JPS6195536A - 樹脂封止型半導体装置の製造方法 - Google Patents

樹脂封止型半導体装置の製造方法

Info

Publication number
JPS6195536A
JPS6195536A JP59217187A JP21718784A JPS6195536A JP S6195536 A JPS6195536 A JP S6195536A JP 59217187 A JP59217187 A JP 59217187A JP 21718784 A JP21718784 A JP 21718784A JP S6195536 A JPS6195536 A JP S6195536A
Authority
JP
Japan
Prior art keywords
support plate
lead
mold
chip
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59217187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244147B2 (cg-RX-API-DMAC10.html
Inventor
Minehide Totokawa
都外川　峯秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59217187A priority Critical patent/JPS6195536A/ja
Publication of JPS6195536A publication Critical patent/JPS6195536A/ja
Publication of JPH0244147B2 publication Critical patent/JPH0244147B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W72/0198—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59217187A 1984-10-16 1984-10-16 樹脂封止型半導体装置の製造方法 Granted JPS6195536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59217187A JPS6195536A (ja) 1984-10-16 1984-10-16 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59217187A JPS6195536A (ja) 1984-10-16 1984-10-16 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6195536A true JPS6195536A (ja) 1986-05-14
JPH0244147B2 JPH0244147B2 (cg-RX-API-DMAC10.html) 1990-10-02

Family

ID=16700224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59217187A Granted JPS6195536A (ja) 1984-10-16 1984-10-16 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6195536A (cg-RX-API-DMAC10.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714868A (ja) * 1993-06-25 1995-01-17 Rohm Co Ltd 樹脂封止型半導体装置
US5395800A (en) * 1992-01-30 1995-03-07 Fuji Electric Co., Ltd. Method for assembling semiconductor devices with lead frame containing common lead arrangement
WO2004036660A1 (en) * 2002-09-02 2004-04-29 Tco Co., Ltd A surface mounting type light emitting diode
US20040113240A1 (en) * 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
JP2010034348A (ja) * 2008-07-30 2010-02-12 Sanyo Electric Co Ltd 半導体装置および半導体モジュール
TWI659506B (zh) * 2017-04-04 2019-05-11 Mitsubishi Electric Corporation 半導體裝置及其製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5395800A (en) * 1992-01-30 1995-03-07 Fuji Electric Co., Ltd. Method for assembling semiconductor devices with lead frame containing common lead arrangement
JPH0714868A (ja) * 1993-06-25 1995-01-17 Rohm Co Ltd 樹脂封止型半導体装置
WO2004036660A1 (en) * 2002-09-02 2004-04-29 Tco Co., Ltd A surface mounting type light emitting diode
US20040113240A1 (en) * 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
US20160035594A1 (en) * 2002-10-11 2016-02-04 Micronas Gmbh Electronic component with a leadframe
US9620391B2 (en) 2002-10-11 2017-04-11 Micronas Gmbh Electronic component with a leadframe
JP2010034348A (ja) * 2008-07-30 2010-02-12 Sanyo Electric Co Ltd 半導体装置および半導体モジュール
TWI659506B (zh) * 2017-04-04 2019-05-11 Mitsubishi Electric Corporation 半導體裝置及其製造方法

Also Published As

Publication number Publication date
JPH0244147B2 (cg-RX-API-DMAC10.html) 1990-10-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees