH0463162U (enrdf_load_stackoverflow) * 1990-10-02 1992-05-29
EP0563991A3 (en) * 1992-04-03 1993-11-10 Eastman Kodak Co Light-emitting apparatus
DE19631736A1 (de) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Verfahren und Vorrichtung zum Herstellen von Linsen mikrooptischer Systeme sowie Lichtsender/Lichtempfängersystem
US5945041A (en) * 1996-08-06 1999-08-31 Stm Sensor Technologie Munchen Gmbh Method and device for producing lenses of microoptical systems and optical emitter/receiver system
JP2000150965A (ja) * 1998-11-11 2000-05-30 Matsushita Electronics Industry Corp 半導体発光装置
US9583683B2 (en) 2000-09-12 2017-02-28 Lumileds Llc Light emitting devices with optical elements and bonding layers
US10312422B2 (en) 2000-09-12 2019-06-04 Lumileds Llc Light emitting devices with optical elements and bonding layers
JP2003017756A (ja) * 2001-06-28 2003-01-17 Toyoda Gosei Co Ltd 発光ダイオード
KR20030033273A (ko) * 2001-10-19 2003-05-01 (주) 나노옵토테크놀러지 칩형 엘. 디. 엠
WO2003069685A3 (en) * 2002-02-14 2004-07-01 Enfis Ltd A light system
JP2003324215A (ja) * 2002-04-30 2003-11-14 Toyoda Gosei Co Ltd 発光ダイオードランプ
JP4791351B2 (ja) * 2003-02-14 2011-10-12 クリー インコーポレイテッド 発光材料を組み込んでいる発光デバイス
JP2006518111A (ja) * 2003-02-14 2006-08-03 クリー　インコーポレイテッド 発光材料を組み込んでいる発光デバイス
JP2008085361A (ja) * 2003-03-10 2008-04-10 Toyoda Gosei Co Ltd 固体素子デバイス
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
US7824937B2 (en) 2003-03-10 2010-11-02 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
US8685766B2 (en) 2003-03-10 2014-04-01 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
US8154047B2 (en) 2003-03-10 2012-04-10 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
JPWO2004082036A1 (ja) * 2003-03-10 2006-06-15 豊田合成株式会社 固体素子デバイスおよびその製造方法
EP1475846A3 (en) * 2003-05-06 2006-03-01 Seiko Epson Corporation Light emitting diode based light source with cooling liquid arrangement, and projection-type display apparatus
JP2007516601A (ja) * 2003-09-08 2007-06-21 ナノクリスタル・ライティング・コーポレーション 高屈折率のカプセル材料を用いたｌｅｄランプのための光の効率的なパッケージ構成
EP1538681A3 (en) * 2003-12-04 2005-09-21 Nitto Denko Corporation Process for producing optical semiconductor device
US7497597B2 (en) 2004-01-19 2009-03-03 Toyoda Gosei Co., Ltd. Light emitting apparatus
JP2005251875A (ja) * 2004-03-02 2005-09-15 Toshiba Corp 半導体発光装置
EP1580818A1 (en) * 2004-03-10 2005-09-28 Nitto Denko Corporation Process for producing optical semiconductor device
JP2005277127A (ja) * 2004-03-25 2005-10-06 Stanley Electric Co Ltd 発光デバイス
EP1585179A1 (en) * 2004-04-05 2005-10-12 Nitto Denko Corporation Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
CN100418212C (zh) * 2004-04-05 2008-09-10 日东电工株式会社 光学半导体元件封装的片和制造光学半导体器件的方法
US7221007B2 (en) 2004-04-05 2007-05-22 Nitto Denko Corporation Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
US7330319B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company High brightness LED package with multiple optical elements
US9601672B2 (en) 2004-10-29 2017-03-21 3M Innovative Properties Company High brightness LED package
US7304425B2 (en) * 2004-10-29 2007-12-04 3M Innovative Properties Company High brightness LED package with compound optical element(s)
EP1657756A3 (en) * 2004-11-15 2007-07-11 Nitto Denko Corporation Sheet for optical semiconductor element encapsulation and process for producing optical semiconductor device with the sheet
JP2006140362A (ja) * 2004-11-15 2006-06-01 Nitto Denko Corp 光半導体素子封止用シートおよび該シートを用いた光半導体装置の製造方法
JP2013225692A (ja) * 2005-03-14 2013-10-31 Philips Lumileds Lightng Co Llc 波長変換型半導体発光デバイス
US7795625B2 (en) 2006-01-16 2010-09-14 Panasonic Corporation Semiconductor light-emitting device
EP2033235A4 (en) * 2006-05-26 2012-05-23 Cree Inc SOLID-BODY LIGHTING COMPONENT AND MANUFACTURING DEVICE THEREFOR
WO2007139894A2 (en) 2006-05-26 2007-12-06 Cree Led Lighting Solutions, Inc. Solid state light emitting device and method of making same
JP2009543321A (ja) * 2006-07-06 2009-12-03 ティーアイアール テクノロジー エルピー 照明装置パッケージ
WO2008026699A1 (fr) * 2006-08-30 2008-03-06 Kyocera Corporation Dispositif émetteur de lumière
JP2008227502A (ja) * 2007-03-13 2008-09-25 Cree Inc 傾斜誘電体層
JP2008270791A (ja) * 2007-03-28 2008-11-06 Kyocera Corp 発光装置およびその製造方法
JP4868427B2 (ja) * 2008-11-13 2012-02-01 国立大学法人名古屋大学 半導体発光装置
US8405111B2 (en) 2008-11-13 2013-03-26 National University Corporation Nagoya University Semiconductor light-emitting device with sealing material including a phosphor
EP2355194A3 (en) * 2010-01-28 2014-05-14 LG Innotek Co., Ltd. Light emitting device package
CN102163682A (zh) * 2010-01-28 2011-08-24 Lg伊诺特有限公司 发光器件封装
JP2011187929A (ja) * 2010-02-09 2011-09-22 Sony Corp 発光装置およびその製造方法
JP2011249856A (ja) * 2011-09-14 2011-12-08 Toshiba Corp 半導体発光装置
KR20140074709A (ko) * 2012-12-10 2014-06-18 삼성디스플레이 주식회사 발광 다이오드 패키지 및 그 제조 방법

Also Published As

Publication number Publication date
JPH0422352B2 (enrdf_load_stackoverflow) 1992-04-16

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