JPS6192818A - モ−ルド型 - Google Patents

モ−ルド型

Info

Publication number
JPS6192818A
JPS6192818A JP19584485A JP19584485A JPS6192818A JP S6192818 A JPS6192818 A JP S6192818A JP 19584485 A JP19584485 A JP 19584485A JP 19584485 A JP19584485 A JP 19584485A JP S6192818 A JPS6192818 A JP S6192818A
Authority
JP
Japan
Prior art keywords
mold
resin
cavity
hole
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19584485A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0356647B2 (enrdf_load_stackoverflow
Inventor
Keizo Otsuki
大槻　桂三
Hidetoshi Mochizuki
秀俊 望月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19584485A priority Critical patent/JPS6192818A/ja
Publication of JPS6192818A publication Critical patent/JPS6192818A/ja
Publication of JPH0356647B2 publication Critical patent/JPH0356647B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP19584485A 1985-09-06 1985-09-06 モ−ルド型 Granted JPS6192818A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19584485A JPS6192818A (ja) 1985-09-06 1985-09-06 モ−ルド型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19584485A JPS6192818A (ja) 1985-09-06 1985-09-06 モ−ルド型

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9622878A Division JPS5522947A (en) 1978-08-09 1978-08-09 Moulding die

Publications (2)

Publication Number Publication Date
JPS6192818A true JPS6192818A (ja) 1986-05-10
JPH0356647B2 JPH0356647B2 (enrdf_load_stackoverflow) 1991-08-28

Family

ID=16347946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19584485A Granted JPS6192818A (ja) 1985-09-06 1985-09-06 モ−ルド型

Country Status (1)

Country Link
JP (1) JPS6192818A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01117038A (ja) * 1987-10-29 1989-05-09 Mitsui High Tec Inc 半導体装置の樹脂封止装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379949A (en) * 1976-12-23 1978-07-14 Mitsubishi Electric Corp Resinnsealed mold
JPS5492059A (en) * 1977-12-29 1979-07-20 Fujitsu Ltd Multi-pot mold device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379949A (en) * 1976-12-23 1978-07-14 Mitsubishi Electric Corp Resinnsealed mold
JPS5492059A (en) * 1977-12-29 1979-07-20 Fujitsu Ltd Multi-pot mold device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01117038A (ja) * 1987-10-29 1989-05-09 Mitsui High Tec Inc 半導体装置の樹脂封止装置

Also Published As

Publication number Publication date
JPH0356647B2 (enrdf_load_stackoverflow) 1991-08-28

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